摘要:
The present invention relates to an attach paste composition for a semiconductor package. The attach paste composition for a semiconductor package includes a mixed resin, or a blend of an elastic resin and an epoxy resin as a basic resin. At this time, preferably the basic resin includes 50 to 95 weight % of the elastic resin and 5 to 50 weight % of the epoxy resin. The present invention enables a conventional semiconductor packaging method using a die adhesive to eliminate a pre-drying process performed after application of a die adhesive through screen printing and a thermal hardening process performed after an encapsulation process, maintains the properties of the die adhesive, ensures reliability of semiconductor products, and realizes a simple process.
摘要:
The present invention relates to a semiconductor packaging method. The method comprises (S1) applying a die adhesive to an upper surface of a member through screen-printing; (S2) B-stage curing the member having the die adhesive; (S3) attaching a die on the B-stage cured die adhesive; (S4) wire-bonding the die to the member; and (S5) encapsulating the outside of the resultant, after the B-stage curing process of the step S2, a degree of cure of the die adhesive shows a decrease in heat capacity by 80 to 100%, and the step S3 is performed such that the die adhesive maintains an adhesive strength of 10 kgf/cm2 or more at normal temperature after the die attaching.
摘要翻译:本发明涉及一种半导体封装方法。 该方法包括(S1)通过丝网印刷将模具粘合剂施加到构件的上表面; (S2)对具有模具粘合剂的部件进行B阶固化; (S3)在B阶固化模具粘合剂上附着模具; (S4)将模具引线接合到构件上; 和(S5)封装所得物的外部,在步骤S2的B阶段固化处理之后,模具粘合剂的固化程度显示出80〜100%的热容量降低,并且步骤S3如此进行 模具粘合剂在模具附着后在常温下保持10kgf / cm 2以上的粘合强度。
摘要:
The present invention relates to a semiconductor packaging method. The method comprises (S1) applying a die adhesive to an upper surface of a member through screen-printing; (S2) B-stage curing the member having the die adhesive; (S3) attaching a die on the B-stage cured die adhesive; (S4) wire-bonding the die to the member; and (S5) encapsulating the outside of the resultant, after the B-stage curing process of the step S2, a degree of cure of the die adhesive shows a decrease in heat capacity by 80 to 100%, and the step S3 is performed such that the die adhesive maintains an adhesive strength of 10 kgf/cm2 or more at normal temperature after the die attaching.
摘要翻译:本发明涉及一种半导体封装方法。 该方法包括(S1)通过丝网印刷将模具粘合剂施加到构件的上表面; (S2)对具有模具粘合剂的部件进行B阶固化; (S3)在B阶固化模具粘合剂上附着模具; (S4)将模具引线接合到构件上; 和(S5)封装所得物的外部,在步骤S2的B阶段固化处理之后,模具粘合剂的固化程度显示出80〜100%的热容量降低,并且步骤S3如此进行 模具粘合剂在模具附着后在常温下保持10kgf / cm 2以上的粘合强度。
摘要:
A liquid crystal display includes; a first substrate, a second substrate disposed facing the first substrate, an alignment layer disposed on at least one of the first substrate and the second substrate, wherein the alignment layer comprises a major alignment material and a vertical photo-alignment material, and the vertical photo-alignment material comprises a first vertical functional group, and a liquid crystal layer interposed between the first substrate and the second substrate.
摘要:
A semiconductor device, a test structure of the semiconductor device, and a method of testing the semiconductor device are provided. The test structure including a first pad and a second pad being separated from each other, and a first test element and a second test element connected between the first pad and the second pad, a first value of a characteristic parameter of the first test element being different from a second value of the characteristic parameter of the second test element, may be provided.
摘要:
A liquid crystal display including: a first substrate and a second substrate facing each other; an alignment layer disposed on one of the first substrate and the second substrate and including a vertical photo-alignment material which includes a first vertical functional group and a photo-reactive group, and a major alignment material which does not include the photo-reactive group; and a liquid crystal layer disposed between the first substrate and the second substrate, wherein a ratio of a molar concentration of the vertical photo-alignment material to the molar concentration of the major alignment material increases in a direction towards a surface of the alignment layer adjacent to the liquid crystal layer.
摘要:
A photoalignment material includes a photoalignment polymer having a photosensitive portion represented by the following Chemical Formula 1, R1 represents a cyclic compound, each of R2 and R3 represents a single bond, —(CnH2n)—, —(CxH2x)O(CyH2y)—, or —(CaH2a)O(CbH2b)O(CdH2d)—, “n” represents an integer in the range of 1 to 6, each of “x”, “y”, “a”, “b”, and “d” represents 0 or an integer in the range of 1 to 6, x+y is an integer in the range of 1 to 5, and a+b+d is an integer in the range of 1 to 6. Each hydrogen atom is replaceable with —CH3, —CH2—CH3, —OCH3, —OCH2CH3, —OCH2OCH3, F, or Cl, and each hydrogen atom of —CH3, —CH2—CH3, —OCH3, —OCH2CH3, or —OCH2OCH3 is replaceable with F or Cl.
摘要:
Disclosed are a display device and a method of driving the same that improve both moving image visibility and lateral visibility. A display panel including gate and data lines arranged in the form of a matrix for displaying an image, a gate driver for driving the gate line, and a data driver for supplying a low gray scale image signal, a high gray scale image signal, and a black impulsive signal to the data line within one frame period.
摘要:
A method for driving a display device includes: dividing an entire gray-scale region corresponding to a data gray scale into a first gray-scale region and a second gray-scale region and setting a first gamma value of the first gray-scale region and a second gamma value of the second gray-scale region, the first gamma value being smaller than the second gamma value; providing a first gray-scale display voltage corresponding to the data gray scale to a display panel during a first section of one horizontal period by using the first gamma value or the second gamma value selected by an inputted data gray scale; and providing a second gray-scale display voltage corresponding to a black gray scale to the display panel during a second section of the one horizontal period.
摘要:
A rail-to-rail amplifier includes an NMOS type amplification unit configured to perform an amplification operation on differential input signals in a domain in which DC levels of the differential input signals are higher than a first threshold value, a PMOS type folded-cascode amplification unit configured to perform an amplification operation on the differential input signals in a domain in which the DC levels of the differential input signals are lower than a second threshold value which is higher than the first threshold value, the PMOS type folded-cascode amplification unit being cascade-coupled to the NMOS type amplification unit, and an adaptive biasing unit configured to interrupt a current path of the PMOS type folded-cascode amplification unit in a domain in which the DC levels of the differential input signals are higher than the second threshold value in response to the differential input signals.