摘要:
A radiation curing apparatus comprises a plurality of solid state radiation sources to generate radiation that cures a first material. The solid state radiation sources can be disposed in an array pattern. Optical concentrators, arranged in a corresponding array pattern, receive radiation from corresponding solid state radiation sources. The concentrated radiation is received by a plurality of optical waveguides, also arranged in a corresponding array pattern. Each optical waveguide includes a first end to receive the radiation and a second end to output the radiation. The curing apparatus can be utilized for continuous substrate, sheet, piece part, spot curing, and/or 3D radiation-cure processes.
摘要:
A method and apparatus for managing a run-time environment is provided for improving performance and scalability of networked computer systems. In one example of the invention, a method starts by loading a class file, the class file specifying a class that includes a static class variable and a static initializer to initialize the static class variable. The static initializer is then invoked to initialize the static class variable. The class and the initialized static class variable are then saved in a second class file. The second class file is then loaded into a shared memory, the second class file including the class and the initialized static class variable.
摘要:
A method and software for managing class variables is described in which a variable-format container for static class variables is provided such that numeric class variables can be accessed directly while other kinds of class variables are accessed via a reference to an object.
摘要:
A method for scanning objects as for garbage collection is described that employ an ancillary data structure to describe the format of an object. Specifically, the data structure lists which parts of the object are references and how large each part of the object is. Scanning the object can efficiently occur by stepping through the object and the data structure in parallel.
摘要:
A method and software for analyzing a heap is described, in which a snapshot is made of a heap, which can be later analyzed by an analysis tool when a program that had run out of memory is no longer running. In one embodiment, an object allocated by the program is accessed and copied into a file, and an address of the object allocated by the process is recorded in association with an offset in the file of the copy of the object. The copy of the object copied into the file has preferably the same size as the object allocated by the process. A heap analysis tool may then be run on the objects copied into the file.
摘要:
An elevated containment structure in the shape of a wafer edge ring surrounding a surface of a semiconductor wafer is disclosed, as well as methods of forming and using such a structure. In one embodiment, a wafer edge ring is formed using a stereolithography (STL) process. In another embodiment, a wafer edge ring is formed with a spin coating apparatus provided with a wafer edge exposure (WEE) system. In further embodiments, a wafer edge ring is used to contain a liquid over a wafer active surface during a processing operation. In one embodiment, the wafer edge ring contains a liquid having a higher refractive index than air while exposing a photoresist on the wafer by immersion lithography. In another embodiment, the wafer edge ring contains a curable liquid material while forming a chip scale package (CSP) sealing layer on the wafer.
摘要:
An elevated containment structure in the shape of a wafer edge ring surrounding a surface of a semiconductor wafer is disclosed, as well as methods of forming and using such a structure. In one embodiment, a wafer edge ring is formed using a stereolithography (STL) process. In another embodiment, a wafer edge ring is formed with a spin coating apparatus provided with a wafer edge exposure (WEE) system. In further embodiments, a wafer edge ring is used to contain a liquid over a wafer active surface during a processing operation. In one embodiment, the wafer edge ring contains a liquid having a higher refractive index than air while exposing a photoresist on the wafer by immersion lithography. In another embodiment, the wafer edge ring contains a curable liquid material while forming a chip scale package (CSP) sealing layer on the wafer.
摘要:
The present invention relates generally to electronic commerce, and more particularly, to a method and system for performing electronic commerce over the Internet.
摘要:
A heap analyzer that processes a snapshot of the heap contained in a dump file is described. The heap analyzer tool can be configured to relocate the pointers in the dumped heap and allow developers to examine the heap in web browser by presenting markup for displaying a heap object in the browser and rendering pointers in the object as clickable links. When a link is selected, the pointer is followed to another object and markup is generated for rendering that object with its links. Furthermore, callbacks may be provided through an application programming interface (API) to allow developers to furnish their own code for analyzing and displaying their data structures.
摘要:
A method and software for analyzing a heap is described, in which a snapshot is made of a heap, which can be later analyzed by an analysis tool when a program that had run out of memory is no longer running. In one embodiment, an object allocated by the program is accessed and copied into a file, and an address of the object allocated by the process is recorded in association with an offset in the file of the copy of the object. The copy of the object copied into the file has preferably the same size as the object allocated by the process. A heap analysis tool may then be run on the objects copied into the file.