摘要:
The invention relates to compositions containing at least one solid epoxide resin A, at least one polymer B of formula (1), at least one thixotropic agent C made from a urea derivative and at least one curing agent for epoxide resins D activated by high temperatures. The compositions are particularly suitable for use as adhesives. Low-temperature impact-resistant adhesives can be produced for use in particular as structural adhesives.
摘要:
Compounds of formula (I) in the field of heat-curing and two-component epoxy resin compositions, which may be used as adhesion promoters or adhesion promoter ingredients and methods of producing such compounds. Such compounds may be prepared as liquids. A heat-curing epoxy resin composition including at least one epoxy resin with more than one epoxy group per molecule on the average; at least one curing agent for epoxy resins, which is activated by elevated temperature; and at least one compound of formula (I).
摘要:
Hybrid-functional polymers of formula (I) or formula (II), a method for their preparation and their use. The hybrid-functional polymers may have multiple functional groups. The hybrid-functional polymers may be polyisocyanate compounds with at least one other functional group and polyurethane compositions. The hybrid-functional polymers may be in compositions as well as composites fabricated using the compositions.
摘要:
Novel impact modifiers obtained by the reaction of amphiphilic block copolymers. These impact modifiers are suitable for use in thermosetting epoxy resin adhesives. The impact modifiers include a carboxylic acid group prepared from the reaction of an intramolecular anhydride of a di- or tricarboxylic acid with at least one amphiphilic block copolymer including at least one hydroxyl group. A method for adhesively binding heat-stable substrates includes applying a single-component thermosetting epoxy resin composition to the surface of a first heat-stable substrate; contacting the epoxy resin composition with the surface of second heat-stable substrate; heating the epoxy resin composition to 20-100° C.; bringing the two substrates and the epoxy resin composition into contact with a wash liquid; and heating the epoxy resin composition to 140-220° C.
摘要:
The invention relates to viscosifiers, especially terminated polymers that have functional terminal groups, said polymers being pre-extended by polyamines, polymercaptans, (poly)aminoalcohols, (poly)mercaptoalcohols or (poly)aminomercaptans and being reacted to give polymers that are terminated by other functional groups. The viscosifiers have a low content in educts or educt descendants that deteriorate the properties of compositions. They are also charaterized in that the formation of high-molecular addition products is considerably reduced or even excluded so that products obtained have low viscosity and good storage stability. The epoxy-terminated polymer of formula (I) is especially preferred.
摘要:
Viscosifiers, especially terminated polymers that have functional terminal groups, the polymers being pre-extended by polyols and being reacted to give polymers that are terminated by other functional groups, are produced. The viscosifiers have a low content in educts or educt descendants that deteriorate the properties of compositions. The formation of high-molecular addition products is considerably reduced or even excluded so that the products obtained have low viscosity and good storage stability. The epoxy-terminated polymer of formula (I) is especially preferred.
摘要:
A heat-curing epoxy resin composition that includes an epoxy resin, a curing agent, an accelerator, and an optional toughener. The epoxy resin compositions are suitable in particular for use as bodyshell adhesives and for preparation of structural foams. An accelerator of formula (I) results in increased impact strength the of heat-curing epoxy resin compositions.
摘要:
Discussed are heat-curable epoxy resin compositions containing at least one epoxy resin A with, on average, more than one epoxide group per molecule, at least one curing agent B for epoxy resins, which is activated by an increased temperature, at least one terminally blocked polyurethane prepolymer of formula (I) and at least one epoxide-terminated polyurethane prepolymer of formula (II). The epoxy resin compositions are particularly suitable for use as one-component, heat-curable adhesives and are characterized by excellent mechanical properties, high glass transition temperatures and high impact resistance.
摘要:
Disclosed are compositions containing at least one epoxy resin A with on average more than one epoxy group per molecule; at least one epoxy adduct B with on average one epoxy group per molecule; at least one thixotropic agent C, based on a urea derivative in a non-diffusing support material; and at least one curing agent D for epoxy resins, which is activated by an increased temperature. Also disclosed are compositions containing at least one core-shell polymer E and/or filler F and/or reactive diluent G.