公开(公告)号：US20180310424A1

公开(公告)日：2018-10-25

申请号：US15959416

申请日：2018-04-23

Applicant: ASUSTeK COMPUTER INC.

Inventor： San-Feng LIN ,  Chen-Sheng CHUNG

IPC: H05K5/04 ,  B29C45/14 ,  B32B15/04 ,  H05K5/02

CPC classification number: H05K5/04 ,  B29C45/14467 ,  B29C2045/14868 ,  B29L2031/3481 ,  B32B15/043 ,  H05K5/0217

Abstract: A method of manufacturing a clad metal casing includes the steps of arranging and connecting metallic materials with different types from each other to form a clad board; shaping the clad board; and post-process the appearance surface of the formed clad board to form the clad metal casing. The appearance surface after the post-process presents surfaces of at least two metallic materials.

公开(公告)号：US20180132378A1

公开(公告)日：2018-05-10

申请号：US15795474

申请日：2017-10-27

Applicant: ASUSTeK COMPUTER INC.

Inventor： Yu-Chun CHOU ,  San-Feng LIN ,  Yuan-An HSU ,  Shih-Wen CHIANG ,  Cheng-An HO ,  Zheng-Cheng LIN ,  Yi-Wei HSU

IPC: H05K7/20 ,  G06F1/20 ,  H05K5/02

CPC classification number: H05K7/20127 ,  G01D5/56 ,  G01D5/58 ,  G06F1/166 ,  G06F1/203 ,  H05K5/0213

Abstract: An electronic device, comprises: a base including a top surface and a bottom surface; a baseplate, a side edge of the baseplate is pivotally connected with the bottom surface, a moving member disposed in the base and configured to push against the baseplate; a linkage member disposed in the base and configured to push against the moving member; and a push member disposed in the base, the push member makes the baseplate moved via the linkage member and the moving member in sequence to make the baseplate selectively cover the bottom surface or detached from the bottom surface.

公开(公告)号：US20180239395A1

公开(公告)日：2018-08-23

申请号：US15900349

申请日：2018-02-20

Applicant: ASUSTEK COMPUTER INC.

Inventor： San-Feng LIN ,  Yen-Yu CHEN

IPC: G06F1/16 ,  H05K5/04

CPC classification number: G06F1/1656 ,  G06F1/1616 ,  G06F1/1637 ,  G06F1/1662 ,  H05K5/0017 ,  H05K5/04

Abstract: A casing assembly of an electronic device is provided. The casing assembly of the electronic device is configured to connect a connecting assembly. The connecting assembly comprises a metal casing; and an injection-molded frame. The injection-molded frame includes a first surface and a second surface, the first surface is fixed to the metal casing, and the second surface is configured with a plurality of connecting structures. The connecting structures are fixed to the connecting assembly, and the connecting assembly is assembled to the metal casing via the connecting structures.