摘要:
An electrical connector (1) for connecting a land grid array (LGA) chip (2) with a printed circuit board includes an insulative housing (12), a frame (11) engaged with the housing, and a plurality of terminals (13) received in the housing. The housing defines two adjacent sides (122, 123). A plurality of arcuate protrusions (1220, 1230) is formed on said sides. The frame has four sidewalls (110, 113, 114, 115) defining a central cavity (111) therebetween for receiving the LGA chip therein. Two adjacent of the sidewalls define a plurality of cutouts (1110, 1130) in respective inner faces thereof, corresponding to the protrusions respectively. The frame is mounted on the housing, with the protrusions being engagingly received in the corresponding cutouts. When the LGA chip is engaged with the connector, the protrusions elastically deform to accurately guide and securely fix the LGA chip in the connector.
摘要:
An electrical socket comprises a socket body and a plurality of contacts. The socket body comprises a first section and a second section, the first section and the second section each having a plurality of contacts received therein, the first section defining an upper face being spaced away from a top face of the second section in a vertical direction.
摘要:
An electrical connector for receiving more than one IC packages (3) includes an insulative housing (1) having a planar interface with a plurality of passageways (10) defined therein; and a plurality of contacts (2) retained in the passageways (10) respectively and arranged in more than one groups. Each group of the contacts (2) is incorporated with positioning members (111) that jointly position the IC package upon the group of the contacts (2).
摘要:
An electrical connector assembly (100) comprises an insulative housing (5) with a plurality of contacts (6) received therein, a lock member (3) assembled on the circuit board (2) and a load plate (1) for pressing the electronic package toward the insulative housing (5). The lock member (3) defines a lock portion (31), the load plate comprises a body portion (12), a first tongue portion (14) and a second tongue portion (15) extending from the body portion (12), the first tongue portion (14) and the second tongue portion (15) can move away from each other to make the first tongue portion (14) and the second tongue portion (15) move to the lower surface of the lock portion (31) to interlock with the lock portion (31).
摘要:
An electrical connector assembly includes an electrical connector, a pick up cap (13) and at least one aligning key (14). The electrical connector has a base surrounded by spaced rigid walls (112) so as to form a receiving cavity (111) adapted to receive an IC package. The at least one aligning key is attached to the base, and has at least a part thereof configured to laterally invade the receiving cavity. The pick up cap is assembled onto the electrical connector, and has a receptacle (1321) defined thereon for receiving the at least one aligning key. Since the pick up cap forms the receptacle adapted for receiving the aligning keys, the pick up cap can be assembled onto the electrical connector, and securely held in position by the engagement of the receptacle of the pick up cap and the aligning key of the electrical connector.
摘要:
According to one embodiment of the present invention, a land grid array socket includes an insulative housing (30) defining a number of passages (35) and a number of conductive terminals (20) residing in corresponding passages, respectively. Each terminal includes a base section (21) secured in the passage and a pair of opposing bent sections (23, 24) angularly stretching out from two sides of the base section. The bent sections each include a pair of resilient arms (25) protruding upwardly out of the housing, so as to provide multiple contacting points between the terminal and an electronic component seated thereon.
摘要:
According to an embodiment of the present invention, a low insertion force socket (10) includes a dielectric housing (20) defining a number of through-holes extending through an upper surface (202) and a lower surface (204) thereof. The through-holes each include a passage (206) for retaining a terminal (30) and a circular lead-in channel (208) in communication with the passage. The lead-in channel has a diameter smaller than that of an associated passage.
摘要:
A land grid array socket (10) includes a dielectric housing (12) defining a number of passages (122) and a number of conductive terminals (16) residing in the corresponding passages, respectively. Each conductive terminal includes a base section (1600) secured to the passage and a pair of opposing bent sections (162) angularly stretching out from lateral sides of the base section. The bent sections each include a resilient arm (164) protruding upwardly and obliquely out of the housing to resiliently and electrically mate with an electronic component coupled thereto.
摘要:
According to an embodiment of the present invention, a low insertion force socket (10) includes a dielectric housing (20) defining a number of through-holes extending through an upper surface (202) and a lower surface (204) thereof. The through-holes each include a passage (206) for retaining a terminal (30) and a circular lead-in channel (208) in communication with the passage. The lead-in channel has a diameter smaller than that of an associated passage.
摘要:
A LIF socket (10) for electrically connecting an IC package and a PCB includes an insulative housing (20) having a supporting surface (202) and a mounting surface (204) opposite to the supporting surface. A number of passages (206) extend from the mounting surface. Each passage has a leading section (208). A number of contacts (30) are disposed in corresponding passages, respectively. Each contact has a planar body (302), a pair of arms (304) extending from two lateral sides of the planar body towards the supporting surface, and a soldering pad (306) angled with respect to the planar body. The arm is formed with a curved contacting (3080) section at a distal end thereof.