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公开(公告)号：US20090142996A1
公开(公告)日：2009-06-04
申请号：US12292677
申请日：2008-11-24
申请人： Hozumi Yasuda , Makoto Fukushima , Tetsuji Togawa
发明人： Hozumi Yasuda , Makoto Fukushima , Tetsuji Togawa
CPC分类号： B24B37/30
摘要： A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a polishing head having at least one elastic membrane configured to form a plurality of pressure chambers for being supplied with a pressurized fluid, and a controller configured to control supply of the pressurized fluid to the pressure chambers. The controller controls supply of the pressurized fluid so that the pressurized fluid is supplied first to the pressure chamber located at a central portion of the substrate when the substrate is brought into contact with the polishing surface, and then the pressurized fluid is supplied to the pressure chamber located at a radially outer side of the pressure chamber located at the central portion of the substrate.
摘要翻译： 抛光装置用于将半导体晶片等基板研磨成平面镜面。 抛光装置包括具有抛光表面的抛光台，具有至少一个弹性膜的抛光头，所述弹性膜被构造成形成用于供应加压流体的多个压力室，以及控制器，其构造成控制加压流体供应到 压力室。 控制器控制加压流体的供给，使得当基板与抛光表面接触时，加压流体首先被供应到位于基板的中心部分处的压力室，然后将加压流体供应到压力 位于位于基板中心部分处的压力室的径向外侧的腔室。
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公开(公告)号：US20080119121A1
公开(公告)日：2008-05-22
申请号：US11987978
申请日：2007-12-06
申请人： Tetsuji Togawa , Osamu Nabeya , Makoto Fukushima , Kunihiko Sakurai , Hiroshi Yoshida , Teruhiko Ichimura
发明人： Tetsuji Togawa , Osamu Nabeya , Makoto Fukushima , Kunihiko Sakurai , Hiroshi Yoshida , Teruhiko Ichimura
CPC分类号： B24B37/30 , B24B41/061 , B24B49/105
摘要： The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus according to the present invention comprises a top ring body having a receiving space therein, and a vertically movable member which is vertically movable within the receiving space in the top ring body. An abutment member having an elastic membrane is attached to a lower surface of the vertically movable member. The elastic membrane of the abutment member comprises an abutment portion, having a flange projecting outwardly, brought into direct or indirect contact with the substrate, and a connecting portion extending upwardly from a base portion of the flange of the abutment portion and being connected to the vertically movable member. The connecting portion is made of a material having a flexibility higher than that of material of the abutment portion.
摘要翻译： 本发明涉及一种用于将基板（例如半导体晶片）保持在用于将基板抛光到抛光装置的平面光洁度的基板保持装置。 根据本发明的基板保持装置包括其中具有容纳空间的顶环主体和可在顶环体中的容纳空间内垂直移动的可垂直移动的构件。 具有弹性膜的邻接构件附接到可垂直移动构件的下表面。 邻接构件的弹性膜包括邻接部分，其具有向外突出的凸缘，与基底直接或间接接触;以及连接部分，其从邻接部分的凸缘的基部向上延伸并连接到 垂直活动件。 连接部由具有高于邻接部的材料的柔软性的材料制成。
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公开(公告)号：US07357699B2
公开(公告)日：2008-04-15
申请号：US10543546
申请日：2004-02-04
IPC分类号： B24B7/22
摘要： A substrate holding apparatus is for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus comprises a vertically movable member, and an elastic member for defining a chamber. The elastic member comprises a contact portion which is brought into contact with the substrate, and a circumferential wall extending upwardly from the contact portion and connected to the vertically movable member. The circumferential wall has a stretchable and contractible portion which is stretchable and contractible vertically.
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公开(公告)号：US07163895B2
公开(公告)日：2007-01-16
申请号：US10481019
申请日：2003-04-17
申请人： Tetsuji Togawa , Makoto Fukushima , Kunihiko Sakurai , Hiroshi Yoshida , Osamu Nabeya , Teruhiko Ichimura
发明人： Tetsuji Togawa , Makoto Fukushima , Kunihiko Sakurai , Hiroshi Yoshida , Osamu Nabeya , Teruhiko Ichimura
IPC分类号： H01L21/302
CPC分类号： B24B37/30 , B24B37/013 , B24B37/042 , H01L21/30625 , Y10S438/977
摘要： The present invention is relates to a polishing method for polishing a semiconductor wafer (W) by pressing the semiconductor wafer (W) against a polishing surface (10) with use of a top ring (23) for holding the semiconductor wafer (W). A pressure chamber (70) is defined in the top ring (23) by attaching an elastic membrane (60) to a lower surface of a vertically movable member (62). The semiconductor wafer (W) is polished while a pressurized fluid is supplied to the pressure chamber (70) so that the semiconductor wafer (W) is pressed against the polishing surface (10) by a fluid pressure of the fluid. The semiconductor wafer (W) which has been polished is released from the top ring (23) by ejecting the pressurized fluid from an opening (62a) defined centrally in the vertically movable member (62).
摘要翻译： 本发明涉及通过使用用于保持半导体晶片（W）的顶环（23）将半导体晶片（W）压靠在研磨面（10）上来研磨半导体晶片（W）的研磨方法。 通过将弹性膜（60）附接到可垂直移动的构件（62）的下表面，将压力室（70）限定在顶环（23）中。 抛光半导体晶片（W），同时向压力室（70）供应加压流体，使得半导体晶片（W）通过流体的流体压力被压靠在抛光表面（10）上。 已经被抛光的半导体晶片（W）通过从限定在可垂直移动部件（62）中心的开口（62a）喷射加压流体而从顶环（23）释放。
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公开(公告)号：US20060199479A1
公开(公告)日：2006-09-07
申请号：US10543546
申请日：2004-02-04
IPC分类号： B24B1/00
摘要： The present invention relates to a substrate holding apparatus for holding a substrate (W) such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. A substrate holding apparatus comprises a vertically movable member (6), and an elastic member (7) for defining a chamber (22). The elastic member (7) comprises a contact portion (8) which is brought into contact with the substrate (W), and a circumferential wall (9) extending upwardly from the contact portion (8) and connected to the vertically movable member (6). The circumferential wall (9) has a stretchable and contractible portion (40) which is stretchable and contractible vertically.
摘要翻译： 本发明涉及一种用于将基板（W）例如半导体晶片保持在用于将基板抛光到抛光装置的平面光洁度的基板保持装置。 基板保持装置包括可垂直移动的构件（6）和用于限定腔室（22）的弹性构件（7）。 弹性构件（7）包括与基板（W）接触的接触部分（8）和从接触部分（8）向上延伸并连接到可垂直移动的部件（6）的周壁（9） ）。 周壁（9）具有可伸缩的部分（40），其可垂直伸缩。
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公开(公告)号：US5762435A
公开(公告)日：1998-06-09
申请号：US681360
申请日：1996-07-23
申请人： Makoto Fukushima
发明人： Makoto Fukushima
CPC分类号： B43K23/124
摘要： A writing instrument includes a body, a writing tip projected from a tip end of the body, an ink supplying mechanism having low-viscosity ink contained therein for supplying the ink to the writing tip, the ink supplying mechanism being incorporated in the body and connected to the writing tip, and at least one ventilating clearance provided between the writing tip and the tip end of the body for facilitating the supplying of the ink to the writing tip. A cap for the writing instrument includes a cap body and a seal member provided in the cap body, the seal member being formed of elastic material. When the writing instrument is coupled with the cap, the seal member is tightly fitted on the tip end of the writing instrument body, whereby the writing tip and the ventilating clearances are completely sealed by the seal member.
摘要翻译： 一种书写工具，包括：本体，从本体的顶端突出的书写尖端;墨水供给机构，其中容纳有用于将墨水供应到书写尖端的低粘度墨水，所述墨水供应机构结合在本体中并连接 并且至少有一个设置在书写尖端和本体前端之间的通风间隙，以便于将油墨供应到书写尖端。 用于书写工具的盖包括盖体和设置在盖体中的密封构件，密封构件由弹性材料形成。 当书写工具与盖结合时，密封构件紧密地装配在书写工具主体的顶端上，由此书写用尖端和通风间隙被密封构件完全密封。
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公开(公告)号：US5208079A
公开(公告)日：1993-05-04
申请号：US888892
申请日：1992-05-26
申请人： Makoto Fukushima , Kikuo Takizawa
发明人： Makoto Fukushima , Kikuo Takizawa
CPC分类号： C23C14/16 , C23C14/0635 , C23C14/0641
摘要： There is provided a process for improving the resistance to corrosion of stainless steel by ion plating process, the process comprising coating a component-adjusted stainless steel having an Mn/S ratio of less than 100 as substrate with a Ti-layer for surface preparation, coating directly the resulting Ti-layer or indirectly a TiC-layer, which has been coated onto the Ti-layer in advance as intermediate, with a TiN-layer in a total thickness of 1 to 3 .mu.m.The TiN-coated stainless steel according to the present invention may be widely used as corrosion-resistant metallic materials for preparing articles which can be employed under wet conditions such as tableware.
摘要翻译： 提供了一种通过离子镀处理来提高不锈钢的耐腐蚀性的方法，该方法包括以Mn / S比小于100的组分调节的不锈钢作为基材，用于表面处理的Ti层， 直接涂覆所得到的Ti层，或间接地涂覆TiC层，TiC层预先涂覆在Ti层上，TiN层总厚度为1〜3μm。 根据本发明的TiN涂覆的不锈钢可以广泛用作用于制备可在诸如餐具的潮湿条件下使用的制品的耐腐蚀金属材料。
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