Method of manufacturing floating structure
    61.
    发明授权
    Method of manufacturing floating structure 失效
    浮动结构制造方法

    公开(公告)号:US07361524B2

    公开(公告)日:2008-04-22

    申请号:US11341613

    申请日:2006-01-30

    申请人: Seok-jin Kang

    发明人: Seok-jin Kang

    IPC分类号: H01L21/00

    CPC分类号: B81C1/0015 B81C2201/019

    摘要: A method of manufacturing a floating structure capable of providing increased device yield. The method includes: a) forming an insulation film, a predetermined area of which is removed, between a first substrate and a second substrate; and b) forming a floating structure in the removed predetermined area.

    摘要翻译: 制造能够提高器件产量的浮动结构的方法。 该方法包括:a)在第一基板和第二基板之间形成预定区域被除去的绝缘膜; 以及b)在去除的预定区域中形成浮动结构。

    Method of manufacturing coil
    62.
    发明申请
    Method of manufacturing coil 审中-公开
    制造线圈的方法

    公开(公告)号:US20080090372A1

    公开(公告)日:2008-04-17

    申请号:US11785146

    申请日:2007-04-16

    IPC分类号: H01L21/20

    摘要: A method of manufacturing a coil for a micro-actuator. The method of manufacturing a coil for a micro-actuator includes preparing a substrate, forming a plurality of trenches for forming a coil on the substrate, covering portions on the substrate with a masking layer except for the plurality of trenches, electroplating the plurality of trenches with a conductive material, and forming a passivation layer on the substrate. Consistent with the method, variations in sections of a coil can be reduced by minimizing bending and warping of a wafer, and therefore a driving current applied to a coil and power consumption can be reduced.

    摘要翻译: 一种制造用于微致动器的线圈的方法。 制造微致动器用线圈的方法包括:准备基板,在基板上形成多个用于形成线圈的沟槽,用除了多个沟槽之外的掩模层覆盖基板上的部分,对多个沟槽进行电镀 具有导电材料,并在基底上形成钝化层。 与该方法一致,可以通过使晶片的弯曲和翘曲最小化来减小线圈的截面的变化,因此可以降低施加到线圈的驱动电流和功率消耗。

    METHOD OF FORMING DECOUPLED COMB ELECTRODES BY SELF-ALIGNMENT ETCHING
    63.
    发明申请
    METHOD OF FORMING DECOUPLED COMB ELECTRODES BY SELF-ALIGNMENT ETCHING 审中-公开
    通过自对准蚀刻形成分解的电极的方法

    公开(公告)号:US20070287231A1

    公开(公告)日:2007-12-13

    申请号:US11733791

    申请日:2007-04-11

    IPC分类号: H01L21/84

    摘要: A method of etching decoupled comb electrodes by self-alignment is provided The etching method is a self-alignment etching method for forming upper comb electrodes in a first silicon layer of a silicon on insulator (SOI) substrate and lower comb electrodes in a second silicon layer of the SOI substrate. The self-alignment etching method includes forming a first metal mask on the first silicon layer so as to cover portions of the first silicon layer where the upper comb electrodes are to be formed, forming a first photoresist (PR) mask on the first metal mask and portions of the first silicon layer corresponding to the lower comb electrodes, selectively etching the first silicon layer using the first PR mask as an etch barrier layer, selectively etching an insulating layer of the SOI substrate using the first PR mask as an etch barrier layer, selectively etching the second silicon layer of the SOI substrate using the first PR mask as an etch barrier layer, forming a second PR mask on portions of the second silicon layer corresponding to the upper comb electrodes, forming a second metal mask entirely on an exposed bottom surface of the second silicon layer including the second PR mask, removing the first and second PR masks, and etching the first and second silicon layers using the remaining first and second metal masks so as to form the upper comb electrodes and the lower comb electrodes.

    摘要翻译: 提供了通过自对准来蚀刻去耦合梳状电极的方法。蚀刻方法是用于在绝缘体上硅(SOI)衬底的第一硅层中形成上梳状电极的自对准蚀刻方法和在第二硅中的下梳状电极 SOI衬底层。 自对准蚀刻方法包括在第一硅层上形成第一金属掩模以覆盖将要形成上梳状电极的第一硅层的部分,在第一金属掩模上形成第一光致抗蚀剂(PR)掩模 并且第一硅层对应于下梳状电极的部分,使用第一PR掩模选择性地蚀刻第一硅层作为蚀刻阻挡层,使用第一PR掩模作为蚀刻阻挡层选择性地蚀刻SOI衬底的绝缘层 使用第一PR掩模作为蚀刻阻挡层选择性地蚀刻SOI衬底的第二硅层,在对应于上梳状电极的第二硅层的部分上形成第二PR掩模,完全在暴露的 第二硅层的底表面包括第二PR掩模,去除第一和第二PR掩模,以及使用rema蚀刻第一和第二硅层 在第一和第二金属掩模上形成上梳状电极和下梳状电极。

    Method and apparatus for vacuum-mounting a micro electro mechanical system on a substrate
    64.
    发明授权
    Method and apparatus for vacuum-mounting a micro electro mechanical system on a substrate 失效
    将微机电系统真空安装在基板上的方法和装置

    公开(公告)号:US07172916B2

    公开(公告)日:2007-02-06

    申请号:US10701552

    申请日:2003-11-06

    IPC分类号: H01L21/00

    CPC分类号: B81C1/00285

    摘要: A method and apparatus for vacuum-mounting at least one micro electro mechanical system (MEMS) on a substrate includes a gas injecting section for injecting an inert gas into a vacuum chamber; a substrate aligning section for aligning a semiconductor substrate and a cover, the cover having a cavity formed therein and a getter attached to an interior surface of the cavity; a bonding section for bonding the semiconductor substrate and the cover together; and a controlling section for controlling the substrate aligning section to align the semiconductor and the cover, for controlling the gas injecting section to inject the inert gas into the vacuum chamber, and for controlling the bonding section to bond the semiconductor substrate and the cover together after the inert gas is injected.

    摘要翻译: 用于真空安装至少一个微机电系统(MEMS)在基板上的方法和装置包括用于将惰性气体注入真空室的气体注入部分; 用于对准半导体衬底和盖的衬底对准部分,所述盖具有形成在其中的空腔和附着到腔的内表面的吸气剂; 用于将半导体衬底和盖结合在一起的接合部分; 以及控制部分,用于控制衬底对准部分以对准半导体和盖子,用于控制气体注入部分以将惰性气体注入真空室中,并且用于控制接合部分将半导体衬底和盖子结合在一起,之后 注入惰性气体。

    Backlight panel employing white light emitting diode having red phosphor and green phosphor
    66.
    发明授权
    Backlight panel employing white light emitting diode having red phosphor and green phosphor 有权
    采用具有红色荧光粉和绿色荧光粉的白色发光二极管的背光面板

    公开(公告)号:US08132952B2

    公开(公告)日:2012-03-13

    申请号:US12904219

    申请日:2010-10-14

    IPC分类号: F21V7/04

    摘要: Disclosed is a backlight panel employing a white light emitting diode. The white light emitting diode includes a blue light emitting diode chip and red and green phosphors positioned over the blue light emitting diode chip. Accordingly, since the backlighting can be performed using white light with distinct red, green and blue wavelengths, the color reproducibility can be enhanced. Further, since the white light can be implemented with a single light emitting diode, the manufacturing costs and thickness of the backlight panel can also be reduced.

    摘要翻译: 公开了采用白色发光二极管的背光面板。 白色发光二极管包括蓝色发光二极管芯片和位于蓝色发光二极管芯片上方的红色和绿色磷光体。 因此,由于可以使用具有不同的红色,绿色和蓝色波长的白光进行背光,因此可以提高颜色再现性。 此外,由于可以用单个发光二极管实现白光,因此也可以降低背光面板的制造成本和厚度。

    LIGHTING APPARATUS
    68.
    发明申请
    LIGHTING APPARATUS 有权
    照明设备

    公开(公告)号:US20110222292A1

    公开(公告)日:2011-09-15

    申请号:US12963981

    申请日:2010-12-09

    IPC分类号: F21V29/00

    摘要: Disclosed is a lighting apparatus. The lighting apparatus includes: a first and a second light emitting diode (LED) module including a plurality of LEDs disposed on one side of a substrate respectively; a heat radiating body which radiates heat from the plurality of the LEDs, includes a space for housing the first and the second LED modules, and includes an opening allowing light emitted from the plurality of the LEDs of the first and the second LED modules to be emitted; and, a reflector being disposed on the heat radiating body and reflecting the light emitted from the plurality of the LEDs of the first and the second LED modules to the opening.

    摘要翻译: 公开了一种照明装置。 照明装置包括:第一和第二发光二极管(LED)模块,分别包括设置在基板一侧的多个LED; 从多个LED辐射热的散热体包括用于容纳第一和第二LED模块的空间,并且包括允许从第一和第二LED模块的多个LED发射的光的开口为 发射 并且反射器设置在散热体上并将从第一和第二LED模块的多个LED发射的光反射到开口。

    Backlight panel employing white light emitting diode having red phosphor and green phosphor
    70.
    发明授权
    Backlight panel employing white light emitting diode having red phosphor and green phosphor 有权
    采用具有红色荧光粉和绿色荧光粉的白色发光二极管的背光面板

    公开(公告)号:US07959321B2

    公开(公告)日:2011-06-14

    申请号:US11909700

    申请日:2006-03-13

    IPC分类号: F21V9/00

    摘要: Disclosed is a backlight panel employing a white light emitting diode. The white light emitting diode includes a blue light emitting diode chip and red and green phosphors positioned over the blue light emitting diode chip. Accordingly, since the backlighting can be performed using white light with distinct red, green and blue wavelengths, the color reproducibility can be enhanced. Further, since the white light can be implemented with a single light emitting diode, the manufacturing costs and thickness of the backlight panel can also be reduced.

    摘要翻译: 公开了采用白色发光二极管的背光面板。 白色发光二极管包括蓝色发光二极管芯片和位于蓝色发光二极管芯片上方的红色和绿色磷光体。 因此,由于可以使用具有不同的红色,绿色和蓝色波长的白光进行背光,因此可以提高颜色再现性。 此外,由于可以用单个发光二极管实现白光,因此也可以降低背光面板的制造成本和厚度。