摘要:
Laser light emitted from a high output laser light source is condensed by a condenser lens to form a condensed point. Xenon (Xe) gas or the like as a target is injected from a nozzle to the condensed point to generate Extreme Ultra Violate (EUV) light, and then the generated EUV light is condensed by a condenser mirror. A transmission filter having a predetermined transmittance with respect to the EUV light is disposed between the condenser mirror and a reflecting mirror, and scattering particles mixed in the EUV light are adsorbed by the transmission filter. The EUV light passing through the transmission filter is deviated by the reflecting mirror, a illuminance distribution of the EUV light is uniformalized by fly eye mirrors, thereafter the EUV light is condensed by another condenser mirror, and then exposure is effected using the condensed EUV light as an exposure beam.
摘要:
Two stages (WS1, WS2) holding wafers can independently move between a positional information measuring section (PIS) under an alignment system (24a) and an exposing section (EPS) under a projection optical system (PI). The wafer exchange and alignment are performed on the stage (WS1), during which wafer (W2) is exposed on the stage (WS2). A position of each shot area of wafer (WS1) is obtained as a relative position with respect to a reference mark formed on the stage WS1 in the section (PIS). Relative positional information can be used for the alignment with respect to an exposure pattern when the wafer (WS1) is moved to the section (EPS) to be exposed. Therefore, it is not necessary that a stage position is observed continuously in moving the stage. Exposure operations are performed in parallel by the two wafer stages (WS1) and (WS2) so as to improve the throughput.
摘要:
When a mask is irradiated obliquely with light from a lighting system, the light reflected from the mask is projected onto a wafer through a projection optical system, and the pattern of the mask is transferred to the wafer. If the magnification of the projection optical system changes because of a vertical movement of the mask, a control unit detects the projection position of the mask pattern image on a stage by an aerial image sensor and also detects a mark on the aerial image sensor by a mark detector so as to determine the baseline of the mark detector. Thus, the positional shift of the projection position of the mask pattern image on the wafer due to the change in magnification is corrected to sufficiently restrict or prevent alignment inaccuracy associated with the change in magnification.
摘要:
Two stages (WS1), (WS2) holding wafers can independently move between a positional information measuring section (PIS) under an alignment system (24a) and an exposing section (EPS) under a projection optical system (PL). The wafer exchange and alignment are performed on the stage (WS1), during which wafer (W2) is exposed on the stage (WS2). A position of each shot area of wafer (WS1) is obtained as a relative position with respect to a reference mark formed on the stage (WS1) in the section (PIS). Relative positional information can be used for the alignment with respect to an exposure pattern when the wafer (WS1) is moved to the section EPS to be exposed. Therefore, it is not necessary that a stage position is observed continuously in moving the stage. Exposure operations are performed in parallel by the two wafer stages (WS1) and (WS2) so as to improve the throughput.
摘要:
While a current photosensitive substrate is being exposed on a substrate stage, the next photosensitive substrate for exposure is loaded on a temperature-adjustment plate for a predetermined time to remove a quantity of heat corresponding to a heat accumulation on the substrate stage during exposure. A substrate transporting system carries and loads the next photosensitive substrate, which has been cooled by the temperature-adjustment plate, onto the substrate stage. A pattern image of a mask is exposed and transferred onto the next photosensitive substrate through a projection optical system.
摘要:
The present invention aims to provide a method of measuring an image-forming error of a projection lens without being influenced by atmospheric temperature at the time of coordinate measurement, and various kinds of applied techniques employing this measuring method. In particular, the measuring method according to the present invention enables errors to be measured with a high accuracy, while taking account of the temperature-dependent extraction or contraction component of the substrate, which is used for measuring the image-forming error.
摘要:
A projection exposure system for printing the pattern formed on a reticle onto a wafer includes a reticle stage (5) and a wafer stage. A first reference plate (9) having a first reference pattern (MM1) formed thereon is mounted on the reticle stage (5), and a second reference plate (25) having a second reference pattern (WM1) formed thereon is mounted on the wafer stage. The first reference pattern (MM1) comprises two cross-marks (60a, 60b) spaced apart from each other in X-direction, and the second reference pattern (WM1) comprises two cross-marks (61a, 61b) spaced apart from each other in X-direction., Images of the cross-marks (61a, 61b) of the second reference pattern (WM1) are formed through a projection optical system (2) on the reticle stage (5) and superimposed with the cross-marks (60a, 60b) of the first reference pattern (MM1). A pair of observation optical systems (10, 11) spaced apart from each other in X-direction are used to observe the superimposed images of the corresponding cross-marks (60a and 61a, 60b and 61b), so as to determine the position shifts in X-direction between the corresponding superimposed images at two positions spaced from each other in X-direction. The determined position shifts are used to calculate the variation in projection magnification. The projection exposure system is capable of quick and high precision detection of the magnification of the projection optical system (2).
摘要:
Provided is a method of aligning a substrate pattern on a photosensitive surface of a substrate with an image of a mask pattern to be formed on the photosensitive surface by an exposing radiation flux through a projection optical system in a projection exposure apparatus, using an alignment sensor system detecting a positional relationship between the substrate pattern and the image. The method includes the steps of moving the photosensitive surface of the substrate to a plurality of first positions relative to a focal plane at which a focused image of the mask pattern is to be formed through the projection optical system, the plurality of first positions being disposed adjacent the focal plane in a first direction substantially normal to the focal plane, the photosensitive surface of the substrate being substantially parallel to the focal plane at each of the first positions; outputting calibration signals from the alignment sensor system at each of the first positions of the photosensitive surface of the substrate, the calibration signals indicating an offset amount to be used to calibrate the alignment sensor system at each of the first positions; detecting a position of the substrate pattern relative to the image of the mask pattern to be formed on the substrate using the alignment sensor system in accordance with the calibration signals; and aligning the substrate pattern with the image of the mask pattern to be formed in the focal plane in accordance with the detected position of the substrate pattern relative to the image of the mask pattern.
摘要:
In a projection exposure apparatus for projecting an image of a pattern on a reticle through a projection optical system onto a wafer, in order to quickly measure imaging characteristics of the projection optical system without actual exposure, an enlarging optical system consisting of an objective lens and a relay optical system, and an image pickup element are provided on a Z-stage on which the wafer is mounted. Illumination light illuminates an index pattern formed on the reticle to form an image thereof near a first lens in the objective lens through the projection optical system, the enlarging optical system enlarges the thus formed image of the index pattern to form an enlarged image thereof on a receiving surface of the image pickup element, the image pickup element converts it into a signal, and an image processing system processes the signal from the image pickup element, thereby measuring the imaging characteristics of the projection optical system, based on the processing results.
摘要:
The structure of an alignment apparatus is as follows: The illuminating areas of the two laser beams for the use of alignment, which are irradiated onto a diffraction grating on a substrate and a diffraction grating mark on a fiducial member, are relatively driven by a field diaphragm and a diaphragm member. A photoelectric detector receives the interference light generated from a first portion in the area on the above-mentioned diffraction mark where the two laser beams intersect following the above-mentioned relative driving, and receives the interference light generated from a second portion in the aforesaid area. A main control system calculates the intersecting angles or rotational error of the two laser beams on the basis of the phase difference of the detection signals from the aforesaid photoelectric detector. The intersecting angles or rotational error is corrected by allowing the parallel flat glasses, which are arranged on the light path, to be slanted.