公开(公告)号：US20130175330A1

公开(公告)日：2013-07-11

申请号：US13663698

申请日：2012-10-30

Applicant: DunAn Microstaq, Inc

Inventor： Parthiban Arunasalam ,  Siddharth Bhopte ,  Joe Albert Ojeda, SR.

IPC: B23K1/20

CPC classification number: H01L24/29 ,  B23K1/0016 ,  B23K1/203 ,  B23K35/3612 ,  B23K2101/42 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/27332 ,  H01L2224/29011 ,  H01L2224/29015 ,  H01L2224/29076 ,  H01L2224/29082 ,  H01L2224/29116 ,  H01L2224/29294 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/32225 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2924/1461 ,  H05K3/3436 ,  H05K3/3478 ,  H05K3/3484 ,  H05K2203/0415 ,  H01L2924/0105 ,  H01L2924/00014 ,  H01L2924/01049 ,  H01L2924/01082 ,  H01L2924/00

Abstract: A method of bonding an electrical component to a substrate includes applying solder paste on to a substrate. Solder preform has an aperture is formed therethrough and is then urged into contact with the solder paste, such that solder paste is urged through the aperture. An electrical component is then urged into contact with the solder preform and into contact with the solder paste that has been urged through the aperture, thereby bonding the electrical component, the solder preform, and the substrate together to define a reflow subassembly.

Abstract translation: 将电气部件接合到基板的方法包括将焊膏施加到基板上。 焊料预制件具有穿过其中的孔，然后被迫与焊膏接触，使得焊膏通过孔被推动。 电气部件然后被推动与焊料预制件接触并与已经被推动通过孔的焊膏接触，从而将电气部件，焊料预成型件和衬底结合在一起以限定回流组件。