Abstract:
A semiconductor device includes a first semiconductor layer having first and second regions, a plurality of first channel layers spaced apart from each other in a vertical direction on the first region of the first semiconductor layer, a first gate electrode surrounding the plurality of first channel layers, a plurality of second channel layers spaced apart from one another in the vertical direction on the second region of the first semiconductor layer, and a second gate electrode surrounding the plurality of second channel layers, wherein each of the plurality of first channel layers has a first crystallographic orientation, and each of the plurality of second channel layers has a second crystallographic orientation different from the first crystallographic orientation, and wherein a thickness of each of the plurality of first channel layers is different from a thickness of each of the plurality of second channel layers.
Abstract:
An integrated circuit includes first and second active regions, first and second standard cells on the first active region and the second active region, and a filler cell between the first and second standard cells and including first and second insulating isolations. The filler cell has a one-pitch dimension. The first and second insulating isolations are spaced the one-pitch dimension apart from each other. The first insulating isolation of the filler cell is disposed at a first boundary between the first standard cell and the filler cell. The second insulating isolation of the filler cell is disposed at a second boundary between the second standard cell and the filler cell. The first and second insulating isolations separate at least a part of the first active region, and at least a part of the second active region.
Abstract:
A vertical fin field effect transistor (V-FinFET) is provided as follows. A substrate has a lower source/drain (S/D). A fin structure extends vertically from an upper surface of the lower S/D. The fin structure includes a sidewall having an upper sidewall portion, a lower sidewall portion and a center sidewall portion positioned therebetween. An upper S/D is disposed on an upper surface of the fin structure. An upper spacer is disposed on the upper sidewall portion. A lower spacer is disposed on the lower sidewall portion. A stacked structure including a gate oxide layer and a first gate electrode is disposed on an upper surface of the lower spacer, the center sidewall portion and a lower surface of the upper spacer. A second gate electrode is disposed on the first gate electrode.
Abstract:
Embodiments of the inventive concepts provide a resistor and a semiconductor device including the same. The resistor includes a substrate, a device isolation layer in the substrate which defines active regions arranged in a first direction a resistance layer including resistance patterns that vertically protrude from the active regions and are connected to each other in the first direction, and contact electrodes on the resistance layer.