PLASMA PROCESSING METHOD
    51.
    发明申请

    公开(公告)号:US20170207068A1

    公开(公告)日:2017-07-20

    申请号:US15408733

    申请日:2017-01-18

    Inventor: Koichi Nagami

    CPC classification number: H01J37/32449 H01J37/32165 H01J37/32183

    Abstract: In a plasma processing method, first processes and second processes are performed alternately. In each first process, a first gas is supplied into a processing vessel from a gas supply system, and a first high frequency power is supplied from a first high frequency power supply. In each second process, the first high frequency power is supplied from the first high frequency power supply continuously from a first process which is performed just before the corresponding second process. In each second process, a gas switching signal for switching the gas from the first gas to the second gas is applied to the gas supply system. Further, a supply of a second high frequency power is begun by a second high frequency power supply when a parameter such as a load impedance exceeds a threshold value after the gas switching signal is applied to the gas supply system.

    PLASMA PROCESSING APPARATUS
    52.
    发明申请
    PLASMA PROCESSING APPARATUS 有权
    等离子体加工设备

    公开(公告)号:US20150096684A1

    公开(公告)日:2015-04-09

    申请号:US14509131

    申请日:2014-10-08

    Abstract: In a plasma processing apparatus, when pulse-modulating the high frequency power RF1 for plasma generation and the high frequency power RF2 for ion attraction with a first pulse PS1 and a second pulse PS2 having different frequencies, respectively, an impedance sensor 96A in a matching device 40 of a plasma generation system calculates an average value (primary moving average value ma) of an load impedance on a high frequency transmission line 43 for each cycle of the second pulse PS2 having a lower frequency, and outputs a load impedance measurement value based on those average values of the load impedance. Then, a matching controller 94A controls reactances of reactance elements XH1 and XH2 within a matching circuit 88A such that the load impedance measurement value is equal or approximate to a matching point (50Ω).

    Abstract translation: 在等离子体处理装置中,分别对具有不同频率的第一脉冲PS1和第二脉冲PS2进行等离子体产生的高频功率RF1和离子吸引用的高频功率RF2进行脉冲调制时,将匹配的阻抗传感器96A 等离子体发生系统的装置40对具有较低频率的第二脉冲PS2的每个周期计算高频传输线43上的负载阻抗的平均值(主移动平均值ma),并输出基于负载阻抗测量值 对负载阻抗的平均值。 然后,匹配控制器94A控制匹配电路88A内的电抗元件XH1和XH2的电抗,使得负载阻抗测量值等于或接近于匹配点(50&OHgr)。

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