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    Measuring the position of passively aligned optical components
    3.
    发明授权
    Measuring the position of passively aligned optical components 失效
    测量被动对准光学元件的位置

    公开(公告)号：US06959134B2

    公开(公告)日：2005-10-25

    申请号：US10609804

    申请日：2003-06-30

    申请人： Ut Tran ,  Hamid Eslampour

    发明人： Ut Tran ,  Hamid Eslampour

    IPC分类号： G02B6/35 ,  G02B6/42

    CPC分类号： G02B6/4232 ,  G02B6/422 ,  G02B6/4227 ,  G02B6/423 ,  H01S5/0224 ,  H01S5/02268 ,  H01S5/02272

    摘要： Optical components may be precisely positioned in three dimensions with respect to one another. A bonder which has the ability to precisely position the components in two dimensions can be utilized. The components may be equipped with contacts at different heights so that as the components come together in a third dimension, their relative positions can be sensed. This information may be fed back to the bonder to control the precise alignment in the third dimension.

    摘要翻译： 光学部件可以相对于彼此精确地定位在三维空间中。 可以利用具有将二次元件精确定位的能力的接合器。 组件可以配备有不同高度的触点，使得当组件在第三维度中组合时，可以感测它们的相对位置。 该信息可以反馈到接合器以控制第三维度中的精确对准。

    Measureing the position of passively aligned optical components
    7.
    发明申请
    Measureing the position of passively aligned optical components 审中-公开
    测量被动对准的光学部件的位置

    公开(公告)号：US20090226135A1

    公开(公告)日：2009-09-10

    申请号：US12454059

    申请日：2009-05-12

    申请人： Ut Tran ,  Hamid Eslampour

    发明人： Ut Tran ,  Hamid Eslampour

    IPC分类号： G02B6/42

    CPC分类号： G02B6/4232 ,  G02B6/422 ,  G02B6/4227 ,  G02B6/423 ,  H01S5/0224 ,  H01S5/02268 ,  H01S5/02272

    摘要： Optical components may be precisely positioned in three dimensions with respect to one another. A bonder which has the ability to precisely position the components in two dimensions can be utilized. The components may be equipped with contacts at different heights so that as the components come together in a third dimension, their relative positions can be sensed. This information may be fed back to the bonder to control the precise alignment in the third dimension.

    摘要翻译： 光学部件可以相对于彼此精确地定位在三维空间中。 可以利用具有将二次元件精确定位的能力的接合器。 组件可以配备有不同高度的触点，使得当组件在第三维度中组合时，可以感测它们的相对位置。 该信息可以反馈到接合器以控制第三维度中的精确对准。

    Methods of making bondable contacts and a tool for making such contacts
    8.
    发明授权
    Methods of making bondable contacts and a tool for making such contacts 有权
    制造可接合触点的方法和用于进行这种接触的工具

    公开(公告)号：US06527163B1

    公开(公告)日：2003-03-04

    申请号：US09865686

    申请日：2000-11-21

    申请人： Hamid Eslampour

    发明人： Hamid Eslampour

    IPC分类号： B23K3102

    CPC分类号： H01L24/13 ,  H01L24/05 ,  H01L24/11 ,  H01L24/742 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/1133 ,  H01L2224/1184 ,  H01L2224/13144 ,  H01L2224/742 ,  H01L2224/749 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/00012

    摘要： A method of making bondable contacts on a microelectronic element includes providing a microelectronic element having one or more die pads on a first face thereof and depositing conductive bonding material, such as gold, atop each die pad. The conductive bonding material is then shaped using a contact forming tool to form bondable contacts. The bondable contact has a substantially flat region and a second region projecting above the substantially flat region. The second region includes an apex adapted to abut against an opposing electrically conductive element. The bondable contacts may be formed one at a time or a plurality of the bondable contacts may be formed simultaneously. In one preferred embodiment, the projecting region of the contact defines a wedge-shaped projection that is bounded by the substantially flat region thereof. Each wedge-shaped projection may include an apex and side-walls extending between the apex and the substantially flat region of the contact.

    摘要翻译： 在微电子元件上制造可结合接触的方法包括提供在其第一面上具有一个或多个管芯焊盘的微电子元件，并且在每个管芯焊盘顶上淀积诸如金的导电接合材料。 然后使用接触形成工具将导电接合材料成型，以形成可结合的接触。 可接合触点具有基本上平坦的区域和在基本上平坦的区域上方突出的第二区域。 第二区域包括适于邻接相对的导电元件的顶点。 可以一次形成可结合的触点，也可以同时形成多个可结合的触点。 在一个优选实施例中，触头的突出区域限定了由其基本上平坦的区域限定的楔形突起。 每个楔形突起可以包括在顶点和接触的基本上平坦的区域之间延伸的顶点和侧壁。

    Components with releasable leads
    9.
    发明授权
    Components with releasable leads 失效
    具有可释放引线的部件

    公开(公告)号：US06495462B1

    公开(公告)日：2002-12-17

    申请号：US09566273

    申请日：2000-05-05

    申请人： Belgacem Haba ,  Hamid Eslampour ,  Konstantine Karavakis

    发明人： Belgacem Haba ,  Hamid Eslampour ,  Konstantine Karavakis

    IPC分类号： H01L21302

    CPC分类号： H05K3/4092 ,  H01L23/32 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/3011 ,  H01L2924/00

    摘要： A microelectronic component is made by providing a starting structure having a dielectric layer and leads on a surface of the dielectric layer. Ends of the leads are connected to contacts on a microelectronic element, such as the contacts on a semiconductor chip or wafer. The dielectric layer is then etched to partially detach the leads from the dielectric layer, leaving at least one end of each lead permanently connected to the dielectric layer. The remainder of the lead may be fully or partially detached from the dielectric layer. If the remainder of the lead is only partially detached, the connecting elements that connects the leads to the polymeric layer can be broken or peeled away from the leads during the step of moving the microelectronic element and dielectric layer away from one another. A microelectronic element assemble by includes a support structure having a dielectric layer and terminals disposed on the dielectric layer; a microelectronic element and a plurality of leads connecting contacts on the microelectronic element to terminals on the dielectric layer. The dielectric layer has a central region and a periphery region which surrounds the central region. The periphery region is disposed beneath the periphery of the microelectronic element.

    摘要翻译： 通过提供具有介电层的起始结构并在电介质层的表面上引出微电子部件。 引线的端部连接到微电子元件上的触点，例如半导体芯片或晶片上的触点。 然后蚀刻电介质层以将引线部分地从电介质层分离，留下每个引线的至少一端永久地连接到电介质层。 引线的剩余部分可以与电介质层完全或部分分离。 如果引线的剩余部分仅部分分离，则在将微电子元件和电介质层彼此远离的步骤期间，将引线连接到聚合物层的连接元件可以从引线断开或剥离。 微电子元件组装通过包括具有电介质层的支撑结构和设置在电介质层上的端子; 微电子元件和将微电子元件上的触点连接到电介质层上的端子的多个引线。 电介质层具有围绕中心区域的中心区域和周边区域。 周边区域设置在微电子元件的外围的下方。