摘要:
An LED lamp includes a radiator, two caps and a light emitting module. The radiator includes a base and a plurality of fins parallel to each other extends along a face of the base, the fins are integrally formed with the base. The two caps are aligned with two opposite ends of the radiator along a longitudinal direction. The light emitting module includes several circuit boards attaching to another face of the base and a plurality of LEDs disposed on the circuit boards. The circuit boards are arranged along the longitudinal direction of the fins, the radiator is cut into pieces with different length according to the arrangement of the circuit board. The present disclosure also provides a method for manufacturing the LED lamp.
摘要:
An LED flood lamp includes an LED lamp and a primary bracket and an accessorial bracket. The lamp includes a pair of lateral sidewalls. The primary bracket pivotally connects with the lateral sidewalls. The accessorial bracket has one end pivotally connecting with one lateral sidewall, and another end connected to the primary bracket via a fastener. Each of the primary and accessorial brackets defines an elongated slot. The fastener is slidable along the slots of the primary and accessorial brackets to vary an illumination angle of the lamp. The LED lamp has a substrate, a plurality of LED modules mounted on a top surface of the substrate and a heat sink mounted on a bottom surface of the substrate, whereby heat generated by the LED modules can be transferred to the heat sink via the substrate to be dissipated to ambient air.
摘要:
An LED lamp includes a first heat sink, a second heat sink thermally contacting the first heat sink, and an LED module mounted on the first heat sink. The first heat sink comprises a plate and a plurality of first fins extending from the plate. The plate has a bare area on a top surface thereof. The LED module is mounted on the bare area and surrounded by the first fins of the first heat sink. The second heat sink comprises a base thermally contacting a bottom surface of the plate of the first heat sink and a plurality of second fins arranged at a bottom surface of the base of the second heat sink. Heat pipes are sandwiched between the plate and base of the first and second heat sinks.
摘要:
An LED module includes an LED, a heat spreader contacting the LED, a heat-dissipating unit remote from the LED and a heat transfer member. The heat transfer member thermally connects the heat spreader and the heat-dissipating unit and transfers heat from the heat spreader to the heat-dissipating unit.
摘要:
A heat sink includes a first plate having a top portion and a bottom portion, a second plate projecting from the top portion of the first plate, and a plurality of fins thermally contacting the second plate. The second plate has a width larger than that of the first plate. The heat pipe includes a first portion embedded in the bottom portion of the first plate for directly contacting an electronic component to be cooled, and a second portion bent from one end of the first portion. The second portion is located at one side of the first plate, while the first portion of the heat pipe is located at a middle of the first plate.
摘要:
An LED unit includes an LED and a lens receiving the LED. The LED includes a chassis, a base on the chassis and an envelope fixed on the base. The lens has two crossed grooves, a hole and a chamber sequentially defined in a bottom face the lens, along an upward direction thereof. The chassis of the LED can be selected to fit in one of the two grooves. The base of the LED is engaged in the hole of the lens, and the envelope of the LED is received in the chamber of the lens.
摘要:
A lamp assembly includes a lamp and a junction box. The lamp defines a front chamber and a rear chamber. A plurality of LED modules is received in the rear chamber. A receiving member is located at a top of the front chamber. The junction box is mounted on an outside of the receiving member. A junction base is received in the junction box. A mounting tube extends through the junction box and the receiving member of the lamp to mount the junction box on the lamp. A connecting tube is mounted on the junction box. Wires of the LED modules extend through the mounting tube and connecting with the junction base. The connecting tube is adapted to receive wires extending from an outside power sources to the junction base.
摘要:
A heat dissipation device includes a heat conducting plate (100) for contacting with an electronic component (400), a heat sink (200) mounted on the heat conducting plate and a heat pipe (300). The heat conducting plate comprises a groove (110) defined in. The heat pipe comprises an evaporating portion (310) sandwiched between the heat conducting plate and the heat sink, and a condensing portion (320) thermally connecting with the heat sink. The evaporating portion comprises a middle portion (3104) having a circular cross section and accommodated in the groove of the heat conducting plate, and a pair of end portions (3102) formed on opposite sides of the middle portion. The end portions have flat bottom surfaces.