摘要:
A receptacle connector includes a receiving slot, a mating plate slidably received in the receiving slot, an ejection mechanism, and a resetting mechanism. The mating plate is exposed at a front end of the receiving slot and is provided with a urging portion and a first engaging portion. The ejection mechanism is provided with a stopping portion for correspondingly stopping the urging portion, so that the ejection mechanism can drive the mating plate to slide outwards. The resetting mechanism is provided with a second engaging portion for being correspondingly engaged with the first engaging portion, so that the resetting mechanism can drive the mating plate to return to an original position.
摘要:
A light source device includes a first heat dissipation structure, an LED module, a heat energy convertor and a fan. The first heat dissipation structure includes a heat dissipation base, a first fin group attached on a top surface of the heat dissipation base. The LED module is attached on a bottom surface of the heat dissipation base of the first heat dissipation structure. The heat energy convertor is thermally connected to the heat dissipation base of the first heat dissipation structure through heat pipes, and configured for changing heat energy generated by the LED module into kinetic energy. The fan is disposed over the first fin group and driven by the heat energy convertor.
摘要:
An LED lamp comprises a lamp housing, a heat sink made of metal and mounted at a bottom side of the lamp housing, a plurality of LED modules, and a vapor chamber having a bottom surface thereof attached to a top surface of the heat sink and having a top surface thereof to which the LED modules are attached, a working liquid is sealed in the vapor chamber. The vapor chamber defines a sealed chamber therein, and the working liquid is phase changeable liquid and is sealed in the sealed chamber. A plurality of ribs is arranged in the vapor chamber for strengthening an integrity of the vapor chamber, and the ribs divide the sealed chamber into a plurality of communicating spaces.
摘要:
A vapor chamber includes a sealed flattened casing containing working liquid therein, a wick structure arranged on an inner face of the casing, a plurality of supporting posts received in the casing and at least a metallic wire connecting the supporting posts. Each supporting post defines at least a channel therein. The at least a metallic wire engagingly extends through the channels of the supporting posts. Top and bottom ends of the supporting posts engage the wick structure to reinforce a structure of the vapor chamber.
摘要:
A heat dissipation device adapted for removing heat from LED modules of an LED lamp includes a plurality of heat sinks, a plurality of fin sets and a plurality of heat pipes extending through the fin sets and thermally connecting the heat sinks and the fin sets together. The heat sinks each have a base plate with a bottom surface which is kept in contact with corresponding LED modules and a plurality of fins arranged on a top surface of the base plate. Each of the fin sets consists of a plurality of flakes and defines a plurality of air passages between the flakes. Air can flow through the heat dissipation device from a place thereunder to a place thereabove via the air passages between the flakes of the fin sets.
摘要:
A heat sink includes a first plate having a top portion and a bottom portion, a second plate projecting from the top portion of the first plate, and a plurality of fins thermally contacting the second plate. The second plate has a width larger than that of the first plate. The heat pipe includes a first portion embedded in the bottom portion of the first plate for directly contacting an electronic component to be cooled, and a second portion bent from one end of the first portion. The second portion is located at one side of the first plate, while the first portion of the heat pipe is located at a middle of the first plate.
摘要:
A gas-liquid separation apparatus includes an inlet pipe for transferring liquid with gas dissolved therein and a separating pipe for separating the gas from the liquid. The separating pipe has a spiral-shaped guiding member therein. The separating pipe extends from the inlet pipe and is in alignment and communicating with the inlet pipe. An outlet pipe extends from a joint of the inlet pipe and the separating pipe and communicates with the separating pipe, for transferring therein the liquid after the liquid has been degassed by the spiral-shaped guiding member in the separating pipe. A gas storage device communicates with the separating pipe and outside for collecting the gas from the separating pipe and discharging the gas to the outside.
摘要:
A gas-liquid separation apparatus includes a container and a separating pipe located in the container. The container includes an annular wall and two lids covering two ends of the wall. The container has a cavity surrounded by the wall and the two lids. An inlet extends through one lid and an outlet extends through the other lid. The separating pipe is disposed in the cavity of the container and in communication with the inlet and the outlet of the container. A plurality of apertures is defined in a body of the separating pipe and in communication with a space inside the separating pipe and the cavity of the container. The liquid with gas dissolved therein enters into the separating pipe via the inlet of the container. The liquid is degassed by the separating pipe. The de-gassed liquid exits the separating pipe via the outlet of the container.
摘要:
A heat sink for cooling an electronic component includes a lower plate, an upper plate, an upper fin set and a lower fin set respectively fixed on the upper plate and the lower plate, and a plurality of heat pipes sandwiched between the upper plate and the lower plate. The lower plate forms a protrusion projecting downwardly therefrom. A bottom surface of the protrusion is milled to be flat and smooth, whereby the bottom surface can intimately contact the electronic component. A method for manufacturing the heat sink comprising milling a bottom surface of a protrusion punched downwardly from a lower plate, whereby the bottom surface can be flat and smooth sufficiently to have an intimate contact with an electronic component, and sequentially welding an upper plate on the lower plate and a plurality of fins on the lower plate and the upper plate, respectively.
摘要:
A heat dissipation device adapted for removing heat from LED modules of an LED lamp includes a plurality of heat sinks, a plurality of fin sets and a plurality of heat pipes extending through the fin sets and thermally connecting the heat sinks and the fin sets together. The heat sinks each have a base plate with a bottom surface which is kept in contact with corresponding LED modules and a plurality of fins arranged on a top surface of the base plate. Each of the fin sets consists of a plurality of flakes and defines a plurality of air passages between the flakes. Air can flow through the heat dissipation device from a place thereunder to a place thereabove via the air passages between the flakes of the fin sets.