Abstract:
A field effect transistor comprises a gate electrode contact of a highly conductive material that contacts the gate electrode and extends in the transistor width dimension at least along a portion of the channel. Thus, the gate resistance and the gate signal propagation time for a voltage applied to the gate contact is significantly reduced even for devices with an extremely down scaled gate length. Moreover, a method for fabricating the above FET is disclosed.
Abstract:
A method is disclosed in which a low-resistance portion of the gate electrode of a transistor is formed independently of the formation of low-resistance portions in the drain and source regions. Accordingly, the device features a thick low-resistance portion in the gate electrode, for example, a thick gate silicide for supporting low gate delays by minimizing the gate resistance, and a thin low-resistance portion in the drain and source in order to meet the requirements for shallow junction integration. Moreover, a transistor is disclosed having a low-resistance gate electrode portion, the composition of which is different from the low-resistance portion of the drain and source.