公开(公告)号：US09823292B2

公开(公告)日：2017-11-21

申请号：US14726973

申请日：2015-06-01

申请人： TOYOTA JIDOSHA KABUSHIKI KAISHA

发明人： Yukio Onishi ,  Takato Sato ,  Yasushi Shinojima ,  Masaru Shimono

IPC分类号： G01R31/40 ,  G01R31/26 ,  G01R31/04

CPC分类号： G01R31/2642 ,  G01R31/048 ,  G01R31/40

摘要： An information output apparatus includes: a first switching element joined through a solder part, and forming one arm of a power conversion apparatus; a second switching element connected in series with the first switching element, and forming the other arm of the power conversion apparatus; a smoothing capacitor; a measuring unit configured to measure a temperature of the first switching element to output a measured value; an applying unit configured to apply two or more continuous pulses in a state where a potential difference across the smoothing capacitor is greater than or equal to a predetermined value, the pulses causing the first switching element and the second switching element to simultaneously turn on; an adjusting unit configured to adjust pulse widths of the pulses; and an output unit configured to output information indicating a deterioration of the solder part based on a manner of a change in measured values.

公开(公告)号：US20160146878A1

公开(公告)日：2016-05-26

申请号：US14899909

申请日：2013-07-01

申请人： HITACHI, LTD.

发明人： Lina Jaya DIGUNA ,  Masahide OKAMOTO ,  Kenji TAMAKI

IPC分类号： G01R31/04 ,  H01L23/00 ,  G01R31/00

CPC分类号： G01R31/048 ,  G01R31/003 ,  G01R31/2817 ,  G01R31/2818 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/04042 ,  H01L2224/27462 ,  H01L2224/27464 ,  H01L2224/27849 ,  H01L2224/29082 ,  H01L2224/29101 ,  H01L2224/29155 ,  H01L2224/29655 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/83908 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/13091 ,  H01L2924/20105 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/014

摘要： The problem to be solved by the present invention is to provide a substrate for providing early warning of degradation in a semiconductor device.The problem is solved by providing a substrate comprising an actual device comprising a semiconductor component and a solder joint, and a dummy device closely placed to the actual device on the substrate and connected electrically in parallel circuit to the actual device, comprising a dummy semiconductor component and a solder joint comprising an outer solder joint part and an inner solder joint part, wherein the outer solder joint part has same characteristic to the solder joint of the actual device and the inner solder joint part accelerates the crack growth faster than the outer solder joint, and percentage area of outer solder joint part is smaller than the predetermined failure criterion of delamination percentage in actual device corresponding to the threshold value of electrical change.

摘要翻译： 本发明要解决的问题是提供一种用于在半导体器件中提供劣化的预警的基板。 该问题通过提供一种包括包括半导体部件和焊接接头的实际器件的基板和紧密地放置在基板上的实际器件上的虚设装置来解决，并且与实际器件电并联电路，包括虚拟半导体部件 以及包括外部焊接部和内部焊点部的焊接接合部，其中，外部焊点部与实际器件的焊点具有相同的特性，内部焊点部比加工外部焊点更快地加速裂纹生长 ，外部焊点部分的百分比面积小于实际装置中对应于电气变化阈值的分层百分比的预定失效标准。

公开(公告)号：US20150241504A1

公开(公告)日：2015-08-27

申请号：US14190850

申请日：2014-02-26

申请人： BHYRAV M. MUTNURY ,  SANDOR FARKAS ,  WALLACE H. ABLES

发明人： BHYRAV M. MUTNURY ,  SANDOR FARKAS ,  WALLACE H. ABLES

IPC分类号： G01R31/04 ,  G01N27/04

CPC分类号： G01R31/048

摘要： Methods and systems for monitoring contact joint integrity in an information handling system may include precisely monitoring a change in resistance of a resistive element associated with a contact joint. The change in resistance of the resistive element may be indicative of the integrity of the contact joint. The resistance may be measured using a modulated current source and by demodulating a voltage signal resulting from the modulated current flowing across the resistive element.

摘要翻译： 用于监测信息处理系统中的接触接头完整性的方法和系统可以包括精确地监测与接触接头相关联的电阻元件的电阻变化。 电阻元件的电阻变化可以指示接触接头的完整性。 可以使用调制电流源来测量电阻，并且通过解调由流过电阻元件的调制电流产生的电压信号来测量电阻。

公开(公告)号：US20150015269A1

公开(公告)日：2015-01-15

申请号：US13940164

申请日：2013-07-11

申请人： NVIDIA CORPORATION

发明人： Hans Wolfgang SCHULZE ,  Cameron BUSCHARDT

IPC分类号： G01R31/303 ,  G01R31/28

CPC分类号： G01R31/11 ,  G01R31/048

摘要： One embodiment of the present invention sets forth a method for detecting defective solder balls that includes configuring a transmitter pad to transmit a pulse signal, transmitting the pulse signal, configuring transmitter pad to receive a pulse reflection, receiving a pulse reflection, analyzing the pulse reflection; and determining whether the pulse reflection is indicative of a defective solder ball. One advantage of the disclosed method is that solder ball defects may be detected more accurately than in the trial and error approach.

摘要翻译： 本发明的一个实施例提出了一种用于检测有缺陷的焊球的方法，其包括配置发射器焊盘以传输脉冲信号，发送脉冲信号，配置发射器焊盘以接收脉冲反射，接收脉冲反射，分析脉冲反射 ; 以及确定脉冲反射是否表示有缺陷的焊球。 所公开的方法的一个优点是可以比试验和误差方法更准确地检测焊球缺陷。

公开(公告)号：US08917105B2

公开(公告)日：2014-12-23

申请号：US13481160

申请日：2012-05-25

申请人： David L. Gardell

发明人： David L. Gardell

IPC分类号： G01R1/067

CPC分类号： G01R31/048 ,  G01N3/08 ,  G01N2203/0286 ,  G01N2203/0296

摘要： A testing apparatus for measuring the material properties of solder balls includes a frame and a chuck base moveable in X, Y, Z dimensions, relative to the frame. A probe tip is fixed to the frame. A measuring device is mounted to the frame and maintains a spacing with relationship to the probe tip and which has an initial, known height above the chuck base.

摘要翻译： 用于测量焊球的材料特性的测试装置包括相对于框架在X，Y和Z尺寸上可移动的框架和夹盘基座。 探头尖端固定在框架上。 测量装置安装到框架上并保持与探针尖端的关系的间隔，并且在夹盘底部上方具有初始的已知高度。

公开(公告)号：US08901952B2

公开(公告)日：2014-12-02

申请号：US13140418

申请日：2009-12-15

申请人： Katell Moreau ,  Marc Grieu

发明人： Katell Moreau ,  Marc Grieu

IPC分类号： G01R31/28 ,  G01R31/04

CPC分类号： G01R31/048 ,  G01R31/2817

摘要： A device for testing a circuit made up of a printed circuit board on which components, preferably dummy components, are assembled by the solder connections. An enclosure of the testing device subjects the circuit under test to a schedule of thermo-mechanical and/or vibration constraints. Bridges of electrical resistors, forms a hardware portion of the testing device. A software portion of the testing device sets a detection criterion representing damage to one or more solder connections and displays the results of the test. An input/output interface converts each electrical resistor measurement of the tested chains of solder connections into data for use the software portion. An adjusting component modifies the criterion for detecting damage to the solder connections.

摘要翻译： 一种用于测试由印刷电路板组成的电路的装置，其上通过焊接连接组装组件，优选为虚拟部件。 测试装置的外壳将待测电路按照热机械和/或振动限制的时间表进行。 电阻桥形成测试装置的硬件部分。 测试装置的软件部分设置表示对一个或多个焊接连接的损坏的检测标准，并显示测试结果。 输入/输出接口将测试的焊接连接链的每个电阻测量值转换为数据，以供软件部分使用。 调整组件修改检测焊接连接损坏的标准。

公开(公告)号：US20130314117A1

公开(公告)日：2013-11-28

申请号：US13481160

申请日：2012-05-25

申请人： David L. GARDELL

发明人： David L. GARDELL

IPC分类号： G01R1/067

CPC分类号： G01R31/048 ,  G01N3/08 ,  G01N2203/0286 ,  G01N2203/0296

摘要： A testing apparatus for measuring the material properties of solder balls includes a frame and a chuck base moveable in X, Y, Z dimensions, relative to the frame. A probe tip is fixed to the frame. A measuring device is mounted to the frame and maintains a spacing with relationship to the probe tip and which has an initial, known height above the chuck base.

摘要翻译： 用于测量焊球的材料特性的测试装置包括相对于框架在X，Y和Z尺寸上可移动的框架和夹盘基座。 探头尖端固定在框架上。 测量装置安装到框架上并保持与探针尖端的关系的间隔，并且在夹盘底部上方具有初始的已知高度。

公开(公告)号：US08590146B2

公开(公告)日：2013-11-26

申请号：US12938208

申请日：2010-11-02

申请人： Thomas Kinsley

发明人： Thomas Kinsley

IPC分类号： H05K3/34 ,  H05K3/20 ,  H05K3/30

CPC分类号： B23K1/0016 ,  G01R31/048 ,  H05K1/0268 ,  H05K1/111 ,  H05K3/3436 ,  H05K2201/09663 ,  H05K2201/09809 ,  H05K2201/10734 ,  H05K2203/163 ,  H05K2203/175 ,  Y02P70/611 ,  Y10T29/49004 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144

摘要： A method comprising coupling a device to a printed circuit board, one of the device or the printed circuit board having a first connection pad and a second connection pad. The first and second connection pads are directly electrically coupled to one another, without any intervening components between the first and second connection pads, via a test path. The method further comprises performing a continuity test across the first and second connection pads and the test path and disabling the test path between the first and second connection pads.

摘要翻译： 一种方法，包括将装置耦合到印刷电路板，所述装置或印刷电路板中的一个具有第一连接焊盘和第二连接焊盘。 第一和第二连接焊盘通过测试路径彼此直接电耦合，而在第一和第二连接焊盘之间没有任何中间部件。 该方法还包括跨越第一和第二连接焊盘和测试路径执行连续性测试，并禁用第一和第二连接焊盘之间的测试路径。

公开(公告)号：US08583391B2

公开(公告)日：2013-11-12

申请号：US13087682

申请日：2011-04-15

申请人： Edward R. Morgana ,  Kevin P. Roy

发明人： Edward R. Morgana ,  Kevin P. Roy

IPC分类号： G06F19/00

CPC分类号： G01R31/2849 ,  G01R31/008 ,  G01R31/048 ,  G01R31/2856 ,  G01R31/2872

摘要： A health monitoring system for monitoring the health of an electronic system. The health monitoring system includes an analog-to-digital converter, and a monitoring circuit within the electronic system. The monitoring circuit includes fatigue life characterized electrical components representative of electrical components comprising the balance of the electronic system. The fatigue life characterized electrical components are employed solely to monitor the health of the electronic system. The monitoring circuit output is electrically connected to the analog-to-digital converter.

摘要翻译： 一个用于监测电子系统健康状况的健康监测系统。 健康监测系统包括模数转换器和电子系统内的监控电路。 监测电路包括代表包括电子系统的平衡的电气部件的表征的电气部件的疲劳寿命。 电气部件的疲劳寿命仅用于监测电子系统的健康状况。 监控电路输出电连接到模数转换器。

公开(公告)号：US20130275096A1

公开(公告)日：2013-10-17

申请号：US13801162

申请日：2013-03-13

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Akifumi Yoshimura ,  Keishi Okamoto

IPC分类号： G06F17/50

CPC分类号： G06F17/5018 ,  G01R31/048 ,  G01R31/2817

摘要： A solder joint fatigue life predicting method includes: establishing a maximum temperature, a minimum temperature, and a temperature cycle frequency in a field environment; establishing a maximum temperature, a minimum temperature, and a temperature cycle frequency in a laboratory environment for accelerated testing; implementing the accelerated testing to measure test fatigue life until failure of the product; determining exponents for the ramp rate and dwell time in a novel acceleration factor equation which is represented using the ramp rates and dwell times of the field environment and the laboratory environment from profile data of the temperature cycle in the field environment, from profile data of the temperature cycle in the laboratory environment, and from test fatigue life data, and calculating an acceleration factor by plugging these exponents into the acceleration factor equation; and calculating field fatigue life of the product from the calculated acceleration factor and measured test fatigue life.

摘要翻译： 焊接疲劳寿命预测方法包括：在现场环境中建立最高温度，最低温度和温度循环频率; 在实验室环境中建立最高温度，最低温度和温度循环频率以加速测试; 实施加速测试，测量产品故障前的疲劳寿命; 在新的加速因子方程中确定斜坡速率和停留时间的指数，该方程式使用现场环境和实验室环境的斜坡速率和驻留时间从现场环境中的温度循环的轮廓数据，从 实验室环境温度循环和试验疲劳寿命数据，并通过将这些指数插入加速度因子方程来计算加速因子; 并根据计算的加速因子和测量的疲劳寿命计算产品的场疲劳寿命。