摘要:
An illumination device for illuminating a road includes a lamp holder and a light source. The lamp holder has an inner surface and a cavity defined by the inner surface. The light source is arranged in the cavity, and light emitted from the light source is redirected by the lamp holder to establish an illuminating area on the road. The illuminating area is consisted of a first angular range and a second angular range which are located at two opposite sides of the lamp holder along a lengthwise direction of the road. The first angular range is directed at an angle Φ1 from a downward vertical line through the lamp holder, and the second angular range is directed at an angle Φ2 from the downward vertical line, wherein, Φ2>Φ1, Φ1≦45°.
摘要:
An LED lamp includes a lamp post, an illumination unit fixed on the lamp post, and a generator disposed in the lamp post and coupled to the illumination unit electrically. The lamp post defines an airflow passage along a longitudinal direction thereof. The airflow passage communicates with an outer environment. The generator is adapted for converting wind energy to electric energy, and includes a rotary turbine arranged in the airflow passage. The rotary turbine includes a hub and a plurality of blades around the hub. Each of the blades includes a top face and an opposite bottom face. The top face and the bottom face are symmetric to a plane which extends through opposite connecting edges of the top and bottom faces and is perpendicular to a rotary axis of the turbine.
摘要:
Methods of fabricating active device array and organic light emitting diode array are provided. A first pattern metal layer is formed over a substrate. An oxide semiconductor layer is formed entirely over the substrate. A first insulation layer covering the first patterned metal layer and the oxide semiconductor layer is formed entirely on the substrate. A second patterned metal layer is formed on the first insulation layer. The oxide semiconductor layer and the first insulation layer is patterned by using the second patterned metal layer as a mask to form a first patterned oxide semiconductor layer and a first patterned insulation layer. A second insulation layer is entirely formed on the substrate. A second patterned oxide semiconductor layer is formed over the second insulation layer. A third patterned metal layer is formed over the second insulation layer.
摘要:
An illuminating device includes a receiving base and at least one light source. The receiving base has at least one receiving space defined therein, and at least one fixing post is positioned adjacent to the corresponding at least one receiving space. The at least one light source is positioned in the at least one receiving space for emitting light. Each light source comprises a light-pervious plate and a LED array located on a side of the light-pervious plate. The light-pervious plate comprises at least one first through hole with the at least one fixing post extending therethrough, the light-pervious plate is fixed to the receiving base in the corresponding receiving space of the receiving base.
摘要:
A photo sensing element array substrate is provided. The photo sensing element array substrate includes a flexible substrate and a plurality of photo sensing elements. The photo sensing elements are disposed in array on the flexible substrate. Each of the photo sensing elements includes a photo sensing thin film transistor (TFT), an oxide semiconductor TFT and a capacitor. The photo sensing TFT is disposed on the flexible substrate. The oxide semiconductor TFT is disposed on the flexible substrate. The oxide semiconductor TFT is electrically connected to the photo sensing TFT. The capacitor is disposed on the flexible substrate and electrically connected between the photo sensing TFT and the oxide semiconductor TFT. When the photo sensing element array substrate is bent, it remains unaffected from normal operation.
摘要:
Methods and systems for providing processing parameters in a secure format are disclosed. In one aspect, a method for providing semiconductor fabrication processing parameters to a design facility is disclosed. The method comprises providing a set of processing parameters of a fabrication facility; creating a model from the set of processing parameters; converting the model into a corresponding set of kernels; converting the set of kernels into a corresponding set of matrices; and communicating the set of matrices to the design facility. In another aspect, a method for providing semiconductor fabrication processing parameters is disclosed. The method comprises providing a set of processing parameters of a fabrication facility; creating a processing model from the set of processing parameters; encrypting the processing model into a format for use with a plurality of EDA tools; and communicating the encrypted processing model format to a design facility.
摘要:
A high definition multimedia interface (HDMI) assembly for providing an electrical connection between two electronic devices includes an HDMI port and an HDMI plug. The HDMI port includes a first connection element and a pin portion. The HDMI plug includes a second connection element. The first connection element is pivotably disposed on the HDMI port and includes a hook, and the pin portion is connected to the HDMI port for providing connection between the HDMI port and one of the electronic devices. When the HDMI plug is connected to the HDMI port, the second connection element and the first connection element contact with each other and the hook hooks the HDMI plug.
摘要:
A surface light source device includes a plurality of light guide plates spliced together side by side and forming a plurality of jointing interfaces. A plurality of LEDs is attached to a side face of each of the light guide plates. The LEDs are arranged in a linear LED array along the side face of each of the light guide plates. At most one linear LED array is arranged at the jointing interface between each two neighboring light guide plates.
摘要:
A light source device includes a lead frame, a first solid-state lighting chip, a first transparent encapsulation, a second solid-state lighting chip, and a second transparent encapsulation. The first solid-state lighting chip and the second solid-state lighting chip are respectively located at two opposite sides of the lead frame and electrically connected to the lead frame. The first transparent encapsulation and the second transparent encapsulation respectively encapsulate the first solid-state lighting chip and the second solid-state lighting chip.