公开(公告)号：US20090095448A1

公开(公告)日：2009-04-16

申请号：US11959434

申请日：2007-12-18

申请人： CHENG-TIEN LAI ,  ZHI-YONG ZHOU ,  QIAO-LI DING

发明人： CHENG-TIEN LAI ,  ZHI-YONG ZHOU ,  QIAO-LI DING

IPC分类号： F28D15/00

CPC分类号： F21V29/763 ,  F21K9/00 ,  F21V29/75 ,  F21Y2113/00 ,  F21Y2115/10 ,  F28D15/0233 ,  F28F3/02 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device for removing heat from LED chips includes a finned heat sink, a plurality of heat pipes and a plurality of heat conductive substrates. The heat sink comprises a base plate and a plurality of fins formed on the base plate. The heat pipes which transfer heat in a unidirectional manner are embedded in the base plate. Each of the heat pipes defines a first wall and a second wall coupled to the heat sink. The heat pipes only transfer heat from the first walls to the second walls and restrict a heat transfer in a reversed direction. The substrates are in contact with first walls of the heat pipes. The LED chips are mounted on the substrates. When the LED chips generate heat, the heat is transferred to the fins via the unidirectional heat pipes to lower the temperature of the LED chips.

摘要翻译： 用于从LED芯片除去热量的散热装置包括翅片式散热器，多个热管和多个导热基板。 散热器包括基板和形成在基板上的多个散热片。 将单向传热的热管嵌入基板中。 每个热管限定了耦合到散热器的第一壁和第二壁。 热管仅将热量从第一壁传递到第二壁并限制相反方向的热传递。 基板与热管的第一壁接触。 LED芯片安装在基板上。 当LED芯片产生热量时，热量通过单向热管传递到散热片，以降低LED芯片的温度。

公开(公告)号：US20080165536A1

公开(公告)日：2008-07-10

申请号：US11621759

申请日：2007-01-10

申请人： CHENG-TIEN LAI ,  ZHI-YONG ZHOU ,  QIAO-LI DING

发明人： CHENG-TIEN LAI ,  ZHI-YONG ZHOU ,  QIAO-LI DING

IPC分类号： F21V29/00

CPC分类号： F21V29/004 ,  F21V17/164 ,  F21V29/51 ,  F21V29/763 ,  F21Y2115/10 ,  Y10S362/80

摘要： An LED module includes a latching component, a frame holding an LED thereon, a heat spreader located in the latching component and a heat transfer member having a heat-dissipating unit remote from the LED and a heat pipe thermally connecting with the heat spreader, the LED and the heat-dissipating unit. The latching component cooperates with the heat spreader to tightly press the frame being attached on the heat spreader. The heat transfer member thermally connects with the heat spreader and transfers heat from the LED to an ambient environment. The latching component has two spring pieces pushing the frame toward the heat spreader and the heat pipe. The spring pieces electrically engage with the frame to thereby electrically connect with the LED.

摘要翻译： LED模块包括闩锁部件，保持LED的框架，位于闩锁部件中的散热器和具有远离LED的散热单元和与散热器热连接的热管的传热部件， LED和散热单元。 闩锁部件与散热器配合，以紧紧地按压附着在散热器上的框架。 传热构件与散热器热连接并将热量从LED传递到周围环境。 闩锁部件具有两个弹簧片，将框架推向散热器和热管。 弹簧片与框架电接合，从而与LED电连接。

公开(公告)号：US20080128114A1

公开(公告)日：2008-06-05

申请号：US11565910

申请日：2006-12-01

申请人： CHENG-TIEN LAI ,  ZHI-YONG ZHOU ,  QIAO-LI DING

发明人： CHENG-TIEN LAI ,  ZHI-YONG ZHOU ,  QIAO-LI DING

IPC分类号： H05K7/20

CPC分类号： G06F1/20 ,  F28F3/12 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cooling plate of a liquid cooling includes a chamber hermetically defined therein, an outlet, and an inlet. The outlet and the inlet communicate with the chamber for circulating liquid through the chamber. One of the outlet and the inlet is located in the other one of the outlet and the inlet.

摘要翻译： 液体冷却的冷却板包括气密地限定在其中的室，出口和入口。 出口和入口与室连通，以使液体循环通过室。 出口和入口之一位于出口和入口的另一个中。

公开(公告)号：US20080117597A1

公开(公告)日：2008-05-22

申请号：US11561344

申请日：2006-11-17

申请人： ZHI-YONG ZHOU ,  CHENG-TIEN LAI ,  YI-SAN LIU

发明人： ZHI-YONG ZHOU ,  CHENG-TIEN LAI ,  YI-SAN LIU

IPC分类号： H05K7/20

CPC分类号： H01L33/648 ,  F21K9/00 ,  F21V29/51 ,  F21V29/70 ,  F21V29/767 ,  F21Y2115/10 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： An LED module includes an LED, a heat spreader contacting the LED, a heat-dissipating unit remote from the LED and a heat transfer member. The heat transfer member thermally connects the heat spreader and the heat-dissipating unit and transfers heat from the heat spreader to the heat-dissipating unit.

摘要翻译： LED模块包括LED，与LED接触的散热器，远离LED的散热单元和传热构件。 传热构件将散热器和散热单元热连接并将热量从散热器传递到散热单元。

公开(公告)号：US20080078528A1

公开(公告)日：2008-04-03

申请号：US11309811

申请日：2006-10-02

申请人： CHENG-TIEN LAI ,  ZHI-YONG ZHOU ,  YI-SAN LIU

发明人： CHENG-TIEN LAI ,  ZHI-YONG ZHOU ,  YI-SAN LIU

IPC分类号： F28D15/00

CPC分类号： F28D15/0275 ,  F28D15/0233 ,  F28F1/12 ,  F28F3/02 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink includes a first plate having a top portion and a bottom portion, a second plate projecting from the top portion of the first plate, and a plurality of fins thermally contacting the second plate. The second plate has a width larger than that of the first plate. The heat pipe includes a first portion embedded in the bottom portion of the first plate for directly contacting an electronic component to be cooled, and a second portion bent from one end of the first portion. The second portion is located at one side of the first plate, while the first portion of the heat pipe is located at a middle of the first plate.

摘要翻译： 散热器包括具有顶部和底部的第一板，从第一板的顶部突出的第二板和与第二板热接触的多个翅片。 第二板的宽度大于第一板的宽度。 热管包括嵌入在第一板的底部中的第一部分，用于直接接触待冷却的电子部件和从第一部分的一端弯曲的第二部分。 第二部分位于第一板的一侧，而热管的第一部分位于第一板的中间。

公开(公告)号：US20080075611A1

公开(公告)日：2008-03-27

申请号：US11309748

申请日：2006-09-21

申请人： CHENG-TIEN LAI ,  Zhi-Yong Zhou ,  Qiao-Li Ding

发明人： CHENG-TIEN LAI ,  Zhi-Yong Zhou ,  Qiao-Li Ding

IPC分类号： F04B17/00

CPC分类号： F04D13/0606

摘要： A miniature liquid cooling device includes a casing (10) defining a first chamber (102), a second chamber (104) and a third chamber (106) communicating with the first chamber. The first and the third chambers cooperatively form a work channel for liquid. An impeller (21) is rotatably mounted in the first chamber to circulate the liquid. A filter (17) is mounted in the second chamber and defines a plurality of orifices (1704). When the impeller rotates the liquid firstly enters the second chamber via an inlet (122) and flows through the filter, whereby air bubbles in the liquid leave the liquid and escape from the filter via the orifices. The escaped air bubbles enter the second chamber. The deaerated liquid flows into the work channel and finally is driven to flow out of the liquid cooling device via an outlet (124).

摘要翻译： 微型液体冷却装置包括限定第一室（102）的壳体（10），与第一室连通的第二室（104）和第三室（106）。 第一和第三室协同地形成液体的工作通道。 叶轮（21）可旋转地安装在第一室中以使液体循环。 过滤器（17）安装在第二室中并限定多个孔（1704）。 当叶轮旋转时，液体首先通过入口（122）进入第二室并流过过滤器，由此液体中的气泡离开液体并经过孔从过滤器逸出。 逸出的气泡进入第二个室。 脱气液体流入工作通道，最后通过出口（124）被驱动流出液体冷却装置。

公开(公告)号：US20070195489A1

公开(公告)日：2007-08-23

申请号：US11309225

申请日：2006-07-13

申请人： CHENG-TIEN LAI ,  Zhi-Yong Zhou ,  Qiao-Li Ding

发明人： CHENG-TIEN LAI ,  Zhi-Yong Zhou ,  Qiao-Li Ding

IPC分类号： H02B1/00

CPC分类号： G11C5/143 ,  H01L23/3672 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： A memory module assembly includes a printed circuit board (10) having a heat-generating electronic component (14) thereon, and first and second heat-dissipation plates (20), (30) attached on opposite sides of the printed circuit board. The first heat-dissipation plate includes a first hook (24) extending from a side thereof and the first hook includes a resisting portion (242) extending from an end of the first heat-dissipation plate and a first engaging portion (244) extending from a free end of the resisting portion for resisting the printed circuit board and the second heat-dissipation plate. The second heat-dissipation plate defines a depressed portion (34) in a side thereof for engaging with the first hook. The other sides of the first and second heat-dissipation plates engage with each other to clamp the printed circuit board between the first and second heat-dissipation plates.

摘要翻译： 存储模块组件包括其上具有发热电子部件（14）的印刷电路板（10）和安装在印刷电路板的相对侧上的第一和第二散热板（20），（30）。 第一散热板包括从其一侧延伸的第一钩（24），第一钩包括从第一散热板的端部延伸的阻挡部分（242）和从第一散热板的一端延伸的第一接合部分（244） 用于抵抗印刷电路板和第二散热板的抵抗部分的自由端。 第二散热板在其一侧限定了与第一钩接合的凹部（34）。 第一和第二散热板的另一侧彼此接合以将印刷电路板夹在第一和第二散热板之间。