公开(公告)号：US20070041691A1

公开(公告)日：2007-02-22

申请号：US11586790

申请日：2006-10-26

Applicant: Ut Tran ,  David Deacon ,  Shing Lee

Inventor： Ut Tran ,  David Deacon ,  Shing Lee

IPC: G02B6/10

CPC classification number: G02B6/136 ,  G02B6/1221 ,  G02B2006/12097 ,  G02B2006/12176

Abstract: A well may be formed for access to an optical waveguide core by a process that results in an L-shaped well. The L-shaped well may then be filled with a polymer. By controlling the size of each portion of well, the occurrence of bubbles within the well and cuts to the core may be reduced.

Abstract translation: 可以形成用于通过导致L形阱的工艺来访问光波导芯的阱。 然后可以用聚合物填充L形孔。 通过控制井的每个部分的尺寸，可以减少井内气泡的发生以及对芯的切割。

公开(公告)号：US20060182395A1

公开(公告)日：2006-08-17

申请号：US11392018

申请日：2006-03-29

Applicant: Ut Tran ,  Hamid Eslampour

Inventor： Ut Tran ,  Hamid Eslampour

IPC: G02B6/26

CPC classification number: G02B6/4232 ,  G02B6/422 ,  G02B6/4227 ,  G02B6/423 ,  H01S5/0224 ,  H01S5/02268 ,  H01S5/02272

Abstract: Optical components may be precisely positioned in three dimensions with respect to one another. A bonder which has the ability to precisely position the components in two dimensions can be utilized. The components may be equipped with contacts at different heights so that as the components come together in a third dimension, their relative positions can be sensed. This information may be fed back to the bonder to control the precise alignment in the third dimension.

公开(公告)号：US20050265665A1

公开(公告)日：2005-12-01

申请号：US11174940

申请日：2005-07-05

Applicant: Ut Tran ,  Hamid Eslampour

Inventor： Ut Tran ,  Hamid Eslampour

IPC: G02B6/35 ,  G02B6/42 ,  G02B6/26

CPC classification number: G02B6/4232 ,  G02B6/422 ,  G02B6/4227 ,  G02B6/423 ,  H01S5/0224 ,  H01S5/02268 ,  H01S5/02272

Abstract: Optical components may be precisely positioned in three dimensions with respect to one another. A bonder which has the ability to precisely position the components in two dimensions can be utilized. The components may be equipped with contacts at different heights so that as the components come together in a third dimension, their relative positions can be sensed. This information may be fed back to the bonder to control the precise alignment in the third dimension.

公开(公告)号：US5875542A

公开(公告)日：1999-03-02

申请号：US844511

申请日：1997-04-18

Applicant: Ut Tran ,  Son Tran

Inventor： Ut Tran ,  Son Tran

IPC: G11B5/31 ,  G11B5/265 ,  G11B5/39 ,  G11B5/127

CPC classification number: G11B5/3967 ,  G11B5/3116 ,  G11B5/3163 ,  Y10T29/49044

Abstract: Methods for fabricating merged magnetic heads, employing an inductive write head and a magnetoresistive (MR) read head which share portions of the overall magnetic structure, provide for accurate definition of the write track width and for improved alignment of the write gap and the read gap. The method includes accurately forming and defining the nonmagnetic write gap prior to fabricating the inductive write coil structure and subsequently formed higher topology elements. The methods provide for better control of the widths of the top pole member and the bottom pole member, thereby resulting in substantially equal widths for these pole members.

Abstract translation: 用于制造合并磁头的方法，采用共享磁性结构部分的感应写头和磁阻（MR）读头，提供写入磁道宽度的精确定义，并改善写入间隙和读取间隙的对准 。 该方法包括在制造感应写入线圈结构之前精确地形成和限定非磁性写入间隙，并随后形成较高的拓扑元件。 这些方法可以更好地控制顶极构件和底极构件的宽度，从而导致这些极构件的宽度基本相等。