利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

676 条记录 (耗时 0.045 秒)

    Sector drive assembly for camera
    53.
    发明授权
    Sector drive assembly for camera 有权
    相机行业驱动装配

    公开(公告)号：US07140790B2

    公开(公告)日：2006-11-28

    申请号：US10825549

    申请日：2004-04-14

    申请人： Yoichi Nakano ,  Hiroshi Takahashi

    发明人： Yoichi Nakano ,  Hiroshi Takahashi

    IPC分类号： G03B9/08 ,  G03B9/40

    CPC分类号： G03B9/18

    摘要： A sector drive assembly for a camera which can open and close an aperture has a sector drive unit having an actuator, a drive force transmitting mechanism, and a sector position detecting unit that are removably mounted as a unit to a support plate, and a sector unit having a base plate formed with an aperture and one or more sectors for opening and closing the aperture. Since the sector drive unit is provided as a removably mountable unit, it is high in versatility and can be mounted to various different types of sector units. In addition, since it is configured to detect the state of the sectors before operation, reliable exposure or opening and closing of the aperture are achieved. In addition, a positional adjustment function is provided by a sector urging spring.

    摘要翻译： 用于可打开和关闭孔的相机的扇形驱动组件具有扇区驱动单元，该扇区驱动单元具有作为单元可拆卸地安装到支撑板的致动器，驱动力传递机构和扇区位置检测单元，以及扇区 单元具有形成有孔的基板和用于打开和关闭孔的一个或多个扇区。 由于扇区驱动单元被设置为可拆卸地安装的单元，所以其通用性高，并且可以安装到各种不同类型的扇区单元。 此外，由于其被配置为在操作之前检测扇区的状态，因此实现了可靠的曝光或打开和关闭光圈。 此外，由扇形推动弹簧提供位置调节功能。

    High-pressure discharge lamp
    54.
    发明授权
    High-pressure discharge lamp 有权
    高压放电灯

    公开(公告)号：US07045961B2

    公开(公告)日：2006-05-16

    申请号：US10835801

    申请日：2004-04-29

    申请人： Hiroshi Takahashi

    发明人： Hiroshi Takahashi

    IPC分类号： H01J17/20

    CPC分类号： H01J61/86 ,  H01J61/0735 ,  H01J61/12

    摘要： There is provided an improved high-pressure discharge lamp which includes an arc tube encapsulating a halogen, and a pair of tungsten electrodes disposed in the arc tube. The oxygen content in the tungsten electrodes is not more than 15 ppm, while the amount of the encapsulated halogen lies in the range of 1×10−7 to 1×10−2 μmol/mm3.

    摘要翻译： 提供了一种改进的高压放电灯，其包括封装卤素的电弧管和设置在电弧管中的一对钨电极。 钨电极中的氧含量不大于15ppm，而封装的卤素的量在1×10 -7至1×10 -2μmol/ mm 2的范围内 3 。

    Book page document image reading apparatus
    57.
    发明授权
    Book page document image reading apparatus 失效

    公开(公告)号：US07006263B2

    公开(公告)日：2006-02-28

    申请号：US09956911

    申请日：2001-09-21

    申请人： Hiroshi Takahashi

    发明人： Hiroshi Takahashi

    IPC分类号： H04N1/40 ,  H04N1/393

    CPC分类号： H04N1/1026 ,  H04N1/1017 ,  H04N1/193 ,  H04N2201/0434

    摘要： The book page document image reading apparatus according to the present invention comprises a reading means for reading an image of a spread book page document placed on with the binding section being aligned to the reference position, an image size changing means for changing a size of a read image read by the reading means, a storage means for storing therein image data to image size changing, and a means for differentiating a range for storage of the image data having been subjected in the storage means when a book page document is read with the same size from a range for storage of image data having been subjected to image size changing in the storage means when a book page document is read with a changed size.

    Method of manufacturing the multi-tip probe, a multi-tip probe, and surface characteristic analysis apparatus
    58.
    发明申请
    Method of manufacturing the multi-tip probe, a multi-tip probe, and surface characteristic analysis apparatus 有权
    多尖头探针的制造方法，多头探针，表面特性分析装置

    公开(公告)号：US20060011830A1

    公开(公告)日：2006-01-19

    申请号：US11230904

    申请日：2005-09-20

    申请人： Yoshiharu Shirakawabe ,  Hiroshi Takahashi ,  Tadashi Arai

    发明人： Yoshiharu Shirakawabe ,  Hiroshi Takahashi ,  Tadashi Arai

    IPC分类号： G01N23/00

    CPC分类号： G01Q70/16 ,  G01N23/00 ,  G01N23/225 ,  G01Q70/06 ,  G01Q70/12 ,  G01R3/00 ,  Y10T29/49007

    摘要： In order to establish processing techniques capable of making multi-tip probes with sub-micron intervals and provide such microscopic multi-tip probes, there is provided an outermost surface analysis apparatus for semiconductor devices etc provided with a function for enabling positioning to be performed in, such a manner that there is no influence on measurement in electrical measurements at an extremely small region using this microscopic multi-tip probe, and there are provided the steps of making a cantilever 1 formed with a plurality of electrodes 3 using lithographic techniques, and forming microscopic electrodes 6 minute in pitch by sputtering or gas-assisted etching a distal end of the cantilever 1 using a focused charged particle beam or using CVD.

    摘要翻译： 为了建立能够制造具有亚微米间隔的多尖头探针并提供这种微观多尖头探针的加工技术，提供了一种用于半导体器件等的最外表面分析装置，其具有使得能够在 使用这种显微多头探针在极小区域的电气测量中对测量没有影响的方式，并且提供了使用光刻技术制造形成有多个电极3的悬臂1的步骤，以及 通过溅射或使用聚焦的带电粒子束或使用CVD气化辅助蚀刻悬臂1的远端来形成6分钟的间距的微观电极。

    Device and method for extracting unmachined shape
    59.
    发明申请
    Device and method for extracting unmachined shape 失效
    用于提取未加工形状的装置和方法

    公开(公告)号：US20050273194A1

    公开(公告)日：2005-12-08

    申请号：US11146356

    申请日：2005-06-07

    申请人： Satoshi Kanbayashi ,  Shingo Yamaguchi ,  Hiroshi Takahashi ,  Mitsugu Suzuki ,  Yoshiyuki Haruta

    发明人： Satoshi Kanbayashi ,  Shingo Yamaguchi ,  Hiroshi Takahashi ,  Mitsugu Suzuki ,  Yoshiyuki Haruta

    IPC分类号： B23Q15/00 ,  G05B19/4069 ,  G05B19/4097 ,  G06F19/00

    CPC分类号： G05B19/4097 ,  G05B19/4069 ,  G05B2219/35338 ,  G05B2219/49149 ,  Y02P90/265

    摘要： A safe and efficient machining process design is realized by extracting the unmachined shape and by three-dimensionally visualizing the unmachined shape without generating a machining track. The present device 1 comprises a displacement unit 2 for displacing a machining tool on the surface of a three-dimensional product shape model at arbitrary positions without causing interference between the product shape model and the machining tool, a detection unit 3 for detecting a distance between the arbitrary position and the machining tool, and a preparation unit 4 for preparing the three-dimensional unmachined shape by using the minimum value of the distance obtained for each point on the surface of the shape model when the arbitrary point is moved.

    摘要翻译： 通过提取未加工的形状和三维可视化未加工的形状而不产生加工轨迹，实现安全高效的加工过程设计。 本装置1包括位移单元2，用于在三维产品形状模型的表面上任意位置移动加工工具，而不会引起产品形状模型与加工工具之间的干扰;检测单元3， 任意位置和加工工具，以及准备单元4，用于通过使用当任意点移动时对形状模型的表面上的每个点获得的距离的最小值来准备三维非加工形状。

    Semiconductor memory device equipped with error correction circuit
    60.
    发明申请
    Semiconductor memory device equipped with error correction circuit 有权
    半导体存储器件配有纠错电路

    公开(公告)号：US20050229080A1

    公开(公告)日：2005-10-13

    申请号：US11130059

    申请日：2005-05-17

    申请人： Hiroshi Takahashi ,  Akihiro Takegama ,  Osamu Handa ,  Hiroshi Kimizuka

    发明人： Hiroshi Takahashi ,  Akihiro Takegama ,  Osamu Handa ,  Hiroshi Kimizuka

    IPC分类号： H03M13/19 ,  G06F11/10 ,  G11C29/00 ,  G11C29/42 ,  H03M13/00

    CPC分类号： G06F11/1008

    摘要： The objective of the invention is to provide a type of semiconductor memory device equipped with an error correction circuit 200 characterized by the fact that it can perform correction of errors in stored data without increasing the circuit size and power consumption, and without decreasing operating speed. An error correction code EC corresponds to data stored in sub-memory 120 separate from main data stored in main memory 110. In read mode, the main data and error correction code are read from the main memory and sub-memory, respectively. On the basis of these data, the error correction code is generated for correcting errors in the read data. Error correction circuit 300 corrects errors in the main data. By storing the error correction code in a sub-memory different from the main memory and selecting the appropriate layout of the main memory and sub-memory, it is possible to increase the reading speed of the error correction code and to suppress time delays caused by error correction.

    摘要翻译： 本发明的目的是提供一种配备有纠错电路200的半导体存储器件，其特征在于可以在不增加电路尺寸和功耗的情况下执行存储数据中的错误校正，并且不降低操作速度。 纠错码EC对应于与存储在主存储器110中的主数据分离的子存储器120中存储的数据。在读取模式中，主数据和纠错码分别从主存储器和子存储器读取。 基于这些数据，生成用于校正读取数据中的错误的纠错码。 纠错电路300纠正主数据中的错误。 通过将错误校正码存储在与主存储器不同的子存储器中并选择主存储器和子存储器的适当布局，可以增加纠错码的读取速度并且抑制由 纠错。