公开(公告)号：US10119300B2

公开(公告)日：2018-11-06

申请号：US15152578

申请日：2016-05-12

Applicant: ASUSTeK COMPUTER INC.

Inventor： Chin-Hsin Yeh ,  Chien-Chin Wang ,  Chiang-Sheng Tseng ,  Te-Chuan Kuo

IPC: E05B45/06 ,  E05B49/00

Abstract: A lock including a lock cylinder, at least one sensing module and a processing unit is provided. The lock cylinder is adapted for allowing a unlocking unit to insert therein along an inserting direction. The at least one sensing module detects a movement of the lock cylinder. The processing unit electrically connected to the at least one sensing module. The sensing module generates a sensing signal to the processing unit according to the movement of the lock cylinder.

公开(公告)号：US10114427B2

公开(公告)日：2018-10-30

申请号：US15481451

申请日：2017-04-06

Applicant: ASUSTeK COMPUTER INC.

Inventor： Yao-Hsun Huang ,  Yu-Chen Lee ,  Shu-Fen Huang ,  I-Cheng Yeh ,  Jonathan Chu ,  Ming-Hung Chung

IPC: H05K7/14 ,  G06F1/20 ,  H05K1/02 ,  H05K7/20 ,  G06F1/18

Abstract: An input/output module baffle is adapted to an electronic device. The electronic device includes a motherboard and a casing. The motherboard is located inside the casing and includes a connector module. The input/output module baffle includes a fixing plate, a conductive component and a frame. The fixing plate includes a plurality of retaining clips to clamp the fixing plate on the connector module. The conductive component is located between the fixing plate and the connector module. The frame is located between the fixing plate and the casing. Moreover, a motherboard with the input/output module baffle is also disclosed herein.

公开(公告)号：US20180310424A1

公开(公告)日：2018-10-25

申请号：US15959416

申请日：2018-04-23

Applicant: ASUSTeK COMPUTER INC.

Inventor： San-Feng LIN ,  Chen-Sheng CHUNG

IPC: H05K5/04 ,  B29C45/14 ,  B32B15/04 ,  H05K5/02

CPC classification number: H05K5/04 ,  B29C45/14467 ,  B29C2045/14868 ,  B29L2031/3481 ,  B32B15/043 ,  H05K5/0217

Abstract: A method of manufacturing a clad metal casing includes the steps of arranging and connecting metallic materials with different types from each other to form a clad board; shaping the clad board; and post-process the appearance surface of the formed clad board to form the clad metal casing. The appearance surface after the post-process presents surfaces of at least two metallic materials.

公开(公告)号：US20180302886A1

公开(公告)日：2018-10-18

申请号：US15952816

申请日：2018-04-13

Applicant: ASUSTek Computer Inc.

Inventor： Li-Te Pan ,  Hsin-Hsi Tsai

IPC: H04W72/04 ,  H04L1/18

Abstract: A method and apparatus are disclosed from the perspective of a network node. In one embodiment, the method includes receiving a resource request to allocate SPS resource from a UE, wherein the resource request indicates a first logical channel. The method also allocating the UE with a first SPS resource and a second SPS resource for the first logical channel and a second logical channel associated with the first logical channel based on the resource request.

公开(公告)号：US20180299833A1

公开(公告)日：2018-10-18

申请号：US15824493

申请日：2017-11-28

Applicant: ASUSTEK COMPUTER INC.

Inventor： Yun-Tse HSIAO ,  Ding-Chia KAO ,  Ling-Ying LEE ,  Po-Hung HUANG ,  Wei-Chung HUNG ,  Huai-Hao SYU ,  Yu-Siang LING ,  Shih-Hai LIN ,  Shih-Yu LIU ,  Wei-Chun HUANG

IPC: G04B47/06 ,  G01P13/00 ,  G06N5/04

Abstract: The present disclosure provides a monitoring method, an electronic device and a non-transient computer readable recording medium. The monitoring method includes the following steps: obtaining an instant sensing signal via an acceleration sensor; converting the instant sensing signal into at least one sensing parameter; and when the at least one sensing parameter satisfies one of the parameter determining rules, determining that the electronic device is in the current state defined correspondingly by the satisfied one of the parameter determining rules.

公开(公告)号：US20180294207A1

公开(公告)日：2018-10-11

申请号：US15935131

申请日：2018-03-26

Applicant: ASUSTeK COMPUTER INC.

Inventor： Yung-Ching Huang

IPC: H01L23/427 ,  H05K7/20

Abstract: A heat spreader includes a first metal cover, a second metal cover, a receiving cavity, a heat conducting block, and working fluid. The receiving cavity is formed between the first metal cover and the second metal cover, the working fluid is filled in the receiving cavity. The heat conducting block is disposed in the receiving cavity and contacted with the first metal cover and the second metal cover. The heat conducting block is corresponding to a heat source contacting area of the second metal cover. A contacting area between the heat conducting block and the second metal cover is larger than the area of the heat source contacting zone of the second metal cover.

公开(公告)号：US10085691B2

公开(公告)日：2018-10-02

申请号：US14819447

申请日：2015-08-06

Applicant: ASUSTeK COMPUTER INC.

Inventor： Tung-Ke Wu

IPC: A61B5/00 ,  A61B5/024 ,  G06F1/16

Abstract: A wearable device is provided. The wearable device includes an optical sensor and a controller. The optical sensor is adapted to emit at least one optical signal, and receive at least one reflective signal corresponding to the at least one optical signal. The at least one reflective signal includes a physiological information. The controller is coupled to the optical sensor, and includes a signal filter. The signal filter is adapted to perform a signal processing operation to the at least one reflective signal according to at least one signal processing parameter. The controller adjusts the at least one signal processing parameter of the signal filter according to the physiological information. A method of operating the wearable device is also provided.

公开(公告)号：US20180279275A1

公开(公告)日：2018-09-27

申请号：US15934602

申请日：2018-03-23

Applicant: ASUSTeK COMPUTER INC.

Inventor： Wei-Yu Chen ,  Li-Te Pan

IPC: H04W72/04 ,  H04W76/27

CPC classification number: H04W72/042 ,  H04W72/0406 ,  H04W76/14 ,  H04W76/27

Abstract: Facilitation reporting assistance information for sidelink service in wireless communications systems is described herein. In one example, a method for a mobile device comprises: entering, by the mobile device, a connected state; and transmitting, by the mobile device, a message to a network node after entering the connected state, wherein the message comprises a first indication for requesting a system information for sidelink and a second indication for requesting transmission resource for a sidelink service.

公开(公告)号：US20180277321A1

公开(公告)日：2018-09-27

申请号：US15923281

申请日：2018-03-16

Applicant: ASUSTeK COMPUTER INC.

Inventor： Yu-Kuang CHEN

IPC: H01H13/704

CPC classification number: H01H13/704 ,  H01H2207/008 ,  H01H2207/016 ,  H01H2207/018 ,  H01H2207/028 ,  H01H2209/002 ,  H01H2211/004

Abstract: A key structure having a pressing area is provided. The key structure includes a first membrane and a second membrane. A first conductive layer and a first insulation layer are sequentially disposed on a surface of the first membrane. The first insulation layer has a first opening in the pressing area, so that a part of the first conductive layer is exposed from the first opening. The second membrane is disposed opposite to the first membrane. A second conductive layer and a second insulation layer are sequentially disposed on a surface of the second membrane facing the first membrane. The second insulation layer has a second opening, which is formed corresponding to the first opening, in the pressing area, so that a part of the second conductive layer is exposed from the second opening to face the first conductive layer in the first opening.

公开(公告)号：US20180272795A1

公开(公告)日：2018-09-27

申请号：US15861812

申请日：2018-01-04

Applicant: ASUSTeK COMPUTER INC.

Inventor： Bin-Yi LIN

IPC: B44C3/02 ,  G02B3/08 ,  B29D11/00 ,  G06F1/16 ,  B44C1/18 ,  B44C3/04

CPC classification number: B44C3/025 ,  B29D11/00269 ,  B29D11/00355 ,  B29L2011/0016 ,  B32B2307/416 ,  B32B2310/0831 ,  B44C1/105 ,  B44C1/18 ,  B44C3/04 ,  B44F1/066 ,  B44F7/00 ,  G02B3/08 ,  G03B21/625 ,  G06F1/1637 ,  G06F1/1656 ,  H04M1/185 ,  H05K5/0086

Abstract: An electronic device comprises a cover and an outer casing. The cover includes a first light transmitting substrate layer and a first pattern layer. The first pattern layer is attached to bottom of the first light transmitting substrate layer and includes a plurality of first microstructure patterns. The outer casing is mounted on the cover. The outer casing includes a second light transmitting protection layer and a second pattern layer. The second light transmitting protection layer includes a first surface facing the cover. The second pattern layer is configured at the first surface of the second light transmitting protection layer. The second pattern layer includes a plurality of second microstructure patterns. The first pattern layer and the second pattern layer are superimposed to form a virtual pattern image.