公开(公告)号：US20250024609A1

公开(公告)日：2025-01-16

申请号：US18713272

申请日：2022-11-28

Applicant: Resonac Corporation

Inventor： Masashi OHKOSHI ,  Yuka ITOH ,  Shunsuke TAKAGI ,  Kunihiko AKAI ,  Nozomu TAKANO ,  Hiroyuki IZAWA ,  Daisuke FUJIMOTO ,  Tomohiko KOTAKE

IPC: H05K3/38

Abstract: A wiring-forming member 1 includes an adhesive layer 10 containing conductive particles 12, and a metal layer 20 disposed on the adhesive layer 10. The adhesive layer 10 includes a first adhesive layer 15 containing the conductive particles 12 and an adhesive component, and a second adhesive layer 16 containing an adhesive component.

公开(公告)号：US20250011261A1

公开(公告)日：2025-01-09

申请号：US18697946

申请日：2022-08-17

Applicant: RESONAC CORPORATION

Inventor： Kazuma TAKAHASHI ,  Tomokazu SUGAWARA ,  Shinichi YOROZUYA ,  Kouji OGAWA ,  Yoshimasa MURAYAMA ,  Kazunari KAGA

IPC: C07C17/23

Abstract: Provided is a method for producing hexafluoro-1,3-butadiene capable of producing hexafluoro-1,3-butadiene at a high yield. The method for producing hexafluoro-1,3-butadiene includes a reaction step of performing dechlorination in which chlorine atoms are eliminated from 1,2,3,4-tetrachlorohexafluorobutane in a reaction solution containing the 1,2,3,4-tetrachlorohexafluorobutane, zinc, at least one of an antioxidant and a polymerization inhibitor, and an organic solvent to yield hexafluoro-1,3-butadiene.

公开(公告)号：US20250006574A1

公开(公告)日：2025-01-02

申请号：US18705992

申请日：2021-11-05

Applicant: Resonac Corporation

Inventor： Takahiro KURODA ,  Kohei TANIGUCHI ,  Hiroki HASHIMOTO ,  Yoshinobu OZAKI ,  Keisuke OKAWARA

IPC: H01L23/29 ,  H01L21/56 ,  H01L23/31 ,  H01L23/488

Abstract: A method for producing a reinforced semiconductor chip includes disposing a film having at least a thermosetting resin layer on a surface of a single-layer or multilayer semiconductor chip. A semiconductor device includes a substrate, a single-layer or multilayer semiconductor chip disposed on the substrate, and a cured product of a film including at least a thermosetting resin layer, the cured product being disposed on a surface of the semiconductor chip.

公开(公告)号：US20250005451A1

公开(公告)日：2025-01-02

申请号：US18694641

申请日：2022-09-28

Applicant: Resonac Corporation

Inventor： Haein LEE ,  Takuya MINAMI ,  Yoshishige OKUNO

IPC: G06N20/00

Abstract: A composition search method for a material includes constructing a prediction model by learning training data in which information related to a composition of a material is set as an explanatory variable and a value of a physical property of the material is set as an objective variable; calculating a predicted value of the physical property by inputting, into the prediction model, prediction data for newly searching for a composition; calculating an influence degree of each explanatory variable on prediction by using the training data and the prediction model; calculating a weighted distance of the prediction data with respect to the training data by using the influence degree; and displaying a relationship between the predicted value and the weighted distance, and outputting corresponding prediction data as a search candidate.

公开(公告)号：US20250004369A1

公开(公告)日：2025-01-02

申请号：US18703643

申请日：2022-10-24

Applicant: Resonac Corporation

Inventor： Shiho TANAKA ,  Keishi ONO

IPC: G03F7/033 ,  G03F7/031

Abstract: A photosensitive resin composition containing (A) a binder polymer, (B) a photopolymerizable compound, and (C) a photopolymerization initiator, in which the component (B) includes a polyfunctional compound having three or more ethylenically unsaturated bonds, and in a case where development is performed after exposing a layer (thickness 25 μm) of the photosensitive resin composition at a wavelength of 405 nm using a 41-step tablet (concentration region 0.00 to 2.00, concentration step 0.05, tablet size 20 mm×187 mm, each step size 3 mm× 12 mm), an exposure dose providing 15 steps as the number of remaining steps is 30 mJ/cm2 or less.

公开(公告)号：US20250002441A1

公开(公告)日：2025-01-02

申请号：US18694549

申请日：2022-10-24

Applicant: Resonac Corporation

Inventor： Shintaro ITAGAKI ,  Takuro SASAKI ,  Yasuhiro HOSOGI ,  Yasuhiro IWAMA

IPC: C07C67/04 ,  B01J21/08 ,  B01J23/652 ,  B01J37/02

Abstract: A method for producing ethyl acetate by reacting ethylene with acetic acid is provided in which side reactions are inhibited from proceeding and a continuous stable operation is possible over a long period. The method for producing ethyl acetate comprises reacting ethylene with acetic acid in the presence of a catalyst comprising a support and, fixed thereto, a heteropolyacid or a salt thereof, the catalyst having a palladium concentration in the range of 0.1-14 mass ppb.

公开(公告)号：US12183656B2

公开(公告)日：2024-12-31

申请号：US17818044

申请日：2022-08-08

Applicant: RESONAC CORPORATION

Inventor： Mika Kobune ,  Michiaki Yajima

IPC: H01L23/367 ,  H01L21/48 ,  H01L23/373

Abstract: A method of manufacturing a semiconductor device includes adhering together a heat dissipating body and a plurality of heat generating bodies via a thermally conductive sheet, by applying pressure to the heat dissipating body and the plurality of heat generating bodies in a thickness direction of the thermally conductive sheet with the thermally conductive sheet disposed therebetween, the thermally conductive sheet having a compression modulus of 1.40 MPa or less under a compressive stress of 0.10 MPa at 150° C.

公开(公告)号：US20240429438A1

公开(公告)日：2024-12-26

申请号：US18687573

申请日：2022-08-24

Applicant: Resonac Corporation

Inventor： Ryosuke SEI ,  Kunchan LEE

IPC: H01M10/0562 ,  C01B35/14 ,  H01M10/0525

Abstract: A lithium ion conductive solid electrolyte material, a lithium ion conductive solid electrolyte, a method for producing the same, or an all-solid-state battery; and the method for producing a lithium ion conductive solid electrolyte material having a crystal structure based on LiTa2PO8 and having at least Li, Ta, P, O, and Zr as constituent elements. The method includes a primary pulverization step of pulverizing a raw material to obtain a primary pulverized product, a firing step of firing the primary pulverized product to obtain a primary fired product, and a secondary pulverization step of pulverizing the primary fired product by using a ball mill to obtain a lithium ion conductive solid electrolyte material.

公开(公告)号：US20240428895A1

公开(公告)日：2024-12-26

申请号：US18686512

申请日：2022-08-31

Applicant: Resonac Corporation

Inventor： Takuya MINAMI ,  Naoki HASHIZUME

IPC: G16C20/30 ,  G16C20/40

Abstract: A compound safety prediction device includes an input unit for inputting the structural formula of at least one molecule, a safety prediction unit for predicting a safety evaluation of the molecule and computing a confidence score level of the prediction, a similar molecule data searching unit for acquiring the safety evaluation data of a similar molecule similar to the molecule, and an output unit for outputting the result of prediction of the safety evaluation of the molecule, the confidence score level of the prediction, and the safety evaluation data of the similar molecule.

公开(公告)号：US20240424614A1

公开(公告)日：2024-12-26

申请号：US18575136

申请日：2022-07-04

Applicant: Resonac Corporation

Inventor： Hideo NAKAKO ,  Yoshinori EJIRI ,  Toshiaki TANAKA ,  Dai ISHIKAWA ,  Michiko NATORI

IPC: B23K35/02 ,  B22F1/052 ,  B22F1/068 ,  B22F7/06 ,  B23K35/30 ,  H01L23/00

Abstract: A metal paste for bonding contains metal particles, a dispersion medium, and a sintering accelerator, the metal particles contain copper particles, the sintering accelerator includes a coordinating compound having electron back donation properties, and the coordinating compound is at least one type selected from the group consisting of a nitrogen-containing aromatic heterocyclic compound, an acetylene derivative, an ethylene derivative, an organic arsenic compound, and a cyanide.