摘要:
It is an object of the present invention to provide a negative photoresist composition for lithography, using short-wavelength light such as ArF excimer laser beam as a light source. The negative photoresist composition of the present invention is a negative photoresist composition comprising at least a polymer having a unit represented by the general formula (1) a crosslinking agent and a photo-acid generating agent, and the crosslinking agent is capable of crosslinking the polymer in the presence of an acid catalyst, whereby the polymer is insolubilized in a developer. Since the negative resist composition of the present invention is insolubilized in the developer by an action of an acid produced from the photo-acid generating agent at the exposed portion, a negative pattern can be obtained. Since the polymer has not a benzene ring, unlike a base polymer of a conventional negative resist, the polymer has high transparency to ArF excimer laser beam and also has high etching resistance because of its bridged alicyclic group.
摘要:
Monomers expressed by the following general formula are polymerized so as to obtain a polymer, and the polymer and a photoacid generator are dissolved in a solvent so as to form a chemically amplified resist layer large in both transparency and sensitivity to ArF excimer laser light and improved in resolution. ##STR1## wherein R.sup.1 represents a hydrogen atom or a methyl group, R.sup.2 represents a bridged hydrocarbon group having the carbon number between 7 and 22, m equals 0 or 1, n equals 0 or 1 and R.sup.3 represents a hydrogen atom, a methyl group or an acetyl group.
摘要:
There is provided a photoresist including (a) a resin composed of a polymer having a compound represented with the following general formula [1] within a structural unit thereof, and (b) a photo acid generator. ##STR1## wherein R.sup.1 represents a hydrogen atom, R.sup.2 represents a divalent hydrocarbon group including a bridged cyclic hydrocarbon group and having a carbon number in the range of 7 to 13 both inclusive, R.sup.3 and R.sup.4 represent a hydrocarbon group having a carbon number of 1 or 2, and R.sup.5 represents one of (a) a hydrocarbon group having a carbon number of 1 to 12, (b) a hydrocarbon group having a carbon number of 1 to 12 and replaced with an alkoxy group having a carbon number of 1 to 12, and (c) a hydrocarbon group having a carbon number of 1 to 12 and replaced with an acyl group having a carbon number of 1 to 13. The above mentioned photoresist produces no extra polymer by side reaction. Thus, the photoresist makes it possible to form a fine pattern without resist residue, and has superior thermal stability.
摘要:
There is provided a photoresist including (a) a resin composed of a polymer having a compound represented with the following general formula �1! within a structural unit thereof, and (b) a photo acid generator. ##STR1## wherein R.sup.1 represents a hydrogen atom, R.sup.2 represents a divalent hydrocarbon group including a bridged cyclic hydrocarbon group and having a carbon number in the range of 7 to 13 both inclusive, R.sup.3 and R.sup.4 represent a hydrocarbon group having a carbon number of 1 or 2, and R.sup.5 represents one of (a) a hydrocarbon group having a carbon number of 1 to 12, (b) a hydrocarbon group having a carbon number of 1 to 12 and replaced with an alkoxy group having a carbon number of 1 to 12, and (c) a hydrocarbon group having a carbon number of 1 to 12 and replaced with an acyl group having a carbon number of 1 to 13. The above mentioned photoresist produces no extra polymer by side reaction. Thus, the photoresist makes it possible to form a fine pattern without resist residue, and has superior thermal stability.
摘要:
Disclosed is a method for forming a resist pattern in which a chemically amplified resist which has a photosensitive acid-generating agent with a catalytic function is used, has the step of: treating the surface of nitrided metal film or nitrided semimetal film deposited on a substrate by using a substance that reduces the basicity of a basic substance which exists on the surface of nitrided metal film or nitrided semimetal film or which is chemically coupled with the nitrided metal film or nitrided semimetal film.
摘要:
A photoresist material for lithography using a light of 220 nm or less which comprises at least a polymer represented by the following formula (2) and a photo-acid generator for generating an acid by exposure: wherein R1, R2, R3 and R5 are each a hydrogen atom or a methyl group; R4 is an acid-labile group or one of a specified subset of alicyclic hydrocarbon groups, alicyclic hydrocarbon groups, or hydrocarbon groups; R6 is a hydrogen atom or one of a specified subset of hydrocarbon groups or alicyclic hydrocarbon groups; x, y and z are optional values which meet x+y+z=1, 0
摘要翻译:一种用于光刻的光致抗蚀剂材料,其使用220nm以下的光,其至少包含由下式(2)表示的聚合物和通过曝光产生酸的光酸发生剂:其中R1,R2,R3和R5各自 氢原子或甲基; R4是酸不稳定基团或脂环族烃基,脂环族烃基或烃基的特定子集之一; R6是氢原子或烃基或脂环烃基的特定子集之一; x,y和z是满足x + y + z = 1,0,0
摘要:
There are here disclosed a photoresist material for lithography using a light of 220 nm or less which comprises at least a polymer represented by the following formula (2) and a photo-acid generator for generating an acid by exposure: wherein R1, R2, R3 and R5 are each a hydrogen atom or a methyl group; R4 is an acid-labile group, an alicyclic hydrocarbon group having 7 to 13 carbon atoms, which has an acid labile group, an alicyclic hydrocarbon group having 7 to 13 carbon atoms, which has a carboxyl group, or a hydrocarbon group having 3 to 13 carbon atoms, which has an epoxy group; R6 is a hydrogen atom, a hydrocarbon group having 1 to 12 carbon atoms, or an alicyclic hydrocarbon group having 7 to 13 carbon atoms, which has a carboxyl group; x, y and z are optional values which meet x+y+z=1, 0
摘要翻译:这里公开了使用220nm以下的光的光刻胶材料,该光致抗蚀剂材料至少包含由下式(2)表示的聚合物和通过曝光产生酸的光酸发生剂:其中R1,R2,R3 和R 5各自为氢原子或甲基; R4是酸不稳定基团,具有7〜13个碳原子的脂环族烃基,其具有酸不稳定基团,具有7〜13个碳原子的脂环族烃基,其具有羧基或具有3〜 13个碳原子,其具有环氧基; R6为氢原子,碳原子数1〜12的烃基或碳原子数为7〜13的脂环族烃基,具有羧基; x,y和z是满足x + y + z = 1,0,0
摘要:
There are here disclosed a photoresist material for lithography using a light of 220 nm or less which comprises at least a polymer represented by the following formula (2) and a photo-acid generator for generating an acid by exposure: wherein R1, R2, R3 and R5 are each a hydrogen atom or a methyl group; R4 is an acid-labile group, an alicyclic hydrocarbon group having 7 to 13 carbon atoms, which has an acid labile group, an alicyclic hydrocarbon group having 7 to 13 carbon atoms, which has a carboxyl group, or a hydrocarbon group having 3 to 13 carbon atoms, which has an epoxy group; R6 is a hydrogen atom, a hydrocarbon group having 1 to 12 carbon atoms, or an alicyclic hydrocarbon group having 7 to 13 carbon atoms, which has a carboxyl group; x, y and z are optional values which meet x+y+z=1, 0
摘要翻译:这里公开了使用220nm以下的光进行光刻的光致抗蚀剂材料,其包含至少由下式(2)表示的聚合物和通过曝光产生酸的光酸发生剂:其中R 1 R 2,R 3,R 5和R 5各自为氢原子或甲基; R 4是酸不稳定基团,具有7-13个碳原子的脂环族烃基,其具有酸不稳定基团,具有7至13个碳原子的脂环族烃基,其具有羧基 ,或具有3〜13个碳原子的烃基,具有环氧基; R 6是氢原子,具有1〜12个碳原子的烃基或具有7〜13个碳原子的脂环族烃基,其具有羧基; x,y和z是满足x + y + z = 1,0,0 是氢原子或甲基,R 9是具有脂环族内酯结构的7-16个碳原子的烃基。
摘要:
A secondary battery, that has an excellent charge and discharge cycle characteristics, with a larger capacity, is provided. The secondary battery having a positive electrode, negative electrode and electrolyte, includes a polymer having a repeating unit represented by a formula (1) as an active material of at least one of positive electrode and negative electrode. According to formula (1), R1, R2, R3 and R4 each independently represents hydrogen atom, substituted or unsubstituted alkyl group, substituted or unsubstituted aromatic hydrocarbons, substituted or unsubstituted hetroaromatic groups, halogen atom, or alkylene group that may be coupled to the ring form either one or both of R1 and R3, R2 and R4.
摘要:
There are here disclosed a photoresist material for lithography using a light of 220 nm or less which comprises at least a polymer represented by the following formula (2) and a photo-acid generator for generating an acid by exposure: wherein R1, R2, R3 and R5 are each a hydrogen atom or a methyl group; R4 is an acid-labile group, an alicyclic hydrocarbon group having 7 to 13 carbon atoms, which has an acid labile group, an alicyclic hydrocarbon group having 7 to 13 carbon atoms, which has a carboxyl group, or a hydrocarbon group having 3 to 13 carbon atoms, which has an epoxy group; R6 is a hydrogen atom, a hydrocarbon group having 1 to 12 carbon atoms, or an alicyclic hydrocarbon group having 7 to 13 carbon atoms, which has a carboxyl group; x, y and z are optional values which meet x+y+z=1, 0
摘要翻译:这里公开了使用220nm以下的光进行光刻的光致抗蚀剂材料,其包含至少由下式(2)表示的聚合物和通过曝光产生酸的光酸发生剂:其中R 1 R 2,R 3,R 5和R 5各自为氢原子或甲基; R 4是酸不稳定基团,具有7-13个碳原子的脂环族烃基,其具有酸不稳定基团,具有7至13个碳原子的脂环族烃基,其具有羧基 ,或具有3〜13个碳原子的烃基,具有环氧基; R 6是氢原子,具有1〜12个碳原子的烃基或具有7〜13个碳原子的脂环族烃基,其具有羧基; x,y和z是满足x + y + z = 1,0,0 是氢原子或甲基,R 9是具有脂环族内酯结构的7-16个碳原子的烃基。