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公开(公告)号:US20220190193A1
公开(公告)日:2022-06-16
申请号:US17479706
申请日:2021-09-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Seogwoo HONG , Hyunjoon KIM , Joonyong PARK , Kyungwook HWANG , Junsik HWANG
IPC: H01L33/00 , H01L25/075 , H01L21/683
Abstract: A display transfer structure includes a base layer, a flexible barrier rib positioned on the base layer and having a plurality of holes therein, and a plurality of micro light emitting diodes (LEDs) positioned respectively in the plurality of holes. A method of manufacturing the display transfer structure includes forming a flexible barrier rib having holes on a base layer, supplying liquid to the holes, supplying micro LEDs to the liquid, and scanning the flexible barrier rib with an absorber capable of absorbing the liquid to align each of the micro LEDs in a respective hole such that electrodes of the micro LEDs face an outside of the holes.
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公开(公告)号:US20220189810A1
公开(公告)日:2022-06-16
申请号:US17383012
申请日:2021-07-22
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Kyungwook HWANG , Hyunjoon KIM , Joonyong PARK , Seogwoo HONG , Junsik HWANG
IPC: H01L21/68 , H01L21/683 , H01L25/075
Abstract: A micro-semiconductor chip wet alignment apparatus is provided. The micro-semiconductor chip wet alignment apparatus includes a semiconductor chip wet supply module configured to supply the plurality of micro-semiconductor chips and a liquid onto the transfer substrate so that the plurality of micro-semiconductor chips are flowable on the transfer substrate; and a chip alignment module including an absorber capable of relative movement along a surface of the transfer substrate and configured to absorb the liquid so that the plurality of micro-semiconductor chips are aligned in the plurality of grooves.
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公开(公告)号:US20220102602A1
公开(公告)日:2022-03-31
申请号:US17197357
申请日:2021-03-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Junsik HWANG , Seogwoo HONG , Kyungwook HWANG
IPC: H01L33/62 , H01L25/075 , H01L27/12
Abstract: A micro light emitting device, a display apparatus including the same, and a method of manufacturing the micro light emitting device are disclosed. The micro light emitting device includes a first type semiconductor layer; a light emitting layer provided on the first type semiconductor layer; a second type semiconductor layer provided on the light emitting layer; one or more first type electrodes provided on the second type semiconductor layer; one or more second type electrodes provided on the second type semiconductor layer and spaced apart from the one or more first type electrodes; and a bonding spread prevention portion provided between the one or more first type electrodes and the one or more second type electrodes.
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公开(公告)号:US20200257389A1
公开(公告)日:2020-08-13
申请号:US16860869
申请日:2020-04-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Dongkyun KIM , Seogwoo HONG , Byungkyu LEE , Seokwhan CHUNG
Abstract: A touch sensor includes a plurality of first electrodes, a plurality of second electrodes, and a capacitance measurer configured to measure mutual capacitances between the plurality of first electrodes and the plurality of second electrodes. Each of the first electrodes includes a plurality of loop patterns.
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55.
公开(公告)号:US20190033609A1
公开(公告)日:2019-01-31
申请号:US16148554
申请日:2018-10-01
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hyunjoon KIM , Joonyong PARK , Bongsu SHIN , Dongouk KIM , Jihyun BAE , Dongsik SHIM , SungHoon LEE , Jaeseung CHUNG , Seogwoo HONG
Abstract: A directional backlight unit, a three-dimensional (3D) image display apparatus, and a 3D image displaying method are provided. The directional backlight unit includes a light guide plate having an emission surface on which a plurality of grating elements including first and second groups of grating elements are provided. The plurality of grating elements are arranged such that light beams emitted from the first and second groups of grating elements commonly propagate through a plurality of pixel points and respectively form first and second groups of view points of which corresponding regions do not overlap with each other.
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公开(公告)号:US20170219747A1
公开(公告)日:2017-08-03
申请号:US15337648
申请日:2016-10-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sunghoon LEE , Jaeseung CHUNG , Dongouk KIM , Hyunjoon KIM , Joonyong PARK , Jihyun BAE , Bongsu SHIN , Dongsik SHIM , Seogwoo HONG
IPC: G02B5/18 , F21V8/00 , G02F1/1335
CPC classification number: G02B5/1852 , B23K26/0006 , B23K26/364 , B23K26/38 , B23K26/402 , B23K26/53 , B23K2101/40 , B23K2103/54 , B23K2103/56 , G02B5/18 , G02B5/3058 , G02B6/0038 , G02F1/133512 , G02F1/133528 , G02F1/133606 , G02F2001/133548 , G02F2001/133607 , G03F7/0002 , G03F7/0007
Abstract: A method of manufacturing a pattern structure is provided. The method includes forming a fine pattern on a wafer, cutting the wafer by irradiating the wafer with a laser while changing a focal depth of the laser, thereby forming a unit pattern structure having a fine pattern, and bonding cutting surfaces of at least two unit pattern structures. The cutting of the wafer comprises moving a focal position of the laser in a horizontal direction and changing the focal depth of the laser, such that the unit pattern structure has a cutting surface profile in which a first surface of the unit pattern structure on which the fine pattern is formed protrudes, in a direction substantially parallel to the first surface, from a second surface of the unit pattern structure that is opposite to the first surface.
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公开(公告)号:US20170199420A1
公开(公告)日:2017-07-13
申请号:US15404717
申请日:2017-01-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Bongsu SHIN , Hyunjoon KIM , Joonyong PARK , Dongouk KIM , Jihyun BAE , Dongsik SHIM , Sunghoon LEE , Jaeseung CHUNG , Seogwoo HONG
IPC: G02F1/1335 , F21V8/00 , G02B27/22
Abstract: A three-dimensional (3D) image display apparatus includes a backlight unit configured to provide collimated white light, and a display panel configured to modulate the light provided from the backlight unit based on image information and to display the light in a plurality of viewing zones. The display panel includes a diffractive color filter in which a diffractive element for providing directivity is disposed on a color filter, thereby improving an optical efficiency in 3D image formation.
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58.
公开(公告)号:US20170176669A1
公开(公告)日:2017-06-22
申请号:US15171523
申请日:2016-06-02
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jaeseung CHUNG , Sunghoon LEE , Jihyun BAE , Joonyong PARK , Hoon SONG , Hongseok LEE , Dongouk KIM , Hyunjoon KIM , Bongsu SHIN , Dongsik SHIM , Seogwoo HONG
CPC classification number: G02B6/0061 , G02B5/1819 , G02B5/1842 , G02B5/1857 , G02B6/005 , G02B6/0065 , G02B6/0068 , G02B27/2228
Abstract: A directional backlight and a 3D image display apparatus including the directional backlight are provided. The directional backlight includes a light guide plate guiding light emitted from a light source; a diffractive device configured to adjust the direction of light exiting the light guide plate; and an aperture adjusting layer including a plurality of apertures. The aperture adjusting layer may adjust the optical output efficiency of the diffractive device.
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公开(公告)号:US20170168209A1
公开(公告)日:2017-06-15
申请号:US15236604
申请日:2016-08-15
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Bongsu SHIN , Joonyong PARK , Hyunjoon KIM , Dongouk KIM , Jihyun BAE , Dongsik SHIM , Sunghoon LEE , Jaeseung CHUNG , Seogwoo HONG
IPC: F21V8/00
CPC classification number: G02B6/005 , G02B6/00 , G02B6/0026 , G02B6/0068 , G02B27/22 , G02F1/133606 , G02F1/133615
Abstract: A directional backlight unit and a three-dimensional image display apparatus including the directional backlight unit are provided. The directional backlight unit includes a light source, a light guide plate guiding light emitted from the light source, and a diffraction device including a plurality of sections. Each of the sections includes a grating pattern set configured to adjust the direction of light incident from the light guide plate.
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60.
公开(公告)号:US20160020709A1
公开(公告)日:2016-01-21
申请号:US14701580
申请日:2015-05-01
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Dongsik SHIM , Seogwoo HONG , Seokwhan CHUNG
IPC: H02N1/00
CPC classification number: B06B1/0292
Abstract: An ultrasonic transducer and a method of manufacturing the same are provided. The ultrasonic transducer includes a substrate, a first insulation layer, and a first thin film layer; a plurality of support members formed on the first thin film layer; a second thin film layer supported by the plurality of support members; a cavity between the first thin film layer and the second thin film layer; and a common ground electrode on the second thin film layer.
Abstract translation: 提供了一种超声换能器及其制造方法。 超声波换能器包括基板,第一绝缘层和第一薄膜层; 形成在所述第一薄膜层上的多个支撑构件; 由所述多个支撑构件支撑的第二薄膜层; 第一薄膜层和第二薄膜层之间的空腔; 以及第二薄膜层上的公共接地电极。
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