公开(公告)号：US07938659B1

公开(公告)日：2011-05-10

申请号：US12825440

申请日：2010-06-29

申请人： Yong-feng Zhu ,  Qing-liang Li ,  You-wen Liu

发明人： Yong-feng Zhu ,  Qing-liang Li ,  You-wen Liu

IPC分类号： H01R27/00

CPC分类号： H01R27/00 ,  H01R12/724 ,  H01R13/502 ,  H01R13/6594 ,  H01R2107/00

摘要： A compound connector plug is disclosed in the present invention. It has a first fixing device for fixing a first terminal set and a second terminal set, and a second fixing device for fixing a third terminal set. The first terminal set has an improved shape so that the compound connector plug can be easily produced. The two devices are connected together and enclosed by a casing. Each terminal set or the combination of terminal sets can support transmission standards, such as eSATA, USB2.0 and USB3.0. An all-in-one connector plug is provided so that no adaptor is needed if a user uses the connector for different kinds of sockets.

摘要翻译： 在本发明中公开了复合连接器插头。 它具有用于固定第一端子组和第二端子组的第一固定装置和用于固定第三端子组的第二固定装置。 第一端子组具有改进的形状，使得可以容易地制造复合连接器插头。 两个装置连接在一起并由套管包围。 每个终端机或终端机组合可以支持eSATA，USB2.0和USB3.0等传输标准。 提供一体化连接器插头，以便如果用户将连接器用于不同种类的插座，则不需要适配器。

公开(公告)号：US20110072929A1

公开(公告)日：2011-03-31

申请号：US12639205

申请日：2009-12-16

申请人： YONG FENG

发明人： YONG FENG

IPC分类号： G05G11/00

CPC分类号： B25J17/0266 ,  B25J9/0051 ,  Y10T74/20207 ,  Y10T74/2036

摘要： A moveable linkage for a parallel mechanism includes a swing arm, a four-link structure rotatably connected to the swing arm, and a plurality of pivotal shafts. The four-link structure includes a first connection shaft, a second connection shaft, a first link bracket and a second link bracket. Each of the first and second link brackets includes a first end portion and a second end portion. The first end portions of the first and second link brackets overlap and rotatably connect two ends of the first connection shaft by the pivotal shafts. The second end portions of the first and second link brackets overlap and rotatably connect two ends of the second connection shaft by the pivotal shafts.

摘要翻译： 用于并联机构的可移动联动装置包括摆臂，可旋转地连接到摆臂的四连杆结构以及多个枢转轴。 四连杆结构包括第一连接轴，第二连接轴，第一连杆支架和第二连杆支架。 第一和第二连杆支架中的每一个包括第一端部和第二端部。 第一和第二连杆支架的第一端部通过枢转轴重叠并可旋转地连接第一连接轴的两端。 第一和第二连杆支架的第二端部通过枢转轴重叠并可旋转地连接第二连接轴的两端。

公开(公告)号：US06953770B2

公开(公告)日：2005-10-11

申请号：US10333770

申请日：2002-05-10

申请人： Yong Zhao ,  Yong Feng ,  Yuan Wu ,  Takato Machi ,  Yasunori Fudamoto ,  Naoki Koshizuka ,  Masato Murakami

发明人： Yong Zhao ,  Yong Feng ,  Yuan Wu ,  Takato Machi ,  Yasunori Fudamoto ,  Naoki Koshizuka ,  Masato Murakami

IPC分类号： H01L39/12 ,  H01L39/00 ,  H01B1/02 ,  H01B12/00

CPC分类号： H01L39/125 ,  C04B35/58057 ,  C04B35/6303 ,  C04B2235/3813 ,  C04B2235/401 ,  C04B2235/404 ,  C04B2235/421 ,  C04B2235/5436 ,  C04B2235/80 ,  C04B2235/94 ,  H01L39/2487 ,  Y10S420/901 ,  Y10S428/93

摘要： The present invention relates to an MgB2-based superconductor that is easy to manufacture and well suited to mass production, and that exhibits excellent superconducting characteristics (such as a high critical current density) while still retaining the high critical temperature characteristics of MgB2. A powder mixture of magnesium, boron, and titanium is pressed into a pellet, and this product is sintered under an atmospheric pressure and other conditions (preferably at 600° C. or higher) to manufacture an MgB2-based superconductor in which titanium and/or a titanium compound are dispersed in polycrystalline MgB2. The composition of the MgB2-based superconductor is preferably adjusted to have an atomic ratio of Mg:B:Ti=x:2:y, 0.7

摘要翻译： 本发明涉及容易制造且非常适合批量生产的基于MgB 2 O 2的超导体，并且显示出优异的超导特性（例如高临界电流密度），同时仍保持高的 MgB 2的临界温度特性。 将镁，硼和钛的粉末混合物压制成颗粒，并将该产物在大气压和其他条件（优选在600℃或更高）下烧结以制备MgB 2 的超导体，其中钛和/或钛化合物分散在多晶MgB 2 2中。 优选将MgB 2 O 2基超导体的组成调整为具有Mg:B:Ti = x:2:y，0.7

公开(公告)号：US06518540B1

公开(公告)日：2003-02-11

申请号：US09332756

申请日：1999-06-14

申请人： Teng Soon Wee ,  Lian Boon Koh ,  Daming Liu ,  Yuan Yuan ,  Yong Feng Lu ,  Jui Kiat Goh ,  Kuan Teck Chang

发明人： Teng Soon Wee ,  Lian Boon Koh ,  Daming Liu ,  Yuan Yuan ,  Yong Feng Lu ,  Jui Kiat Goh ,  Kuan Teck Chang

IPC分类号： B23K2618

CPC分类号： B23K26/361

摘要： A method and apparatus for creating ablation-free visible markings on a multi-layer hard disk magnetic storage media by laser-induced deformation while maintaining the integrity of the protective carbon layer, and without destroying the multi-layered structure of the media. The apparatus includes a laser generator, a rotatable optical plate and a beamsplitter by which the fluence of the beam can be controlled without altering the power setting to the laser generator, a beam sampler for determining the fluence of the beam, and an optical plate which acts with the beamsplitter to eliminate unwanted reflection of the laser beam. The laser beam is steered by a beamsteerer to a hard disk held in a material handling unit. This technique is highly suitable for marking or labeling finished hard disks for the purposes of identification and traceability, without creating any short-term or long-term contamination problems. The corresponding storage media so marked are also claimed.

摘要翻译： 一种用于通过激光诱导变形在多层硬盘磁性存储介质上产生无消融可见标记的方法和装置，同时保持保护性碳层的完整性，并且不破坏介质的多层结构。 该装置包括激光发生器，可旋转光学板和分束器，通过该分束器可以控制光束的注量而不改变对激光发生器的功率设置，用于确定光束的光束的光束采样器和光学板， 与分束器一起作用以消除激光束的不必要的反射。 激光束被束流器转向保持在材料处理单元中的硬盘。 该技术非常适合于为了识别和追溯而进行标记或标记成品硬盘，而不会产生任何短期或长期的污染问题。 还声明了如此标记的相应存储介质。

公开(公告)号：US5961860A

公开(公告)日：1999-10-05

申请号：US456298

申请日：1995-06-01

申请人： Yong Feng Lu ,  Daniel Siu Hung Chan ,  Teck Seng Low

发明人： Yong Feng Lu ,  Daniel Siu Hung Chan ,  Teck Seng Low

IPC分类号： B08B7/00 ,  B23K26/00 ,  B23K26/03

CPC分类号： B29C37/02 ,  B08B7/0042 ,  B23K26/032 ,  B23K26/0344 ,  B23K26/0665 ,  B23K26/351

摘要： A dry process to remove mold flash on integrated circuit packages (IC packages) by using pulse, short wavelength laser irradiation. The mold remnants on the surface or in holes of the lead frame can be removed by pulse laser irradiation, with the effect of thermal expansion of lead frame metals and momentum transferring from the laser beam to the mold remnants. Compared with conventional water jet or etching processes, the new technique has high productivity and does not degrade the reliability of the IC packages, due to the fact that there is no water or chemical solutions involved in the process.

摘要翻译： 通过使用脉冲短波长激光照射，在集成电路封装（IC封装）上清除模具闪光的干法。 通过脉冲激光照射可以消除引线框架表面或孔中的模具残留，引起框架金属的热膨胀和从激光束向模具残余物转移的动量的影响。 与传统的水射流或蚀刻工艺相比，新技术具有高生产率，并且不会降低IC封装的可靠性，因为在该过程中不存在水或化学溶液。