LITHOGRAPHY SYSTEM AND OPERATION METHOD THEREOF

    公开(公告)号:US20230161273A1

    公开(公告)日:2023-05-25

    申请号:US18151163

    申请日:2023-01-06

    IPC分类号: G03F7/20 H05G2/00

    摘要: A method includes shooting a primary droplet and a satellite droplet from a droplet generator along a common initial direction; applying a force to the primary droplet and the satellite droplet, wherein after applying the force, the primary droplet has a first deflection toward a first direction different than the common initial direction, and the satellite droplet has a second deflection toward a second direction different than the common initial direction, wherein the second deflection of the satellite droplet is greater than the first deflection of the primary droplet; and generating an extreme ultraviolet (EUV) light using an excitation laser hitting the primary droplet with the first deflection.

    SUBSTRATE MEASURING DEVICE AND A METHOD OF USING THE SAME

    公开(公告)号:US20200033730A1

    公开(公告)日:2020-01-30

    申请号:US16049678

    申请日:2018-07-30

    IPC分类号: G03F7/20 G03F1/42

    摘要: Embodiments of the present disclosure provide a substrate measuring device in a lithography projection apparatus that provides multiple light sources having different wavelengths. In some embodiments, a lithography projection apparatus includes a substrate measuring system disposed proximate to a substrate stage, the substrate measuring system further including an emitter including multiple light sources configured to provide multiple beams of light, each of at least some of the multiple beams of light having a different wavelength, at least one optical fiber, wherein each of respective portions of the at least one optical fiber is configured to pass a respective one of the multiple beams of light, and a receiver positioned to collected light emitted from the emitter and reflected off of a substrate disposed on the substrate stage.

    CLEANING METHOD AND APPARATUS
    5.
    发明申请

    公开(公告)号:US20230118862A1

    公开(公告)日:2023-04-20

    申请号:US18066771

    申请日:2022-12-15

    摘要: A method includes transferring a wafer to a position over a wafer chuck; lifting a lifting pin through the wafer chuck to a first position to support the wafer; holding the wafer on the lifting pin using a negative pressure source in gaseous communication with an inner gas passage of the lifting pin; introducing a gas to a region between the wafer and the wafer chuck through an outer gas passage of the lifting pin, wherein in a top view of the lifting pin, the inner gas passage has a circular profile, while the outer gas passage has a ring-shape profile; and lowering the lifting to dispose the wafer over the wafer chuck.

    PARTICLE REMOVAL FROM WAFER TABLE AND PHOTOMASK

    公开(公告)号:US20200301292A1

    公开(公告)日:2020-09-24

    申请号:US16894653

    申请日:2020-06-05

    IPC分类号: G03F7/20 G03F1/82

    摘要: A system includes a frame, a projection lens, a wafer table, and a cleaner. The frame has an opening vertically extending through the frame. The projection lens is disposed on the frame. The wafer table is below the frame, in which the wafer table is movable along a horizontal direction. The cleaner is over the frame, in which the cleaner comprises a sticky structure movable along a vertical direction and through the opening of the frame.

    PARTICLE REMOVAL FROM WAFER TABLE AND PHOTOMASK

    公开(公告)号:US20200019072A1

    公开(公告)日:2020-01-16

    申请号:US16164652

    申请日:2018-10-18

    IPC分类号: G03F7/20 G03F1/82

    摘要: A method includes moving a sticky structure to a wafer table such that a first particle on the wafer table is adhered to the sticky structure, moving the sticky structure away from the wafer table after the first particle is adhered to the sticky structure, and performing a lithography process to a wafer held by the wafer table after moving the sticky structure away from the wafer table

    SUBSTRATE MEASURING DEVICE AND A METHOD OF USING THE SAME

    公开(公告)号:US20220334490A1

    公开(公告)日:2022-10-20

    申请号:US17855591

    申请日:2022-06-30

    IPC分类号: G03F7/20 G03F1/42 G03F9/00

    摘要: Embodiments of the present disclosure provide a substrate measuring device in a lithography projection apparatus that provides multiple light sources having different wavelengths. In some embodiments, a lithography projection apparatus includes a substrate measuring system disposed proximate to a substrate stage, the substrate measuring system further including an emitter including multiple light sources configured to provide multiple beams of light, each of at least some of the multiple beams of light having a different wavelength, at least one optical fiber, wherein each of respective portions of the at least one optical fiber is configured to pass a respective one of the multiple beams of light, and a receiver positioned to collected light emitted from the emitter and reflected off of a substrate disposed on the substrate stage.

    SUBSTRATE MEASURING DEVICE AND A METHOD OF USING THE SAME

    公开(公告)号:US20210341841A1

    公开(公告)日:2021-11-04

    申请号:US17374647

    申请日:2021-07-13

    IPC分类号: G03F7/20 G03F1/42 G03F9/00

    摘要: Embodiments of the present disclosure provide a substrate measuring device in a lithography projection apparatus that provides multiple light sources having different wavelengths. In some embodiments, a lithography projection apparatus includes a substrate measuring system disposed proximate to a substrate stage, the substrate measuring system further including an emitter including multiple light sources configured to provide multiple beams of light, each of at least some of the multiple beams of light having a different wavelength, at least one optical fiber, wherein each of respective portions of the at least one optical fiber is configured to pass a respective one of the multiple beams of light, and a receiver positioned to collected light emitted from the emitter and reflected off of a substrate disposed on the substrate stage.