-
公开(公告)号：US12104075B2
公开(公告)日：2024-10-01
申请号：US16467415
申请日：2017-12-11
申请人： LG CHEM, LTD.
发明人： Mi Lim Yu , Joon Hyung Kim , Yu Jin Woo , Kook Hyun Choi
IPC分类号： C09D163/00 , C08G59/22 , C08G59/24 , C09D11/101 , C09D11/30 , H10K50/844 , H10K59/80 , H10K85/10
CPC分类号： C09D163/00 , C08G59/223 , C08G59/226 , C08G59/24 , C09D11/101 , C09D11/30 , H10K50/844 , H10K59/873 , H10K85/111
摘要： The present application relates to an encapsulating composition and an organic electronic device comprising the same, and provides an encapsulating composition which can effectively block moisture or oxygen introduced into an organic electronic device from the outside to secure the lifetime of the organic electronic device, is possible to realize a top emission type organic electronic device, is applicable to an inkjet method and can maintain reliability of a sealing structure under severe conditions such as high temperature and high humidity while providing a thin display, and an organic electronic device comprising the same.
-
公开(公告)号：US12104009B2
公开(公告)日：2024-10-01
申请号：US16971307
申请日：2018-02-22
申请人： RESONAC CORPORATION
CPC分类号： C08G59/226 , C08G59/245 , C08G59/28 , C08J5/04 , C08K5/0025 , C08G2250/00
摘要： (1) An epoxy resin, which is configured to form, in a cured product of the epoxy resin, a phase-separated structure that is formed from at least two phases, wherein at least one phase of the at least two phases includes a liquid crystal structure and (2) An epoxy resin, which is configured to form a phase-separated structure in a cured product, the cured product being obtained by curing the epoxy resin by increasing a temperature of the epoxy resin from an ambient temperature to a curing temperature at a rate of not greater than 20° C./minute.
-
公开(公告)号：US11746183B2
公开(公告)日：2023-09-05
申请号：US16567480
申请日：2019-09-11
CPC分类号： C08G59/245 , C08G59/226 , C08G59/50 , C08K5/549 , C08L63/00 , C09D163/00 , C08L2207/53
摘要： In an illustrative example, one or more coating formulations may be used and may have characteristics useful in different situations. During evaluations, a plurality of coating formulations comprising epoxy resins and diamine hardeners were prepared and evaluated with regards to impact ice adhesion strength and durability. Alone, such coating formulations provided a significantly reduced impact ice adhesion strength as compared to uncoated aluminum and/or stainless steel surfaces. However, a durability of the coatings, when applied to aluminum or stainless steel surfaces, was insufficient to be considered for use on external aircraft surfaces. By including nano-sized and/or micro-sized particles as additives to the coating formulations, resulted in improved durability without significantly reducing ice adhesion performance of the resin base.
-
公开(公告)号：US11718706B2
公开(公告)日：2023-08-08
申请号：US16980894
申请日：2019-02-22
发明人： Christian Beisele , Hubert Wilbers , Daniel Baer
CPC分类号： C08G59/226 , C08G59/42 , C08L63/00 , D21H17/52 , H01B3/52
摘要： The disclosure relates to a curable mixture for use in impregnation of paper bushings comprising a resin mixture of a bisphenol-A-diglycidylether (BADGE) and a bisphenol-F-diglycidylether (BFDGE), methyltetrahydrophthalic anhydride (MTHPA) as hardener, and an accelerator selected from the group consisting of tertiary alkylamine aminoethylalcohols and corresponding ethers thereof as well as paper bushings impregnated with such mixture and uses of such mixture.
-
公开(公告)号：US10018810B2
公开(公告)日：2018-07-10
申请号：US14424935
申请日：2013-08-22
申请人： DAICEL CORPORATION
发明人： Takashi Kubo , Hiroki Takenaka
IPC分类号： C08G59/20 , G02B13/00 , G02B1/04 , C08G59/24 , C08G59/30 , C08G59/32 , B29D11/00 , C08G59/02 , C08G59/22 , B29C39/02 , B29K63/00 , B29K83/00
CPC分类号： G02B13/0085 , B29C39/02 , B29D11/00365 , B29K2063/00 , B29K2083/00 , C08G59/02 , C08G59/226 , C08G59/24 , C08G59/306 , C08G59/3218 , C08G59/3281 , G02B1/041 , C08L63/00 , C08L83/06 , C08L83/04
摘要： An object of the present invention is to provide a curable composition that can be cured satisfactorily and can form a cured product having a high glass transition temperature as maintained and having high mechanical strength. A curable composition includes a siloxane (A), a cycloaliphatic epoxide (B), and a curing agent (C). The siloxane (A) contains at least two epoxy groups per molecule. The cycloaliphatic epoxide (B) in the curable composition is preferably a compound represented by Formula (I): wherein X is selected from a single bond and a linkage group.
-
公开(公告)号：US20180179328A1
公开(公告)日：2018-06-28
申请号：US15900851
申请日：2018-02-21
发明人： Danny Warren
IPC分类号： C08G59/02 , F16L55/164 , F16L57/00
CPC分类号： C08G59/02 , C08G59/226 , C08G59/42 , C08G59/502 , C08G59/621 , F16L55/1651 , F16L55/1654 , F16L55/1656
摘要： A resin composition and method for installing a pipe liner that allows the liner to be fully wet out with a resin and activator and stored for a period of up to six months prior to installation and curing. A method of lining a pipe with a delayed curing resin composition is also provided that includes fully wetting out a liner with a blended two part epoxy composition such that the liner can be transported in a wet out fashion, placed in a pipe to be lined and repositioned as needed without concern for the resin composition to begin curing.
-
公开(公告)号：US09994693B2
公开(公告)日：2018-06-12
申请号：US14434796
申请日：2013-10-10
发明人： Toshitaka Yoshitake , Masaki Tono , Kenji Otsuka , Hideaki Yano
IPC分类号： C08J9/00 , C08G59/22 , C08K5/3492 , C08K3/04 , C08K3/26 , C08K3/32 , C08G59/30 , C08G59/50 , C08K3/22
CPC分类号： C08K5/34928 , C08G59/226 , C08G59/308 , C08G59/504 , C08J9/0066 , C08J2363/02 , C08K3/04 , C08K3/22 , C08K3/26 , C08K3/32 , C08K2003/2241 , C08K2003/265 , C08K2003/323 , C08L2205/02 , C08L2205/03 , C08L63/00
摘要： A thermally expandable resin composition containing an epoxy resin, a thermally expandable graphite, and an inorganic filler excluding graphite. The epoxy compound contained in said epoxy resin contains a brominated epoxy compound, and contains, in addition to the brominated epoxy compound, a bisphenol-type epoxy compound and/or an aliphatic epoxy compound, wherein the weight ratio of the brominated epoxy compound to the bisphenol-type epoxy compound and/or aliphatic epoxy compound is in the range 99:1-1:99.
-
公开(公告)号：US09974172B2
公开(公告)日：2018-05-15
申请号：US14241961
申请日：2012-08-30
申请人： Hae Yeon Kim , Sung Bae Moon , Jae Man Park , Jeung Ook Park , Jong Heum Yoon , In Hee Cho
发明人： Hae Yeon Kim , Sung Bae Moon , Jae Man Park , Jeung Ook Park , Jong Heum Yoon , In Hee Cho
IPC分类号： H05K1/05 , B32B27/38 , C08L63/00 , C09J163/00 , C08K3/22 , C08G59/22 , C08G59/24 , C08G59/38 , C08L63/04 , C09K5/14
CPC分类号： H05K1/056 , C08G59/226 , C08G59/245 , C08G59/38 , C08K3/013 , C08L63/00 , C08L63/04 , C09K5/14 , C08K3/0033
摘要： An epoxy resin compound having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the thermal conductivity of the epoxy resin compound can be increased because the epoxy resin has a mesogen structure that facilitates crystallizability. In addition, a high radiant heat board can be provided by using the above-mentioned epoxy resin as an insulating material for a printed circuit board.
-
公开(公告)号：US09845416B1
公开(公告)日：2017-12-19
申请号：US15524613
申请日：2016-10-14
申请人： SAES GETTERS S.P.A.
发明人： Paolo Vacca , Marco Mudu , Jiabril Gigli
IPC分类号： C08F2/46 , C08F2/50 , C08G61/04 , C09J163/00 , C09J11/08
CPC分类号： C09J163/00 , C08G59/182 , C08G59/226 , C08G59/245 , C08L63/00 , C09J11/08
摘要： A thermally or photo curable adhesive composition containing a bisphenol F epoxy resin and a bisphenol A epoxy resin in a ratio between 2 and 10. The composition further contains at least one epoxy acrylate component and a rubber modified bisphenol. The adhesive composition is applicable by a melt or liquid coating technique and undergoes curing upon exposure to heat or radiation, showing improved viscoelastic properties and suitable to provide a cured product having superior durability.
-
公开(公告)号：US20170349794A1
公开(公告)日：2017-12-07
申请号：US15524613
申请日：2016-10-14
申请人： SAES GETTERS S.P.A.
发明人： Paolo VACCA , Marco MUDU , Jiabril GIGLI
IPC分类号： C09J163/00 , C09J11/08
CPC分类号： C09J163/00 , C08G59/182 , C08G59/226 , C08G59/245 , C08L63/00 , C09J11/08
摘要： A thermally or photo curable adhesive composition containing a bisphenol F epoxy resin and a bisphenol A epoxy resin in a ratio between 2 and 10. The composition further contains at least one epoxy acrylate component and a rubber modified bisphenol. The adhesive composition is applicable by a melt or liquid coating technique and undergoes curing upon exposure to heat or radiation, showing improved viscoelastic properties and suitable to provide a cured product having superior durability.
-
-
-
-
-
-
-
-
-
搜索结果
643 条记录 (耗时 0.019 秒)
