公开(公告)号：US06807056B2

公开(公告)日：2004-10-19

申请号：US10621647

申请日：2003-07-18

申请人： Yoshihiro Kondo ,  Shigeo Ohashi ,  Rintaro Minamitani ,  Takashi Naganawa ,  Yuji Yoshitomi ,  Masato Nakanishi ,  Yasuhiko Sasaki ,  Tsuyoshi Nakagawa ,  Osamu Suzuki ,  Shinji Matsushita ,  Yasunori Yamada

发明人： Yoshihiro Kondo ,  Shigeo Ohashi ,  Rintaro Minamitani ,  Takashi Naganawa ,  Yuji Yoshitomi ,  Masato Nakanishi ,  Yasuhiko Sasaki ,  Tsuyoshi Nakagawa ,  Osamu Suzuki ,  Shinji Matsushita ,  Yasunori Yamada

IPC分类号： H05K720

CPC分类号： H05K7/20781 ,  G06F1/20 ,  G06F2200/201

摘要： A plurality of electronic apparatuses, each apparatus having a closed loop cooling system, are installed in a cabinet having another closed loop fluid cooling system. Each of the closed loop fluid cooling systems includes a heat receiver and a pump. A projection is mounted on the electronic apparatus and a switching valve is arranged on the cabinet to stop or start circulation of a cooling fluid.

公开(公告)号：US06757169B2

公开(公告)日：2004-06-29

申请号：US10239155

申请日：2003-05-06

申请人： Yoshihiro Kondo ,  Shinji Matsushita ,  Shigeo Ohashi ,  Takashi Naganawa ,  Rintaro Minamitani ,  Tsuyoshi Nakagawa ,  Yuuji Yoshitomi ,  Masato Nakanishi ,  Hajime Katou

发明人： Yoshihiro Kondo ,  Shinji Matsushita ,  Shigeo Ohashi ,  Takashi Naganawa ,  Rintaro Minamitani ,  Tsuyoshi Nakagawa ,  Yuuji Yoshitomi ,  Masato Nakanishi ,  Hajime Katou

IPC分类号： H05K720

CPC分类号： G06F1/203 ,  G06F2200/201 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： In an electronic equipment or apparatus, having water-cooling structure able to circulate/supply a cooling liquid with stability, for dealing with an increase of heat-generation of a heat-generating element, accompanying with an increase of processing performances, a pipe, which is located at a side where the cooling water flows out from a tank building up the water-cooling system, is extended up to the position of a center of the tank and disposed therein. Also, two (2) pieces of plates are provided for dividing the vicinity of an inlet portion of a pipe, through which the cooling water flows out, within the tank, and further, when injecting the cooling water into the tank, an injection jig for the cooling water is used, which has a connector portion with the tank.

摘要翻译： 在具有能够稳定地循环/供给冷却液的水冷结构的电子设备或装置中，为了处理发热元件的发热增加，随着加工性能的提高，管， 其位于冷却水从构成水冷却系统的罐流出的一侧，延伸到罐的中心位置并设置在其中。 另外，设置有二（2）个板，用于将在冷却水流出的管的入口附近分配在罐内，此外，当将冷却水注入罐中时，注射夹具 因为使用冷却水，其具有与罐的连接器部分。

公开(公告)号：US06697253B2

公开(公告)日：2004-02-24

申请号：US09921927

申请日：2001-08-06

申请人： Rintaro Minamitani ,  Makoto Kitano ,  Noriyuki Ashiwake ,  Shigeo Ohashi ,  Yoshihiro Kondo ,  Takashi Naganawa ,  Yuji Yoshitomi ,  Tsuyoshi Nakagawa

发明人： Rintaro Minamitani ,  Makoto Kitano ,  Noriyuki Ashiwake ,  Shigeo Ohashi ,  Yoshihiro Kondo ,  Takashi Naganawa ,  Yuji Yoshitomi ,  Tsuyoshi Nakagawa

IPC分类号： G06F120

CPC分类号： G06F1/203 ,  F01P2011/066 ,  F28D15/0266 ,  G06F2200/201 ,  Y10S165/905

摘要： A liquid cooling system for a personal computer is suitable for cooling a semiconductor device, etc, generating high heat and is designed to suppress undesirable influence on the personal computer following corrosion in the liquid cooling system, thereby ensuring the dependability of the system as a whole. The liquid cooling system has a pump for supplying cooling liquid; a heat receiving jacket supplied with the cooling liquid and positioned to receive heat generated from a heat generation body; a heat radiation pipe for radiating heat which is supplied by the cooling liquid passing through the heat receiving jacket; and a passage for circulating the cooling liquid passing through the heat radiation pipe into said pump. The heat radiation pipe is made of a material having a corrosion resistance that is higher than that of the heat receiving jacket.

摘要翻译： 用于个人计算机的液体冷却系统适用于冷却产生高热量的半导体器件等，并且设计成可以抑制液体冷却系统中的腐蚀对个人计算机的不期望的影响，从而确保整个系统的可靠性 。 液体冷却系统具有用于供应冷却液体的泵; 提供有冷却液体并被定位成接收从发热体产生的热量的热接收套管; 用于散热的热辐射管，其由通过所述受热夹套的冷却液供给; 以及用于使通过散热管的冷却液循环到所述泵中的通道。 散热管由具有高于受热护套的耐腐蚀性的材料制成。

公开(公告)号：US06611425B2

公开(公告)日：2003-08-26

申请号：US09934594

申请日：2001-08-23

申请人： Shigeo Ohashi ,  Noriyuki Ashiwake ,  Takashi Naganawa ,  Makoto Kitano ,  Rintaro Minamitani ,  Yoshihiro Kondo ,  Tsuyoshi Nakagawa

发明人： Shigeo Ohashi ,  Noriyuki Ashiwake ,  Takashi Naganawa ,  Makoto Kitano ,  Rintaro Minamitani ,  Yoshihiro Kondo ,  Tsuyoshi Nakagawa

IPC分类号： G06F116

CPC分类号： G06F1/203 ,  G06F2200/201 ,  G06F2200/203

摘要： An electronic apparatus has a water-cooling system suited for a construction having compact, thin design. In the electronic apparatus, a water-cooling jacket is thermally connected to a heat-generating element, a heat-dissipating pipe is thermally connected to a heat-dissipating metal sheet provided at a rear panel of a display case, and a cooling medium liquid is circulated between the water-cooling jacket and the heat-dissipating pipe by a liquid-moving device. A necessary and sufficient circulating flow rate and a necessary discharge pressure are determined by the relation between the upper limit temperature of the heat-generating element and the limit amount of heat dissipation from the surface of the housing. With this structure, heat occurring in the heat-generating element can be dissipated from the rear surface of the display case due to the necessary and sufficient liquid-circulating flow rate.

摘要翻译： 电子设备具有适于具有紧凑，薄型设计的结构的水冷却系统。 在电子设备中，将水冷套管热连接到发热元件，散热管热连接到设在显示器壳体的后面板上的散热金属片和冷却介质液体 通过液体移动装置在水冷套管和散热管之间循环。 必要且充分的循环流量和必要的排出压力由发热元件的上限温度与从壳体的表面限制的散热量之间的关系来确定。 利用这种结构，由于必要且足够的液体循环流量，发热元件中产生的热量可从显示器壳体的后表面消散。

公开(公告)号：US5250809A

公开(公告)日：1993-10-05

申请号：US824081

申请日：1992-01-22

申请人： Shuji Nakata ,  Minoru Nakamura ,  Takeo Sakai ,  Yoshimasa Shimizu ,  Yoshihiro Kondo

发明人： Shuji Nakata ,  Minoru Nakamura ,  Takeo Sakai ,  Yoshimasa Shimizu ,  Yoshihiro Kondo

IPC分类号： G01N25/72 ,  G01R31/04

CPC分类号： G01N25/72 ,  G01R31/048

摘要： A method and device for checking a joint of an electronic component is arranged to apply heat energy to a joint containing a heat conductive material and receive the infrared ray radiated from said joint with an infrared camera. By processing the image information output from the infrared camera, the method and device can offer an area of a defect, an area ratio of a defect, pixel coordinates, a temperature distribution pattern, a distance between central axes of a particular portion of the joint, or a gradient angle. The obtained value is compared with a predetermined value for determining the kind of a defect and whether or not the joint is defective.

摘要翻译： 用于检查电子部件的接头的方法和装置被布置成将热能施加到包含导热材料的接头上，并且用红外相机接收从所述接头辐射的红外线。 通过处理从红外线摄像机输出的图像信息，该方法和装置可以提供缺陷的面积，缺陷的面积比，像素坐标，温度分布图案，关节的特定部分的中心轴之间的距离 ，或梯度角。 将获得的值与用于确定缺陷的种类的预定值进行比较，以及关节是否有缺陷。