Semiconductor integrated circuit device and process for fabricating the
same
    64.
    发明授权
    Semiconductor integrated circuit device and process for fabricating the same 失效
    半导体集成电路器件及其制造方法

    公开(公告)号:US5652457A

    公开(公告)日:1997-07-29

    申请号:US351173

    申请日:1994-11-30

    IPC分类号: H01L27/11 H01L29/76

    摘要: Herein disclosed is a semiconductor integrated circuit device comprising a SRAM having its memory cell composed of transfer MISFETs to be controlled through word lines and drive MISFETs. The gate electrodes of the drive MISFETs and the gate electrodes of the transfer MISFETs of the memory cell, and the word lines are individually formed of different conductive layers. The drive MISFETs and the transfer MISFETs are individually arranged to cross each other in the gate length direction. The word lines are extended in the gate length direction of the gate electrodes of the drive MISFETs and caused to cross the gate electrodes of the drive MISFETs partially.The two transfer MISFETs of the memory cell have their individual gate electrodes connected with two respective word lines spaced from each other and extended in an identical direction. The region defined by the two word lines is arranged therein with the two drive MISFETs and the source lines.The source line is formed of a conductive layer identical to that of the word line. The individual data lines of the complementary data line are formed of an identical conductive layer which is different from that of the word line and the source line. The identical conductive layer between the word line and source line and the complementary data line is formed with two word lines: a main word line extended in the first direction identical to that of the word line and source line and used by adopting the divided word line system: and a sub-word line used by adopting the double word line system.

    摘要翻译: 这里公开了一种半导体集成电路器件,其包括具有其存储单元的SRAM,SRAM由通过字线控制的转移MISFET和驱动MISFET构成。 驱动MISFET的栅电极和存储单元的转移MISFET的栅电极和字线分别由不同的导电层形成。 驱动MISFET和转移MISFET分别布置成在栅极长度方向上彼此交叉。 字线在驱动MISFET的栅电极的栅极长度方向上延伸,并且部分地与驱动MISFET的栅电极交叉。 存储器单元的两个转移MISFET的各自的栅极电极与彼此间隔开并沿相同方向延伸的两个相应字线连接。 由两个字线限定的区域配置有两个驱动MISFET和源极线。 源极线由与字线的导电层相同的导电层形成。 互补数据线的各个数据线由与字线和源极线不同的导电层形成。 字线和源极线与互补数据线之间的相同的导电层由两条字线形成:主字线在第一方向上延伸,与字线和源极线相同,并通过采用分割字线 系统:采用双字线系统使用的子字线。

    Semiconductor integrated circuit device and process for manufacturing the same
    65.
    发明授权
    Semiconductor integrated circuit device and process for manufacturing the same 失效
    半导体集成电路器件及其制造方法

    公开(公告)号:US08093681B2

    公开(公告)日:2012-01-10

    申请号:US13044260

    申请日:2011-03-09

    IPC分类号: H01L29/00 H01L21/8234

    摘要: A SRAM of complete CMOS type having its memory cell composed of six MISFETs, in which a pair of local wiring lines for connecting the input/output terminals of CMOS inverters are formed of a refractory metal silicide layer formed over a first conducting layer constituting the individual gate electrodes of the drive MISFETs, the transfer MISFETs and the load MISFETs of the memory cell and in which a reference voltage line formed over the local wiring lines is arranged to be superposed over the local wiring lines to form a capacity element. Moreover, the capacity element is formed between the local wiring lines and the first conducting layer by superposing the local wiring lines over the first conducting layer. Moreover, the local wiring lines are formed by using resistance lowering means such as silicification. In addition, there are made common the means for lowering the resistance of the gate electrode of the transfer MISFETs and the means for forming the local wiring lines.

    摘要翻译: 一种完整的CMOS型SRAM,其存储单元由六个MISFET组成,其中一对用于连接CMOS反相器的输入/输出端的局部布线由难熔金属硅化物层形成,该难熔金属硅化物层形成在构成个体的第一导电层上 存储单元的驱动MISFET,转移MISFET和负载MISFET的栅极电极,其中形成在局部布线上的参考电压线被布置成叠加在局部布线上以形成电容元件。 此外,通过在第一导电层上叠加局部布线,在局部布线和第一导电层之间形成电容元件。 此外,通过使用诸如硅化的电阻降低装置来形成局部布线。 此外,公开了用于降低转移MISFET的栅电极的电阻和用于形成局部布线的装置的手段。

    Semiconductor integrated circuit device and process for manufacturing the same
    67.
    发明授权
    Semiconductor integrated circuit device and process for manufacturing the same 失效
    半导体集成电路器件及其制造方法

    公开(公告)号:US07397123B2

    公开(公告)日:2008-07-08

    申请号:US11765265

    申请日:2007-06-19

    IPC分类号: H01L23/52 H01L21/44

    摘要: A SRAM of complete CMOS type having its memory cell composed of six MISFETs, in which a pair of local wiring lines for connecting the input/output terminals of CMOS inverters are formed of a refractory metal silicide layer formed over a first conducting layer constituting the individual gate electrodes of the drive MISFETs, the transfer MISFETs and the load MISFETs of the memory cell and in which a reference voltage line formed over the local wiring lines is arranged to be superposed over the local wiring lines to form a capacity element. Moreover, the capacity element is formed between the local wiring lines and the first conducting layer by superposing the local wiring lines over the first conducting layer. Moreover, the local wiring lines are formed by using resistance lowering means such as silicification. In addition, there are made common the means for lowering the resistance of the gate electrode of the transfer MISFETs and the means for forming the local wiring lines.

    摘要翻译: 一种完整的CMOS型SRAM,其存储单元由六个MISFET组成,其中一对用于连接CMOS反相器的输入/输出端的局部布线由难熔金属硅化物层形成,该难熔金属硅化物层形成在构成个体的第一导电层上 存储单元的驱动MISFET,转移MISFET和负载MISFET的栅极电极,其中形成在局部布线上的参考电压线被布置成叠加在局部布线上以形成电容元件。 此外,通过在第一导电层上叠加局部布线,在局部布线和第一导电层之间形成电容元件。 此外,通过使用诸如硅化的电阻降低装置来形成局部布线。 此外,公开了用于降低转移MISFET的栅电极的电阻和用于形成局部布线的装置的手段。

    Semiconductor integrated circuit device and process for manufacturing the same
    68.
    发明授权
    Semiconductor integrated circuit device and process for manufacturing the same 有权
    半导体集成电路器件及其制造方法

    公开(公告)号:US07253051B2

    公开(公告)日:2007-08-07

    申请号:US11297500

    申请日:2005-12-09

    摘要: A SRAM of complete CMOS type having its memory cell composed of six MISFETs, in which a pair of local wiring lines for connecting the input/output terminals of CMOS inverters are formed of a refractory metal silicide layer formed over a first conducting layer constituting the individual gate electrodes of the drive MISFETs, the transfer MISFETs and the load MISFETs of the memory cell and in which a reference voltage line formed over the local wiring lines is arranged to be superposed over the local wiring lines to form a capacity element. Moreover, the capacity element is formed between the local wiring lines and the first conducting layer by superposing the local wiring lines over the first conducting layer. Moreover, the local wiring lines are formed by using resistance lowering means such as silicification. In addition, there are made common the means for lowering the resistance of the gate electrode of the transfer MISFETs and the means for forming the local wiring lines.

    摘要翻译: 一种完整的CMOS型SRAM,其存储单元由六个MISFET组成,其中一对用于连接CMOS反相器的输入/输出端的局部布线由难熔金属硅化物层形成,该难熔金属硅化物层形成在构成个体的第一导电层上 存储单元的驱动MISFET,转移MISFET和负载MISFET的栅极电极,其中形成在局部布线上的参考电压线被布置成叠加在局部布线上以形成电容元件。 此外,通过在第一导电层上叠加局部布线,在局部布线和第一导电层之间形成电容元件。 此外,通过使用诸如硅化的电阻降低装置来形成局部布线。 此外,公开了用于降低转移MISFET的栅电极的电阻和用于形成局部布线的装置的手段。