公开(公告)号：US20200057372A1

公开(公告)日：2020-02-20

申请号：US16449184

申请日：2019-06-21

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

发明人： Chi-Hung LIAO ,  Min-Cheng WU

IPC分类号： G03F7/20 ,  G21K1/06 ,  H05G2/00 ,  G02B26/08

摘要： A method is provided. The method includes steps as follows. EUV light is generated. A collector is used to gather the EUV light onto a first optical reflector. The first optical reflector is used to reflect the EUV light to a reticle, so as to impart the EUV light with a pattern. A second optical reflector is used to reflect the EUV light with the pattern onto a wafer. The first optical reflector is rotated.

公开(公告)号：US20200057365A1

公开(公告)日：2020-02-20

申请号：US16212442

申请日：2018-12-06

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

发明人： Chi-Hung LIAO ,  Ju-Wei LIAO

IPC分类号： G03F1/38 ,  H01L21/033 ,  G03F1/52 ,  G03F1/54 ,  G03F1/36

摘要： A method includes clamping a mask on a mask stage, in which the mask includes a multilayered magnetic film; performing a first lithography process by using the mask; moving the mask away from the mask stage; and determining whether a surface condition of a surface layer of the multilayered thin film is acceptable; and peeling the surface layer of the multilayered magnetic film from the multilayered magnetic film when the surface condition of the surface layer is determined as unacceptable.

公开(公告)号：US20200019072A1

公开(公告)日：2020-01-16

申请号：US16164652

申请日：2018-10-18

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

发明人： Min-Cheng WU ,  Chi-Hung LIAO

IPC分类号： G03F7/20 ,  G03F1/82

摘要： A method includes moving a sticky structure to a wafer table such that a first particle on the wafer table is adhered to the sticky structure, moving the sticky structure away from the wafer table after the first particle is adhered to the sticky structure, and performing a lithography process to a wafer held by the wafer table after moving the sticky structure away from the wafer table