利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

94 条记录 (耗时 0.041 秒)

    WAKE-UP APPARATUS AND WAKE-UP METHOD FOR LOW POWER SENSOR NODE
    52.
    发明申请
    WAKE-UP APPARATUS AND WAKE-UP METHOD FOR LOW POWER SENSOR NODE 有权
    用于低功率传感器节点的唤醒设备和唤醒方法

    公开(公告)号：US20110194471A1

    公开(公告)日：2011-08-11

    申请号：US12808542

    申请日：2008-10-24

    申请人： Ji-Eun Kim ,  Kang Ho-yong ,  Nae-Soo Kim ,  Cheol-l-Sig Pyo

    发明人： Ji-Eun Kim ,  Kang Ho-yong ,  Nae-Soo Kim ,  Cheol-l-Sig Pyo

    IPC分类号： H04W52/02

    CPC分类号： H04W52/0235

    摘要： Provided are a wake-up apparatus and wake-up method for a low power sensor node, and more particularly, to a wake-up apparatus and wake-up method for a low power sensor node, which can extend the battery life of the sensor node and minimize the amount of power consumed by an entire sensor network power by minimizing unnecessary power consumption of the sensor node. The wake-up apparatus for a low power sensor node includes: a wake-up signal detector receiving and detecting a wake-up signal of a sensor node; a wake-up radio frequency (RF) circuit unit filtering and amplifying the wake-up signal; and a wake-up baseband transducer detecting a wake-up address from the wake-up signal and comparing and verifying the wake-up address with a wake-up address that is provided from a server managing the sensor node. The wake-up apparatus outputs an interrupt signal for transmitting a sensing event of the sensor node or outputs a wake-up address of another sensor node in an area where the interrupt signal is to be sensed if errors are not detected when the wake-up address is verified.

    摘要翻译： 提供了用于低功率传感器节点的唤醒装置和唤醒方法，更具体地，涉及用于低功率传感器节点的唤醒装置和唤醒方法，其可以延长传感器的电池寿命 节点，并通过最小化传感器节点的不必要的功耗来最小化整个传感器网络功率消耗的功率量。 用于低功率传感器节点的唤醒装置包括：唤醒信号检测器，其接收并检测传感器节点的唤醒信号; 唤醒射频（RF）电路单元对唤醒信号进行滤波和放大; 以及唤醒基带传感器，从唤醒信号检测唤醒地址，并用从管理传感器节点的服务器提供的唤醒地址来比较和验证唤醒地址。 唤醒装置输出用于发送传感器节点的感测事件的中断信号，或者在唤醒时未检测到错误的情况下，在要检测中断信号的区域中输出另一个传感器节点的唤醒地址 地址已验证。

    WRIST-WORN INPUT APPARATUS AND METHOD
    54.
    发明申请
    WRIST-WORN INPUT APPARATUS AND METHOD 审中-公开
    WRIST-WORN输入装置和方法

    公开(公告)号：US20100066664A1

    公开(公告)日：2010-03-18

    申请号：US12516856

    申请日：2007-12-05

    申请人： Yong-Ki Son ,  John Sunwoo ,  Ji-Eun Kim ,  Dong-Woo Lee ,  Il-Yeon Cho

    发明人： Yong-Ki Son ,  John Sunwoo ,  Ji-Eun Kim ,  Dong-Woo Lee ,  Il-Yeon Cho

    IPC分类号： G09G5/00

    CPC分类号： G06F1/163 ,  G06F3/011 ,  G06F3/017

    摘要： Provided are a wrist-worn input apparatus and method. The apparatus and method can segment meaningful hand gestures using a vibration sound generated by a finger tapping and can issue commands corresponding to the recognized hand gestures, enabling the user to easily input commands to electronic devices.

    摘要翻译： 提供了一种手腕式输入装置和方法。 该装置和方法可以使用由手指敲击产生的振动声音来分割有意义的手势，并且可以发出与所识别的手势相对应的命令，使得用户能够容易地将命令输入到电子装置。

    ATTACH PASTE COMPOSITION FOR SEMICONDUCTOR PACKAGE
    56.
    发明申请
    ATTACH PASTE COMPOSITION FOR SEMICONDUCTOR PACKAGE 审中-公开
    用于半导体封装的粘合剂组合物

    公开(公告)号：US20090088527A1

    公开(公告)日：2009-04-02

    申请号：US12238634

    申请日：2008-09-26

    申请人： Joon-Mo Seo ,  Byoung-Un Kang ,  Jae-Hoon Kim ,  Ji-Eun Kim ,  Jun-Woo Lee

    发明人： Joon-Mo Seo ,  Byoung-Un Kang ,  Jae-Hoon Kim ,  Ji-Eun Kim ,  Jun-Woo Lee

    IPC分类号： C08L63/00

    CPC分类号： C08L21/00 ,  C08L15/00 ,  C08L63/00 ,  C08L2666/04 ,  C09J163/00 ,  H01L2924/0002 ,  C08L2666/14 ,  H01L2924/00

    摘要： The present invention relates to an attach paste composition for a semiconductor package. The attach paste composition for a semiconductor package includes a mixed resin, or a blend of an elastic resin and an epoxy resin as a basic resin. At this time, preferably the basic resin includes 50 to 95 weight % of the elastic resin and 5 to 50 weight % of the epoxy resin. The present invention enables a conventional semiconductor packaging method using a die adhesive to eliminate a pre-drying process performed after application of a die adhesive through screen printing and a thermal hardening process performed after an encapsulation process, maintains the properties of the die adhesive, ensures reliability of semiconductor products, and realizes a simple process.

    摘要翻译： 本发明涉及一种半导体封装用贴剂组合物。 用于半导体封装的附着膏组合物包括混合树脂或作为基础树脂的弹性树脂和环氧树脂的共混物。 此时，碱性树脂优选包含50〜95重量％的弹性树脂和5〜50重量％的环氧树脂。 本发明能够实现使用模具粘合剂的常规半导体封装方法来消除在通过丝网印刷施加模具粘合剂之后执行的预干燥处理和在封装工艺之后进行的热硬化处理，保持模具粘合剂的性质确保 半导体产品的可靠性，实现了一个简单的过程。