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公开(公告)号：US11160164B2
公开(公告)日：2021-10-26
申请号：US16831902
申请日：2020-03-27
申请人： IBIDEN CO., LTD.
摘要： A wiring substrate includes a core layer, first conductor layers including first inner, outer and intermediate conductor layers, second conductor layers including second inner, outer and intermediate conductor layers, interlayer insulating layers interposed between the first conductor layers and between the second conductor layers, and via conductors formed in the core layer such that each via conductor decreases in diameter from one of the inner conductor layers toward the other one of the inner conductor layers and that the other one of the inner conductor layers has thickness greater than thickness of the one of the inner conductor layers. The first and/or second inner conductor layers includes a first laminated structure including metal foil and plating film layers, the first and/or second outer conductor layers includes the first laminated structure, and the first and/or second intermediate conductor layers includes a second laminated structure including metal foil and plating film layers.
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公开(公告)号：US20210298178A1
公开(公告)日：2021-09-23
申请号：US17184865
申请日：2021-02-25
申请人： IBIDEN CO., LTD.
发明人： Satoru KAWAI , Yasuki KIMISHIMA
摘要： An inductor built-in substrate includes a core substrate having an opening and a first through hole formed therein, a magnetic resin filling the opening and having a second through hole formed therein, a first through-hole conductor including a metal film formed in the first through hole, and a second through-hole conductor including a metal film formed in the second through hole. The core substrate and the magnetic resin are formed such that a surface in the first through hole has a roughness that is larger than a roughness of a surface in the second through hole.
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公开(公告)号：US20210259107A1
公开(公告)日：2021-08-19
申请号：US17132376
申请日：2020-12-23
申请人： IBIDEN CO., LTD.
发明人： Yasuki KIMISHIMA , Satoru KAWAI
摘要： A wiring substrate includes an insulating layer having through holes, a first conductor layer formed on first surface of the insulating layer, a second conductor layer formed on second surface of the insulting layer on the opposite side, and interlayer connection conductors formed in the through holes through the insulating layer and connecting the first and second conductor layers. The insulating layer is formed such that the though holes include first and second groups of through holes and that the through holes in the second group have inner walls covered with non-conductive resin, and the interlayer conductors includes first interlayer conductors each including a plating film formed in the first group of through holes, and second interlayer conductors each including a plating film formed in the second group of through holes such that minimum distance between the second interlayer conductors is smaller than minimum distance between the first interlayer conductors.
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公开(公告)号：US20210259106A1
公开(公告)日：2021-08-19
申请号：US17161737
申请日：2021-01-29
申请人： IBIDEN CO., LTD.
发明人： Shota TACHIBANA
摘要： A printed wiring board includes resin insulating layers including an outermost resin insulating layer, conductor layers laminated on the resin insulating layers, a copper layer formed in the outermost insulating layer, and metal bumps formed on the copper layer such that the bumps have upper surfaces protruding from the outermost insulating layer and that each metal bump includes Ni film, Pd film and Au film. The copper layer is reduced in diameter toward upper surface side such that the copper layer has upper and bottom surfaces and each upper surface has diameter that is smaller than diameter of each bottom surface, the outermost insulating layer has cylindrical sidewalls formed such that at least part of the copper layer is not in contact with the sidewalls, and the bumps are formed such that the Ni film is filling spaces between the copper layer and the sidewalls of the outermost insulating layer.
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公开(公告)号：US20210257224A1
公开(公告)日：2021-08-19
申请号：US17159619
申请日：2021-01-27
申请人： IBIDEN CO., LTD.
发明人： Kazuhiko KURANOBU , Tomoya DAIZO
IPC分类号： H01L21/48 , H01L23/498
摘要： A manufacturing method of a wiring substrate includes forming an interlayer insulating layer on a substrate, forming a metal film on a surface of the insulating layer such that the metal film covers the surface of the insulating layer, etching a surface of the metal film on the opposite side with respect to the insulating layer such that the surface of the metal film is roughened, forming a dry film on the roughened surface of the metal film such that the dry film has an opening formed in the dry film, forming an electrolytic plating film in the opening using the metal film as a power feeding layer, removing the dry film from the metal film, and removing part of the metal film exposed from the plating film by the dry film removing such that the part of the metal film is removed from the surface of the insulating layer.
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公开(公告)号：US20210195748A1
公开(公告)日：2021-06-24
申请号：US17123756
申请日：2020-12-16
申请人： IBIDEN CO., LTD.
发明人： Satoru Kawai , Yasuki Kimishima
摘要： An inductor built-in substrate includes a core substrate having openings and first through holes formed therein, a magnetic resin filling the openings and having second through holes formed therein, first through-hole conductors formed in the first through holes respectively such that each of the first through-hole conductors includes an electroless plating film and an electrolytic plating film, and second through-hole conductors formed in the second through holes respectively such that each of the second through-hole conductors includes an electroless plating film and an electrolytic plating film. The first through-hole conductors and the second through-hole conductors are formed such that a thickness of the electroless plating film in the first through-hole conductors is larger than a thickness of the electroless plating film in the second through-hole conductors.
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公开(公告)号：US20210153350A1
公开(公告)日：2021-05-20
申请号：US17096299
申请日：2020-11-12
申请人： IBIDEN CO., LTD.
发明人： Katsuyoshi YAMASAKI
摘要： A wiring substrate includes an insulating layer, and a conductor layer formed on the insulating layer and including a mesh-like conductor pattern and conductor pads such that the mesh-like conductor pattern has openings exposing the insulating layer and that the conductor pads are formed at substantially centers of selected ones or all of the openings respectively. The conductor layer is formed such that each of the openings has a polygonal shape, that gaps are formed between the conductor pads and the conductor pattern surrounding the conductor pads, and that each of the conductor pads has a curved outer edge.
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公开(公告)号：US20210136914A1
公开(公告)日：2021-05-06
申请号：US17080898
申请日：2020-10-27
申请人： IBIDEN CO., LTD.
发明人： Satoru KAWAI
IPC分类号： H05K1/11
摘要： A printed wiring board includes a base insulating layer, a conductor layer formed on the base insulating layer and having a conductor pad, a solder resist layer formed on the base insulating layer such that the solder resist layer is covering the conductor layer and has an opening exposing the conductor pad in the conductor layer, and a bump formed on the conductor pad of the conductor layer and including a base plating layer formed in the opening of the solder resist layer, an intermediate layer formed on the base plating layer, and a top plating layer formed on the intermediate layer such that that the base plating layer has a side surface exposed from the solder resist layer and that the intermediate layer has a side surface protruding from the side surface of the base plating layer.
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公开(公告)号：US10989092B2
公开(公告)日：2021-04-27
申请号：US16745217
申请日：2020-01-16
摘要： The present invention provides a honeycomb structured body containing a ceria-zirconia composite oxide and being less susceptible to ring-off cracking. The honeycomb structured body of the present invention includes a honeycomb fired body in which multiple through-holes are arranged longitudinally in parallel with one another with a partition wall therebetween, wherein the honeycomb fired body contains ceria-zirconia composite oxide particles and inorganic fibers, and a b-axis thermal expansion coefficient measured in a direction along a b-axis representing a direction perpendicular to a longitudinal direction of the honeycomb structured body is higher than an a-axis thermal expansion coefficient measured in a direction along an a-axis representing the longitudinal direction of the honeycomb structured body.
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公开(公告)号：US10986729B2
公开(公告)日：2021-04-20
申请号：US16829675
申请日：2020-03-25
申请人： IBIDEN CO., LTD.
IPC分类号： H05K1/11
摘要： A wiring substrate includes a core layer, first conductor layers including first inner, outer and intermediate conductor layers, second conductor layers including second inner, outer and intermediate conductor layers, and interlayer insulating layers interposed between the first conductor layers and between the second conductor layers. The first and/or second inner conductor layers has a first laminated structure including metal foil and plating film layers and includes first conductor pattern having a side surface curved toward inner side of the first pattern, the first and/or second outer conductor layers has the first laminated structure and includes the first conductor pattern having the side surface curved toward the inner side of the first pattern, and the first and/or second intermediate conductor layers has a second laminated structure including metal foil and plating film layers and includes second conductor pattern having a side surface curved toward outer side of the second pattern.
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