摘要:
An amorphous layer 101 is formed in a region from a surface of a silicon substrate 100 to a first depth A. At this time, defects 103 are generated near an amorphous-crystal interface 102. By heat treatment, the crystal structure of the amorphous layer 101 is restored in a region from the first depth A to a second depth B that is shallower than the first depth A. The resultant amorphous layer 101 extends from the surface of the silicon substrate 100 to the second depth B. The defects 103 remain at the first depth A. By ion implantation, a pn junction 104 is formed at a third depth C that is shallower than the second depth B.
摘要:
In a method for fabricating an electronic device including a transistor with a drain extension structure, a correspondence between a size of a gate electrode of the transistor and ion implantation conditions or heat treatment conditions for forming the drain extension structure is previously obtained. This correspondence satisfies that the transistor has a given threshold voltage. After formation of the gate electrode and measurement of the size of the gate electrode, ion implantation conditions or heat treatment conditions for forming the drain extension structure are set based on the previously-obtained correspondence and the measured size of the gate electrode. Ion implantation or heat treatment for forming the drain extension structure is performed under the ion implantation conditions or heat treatment conditions that have been set.
摘要:
A biaxially oriented polyester container with a uniformly and sufficiently elongated and thin-walled bottom part having excellent drop strength, improved ESC resistance and reduced weight, and a method of manufacturing the container. The biaxially oriented polyester container of the present invention is characterized in that, when an X-ray diffraction measurement is performed in and near a bottom center area of the biaxially oriented polyester container formed by a double-stage orientation blow molding method, a peak indicative of molecular orientation is observed near a diffraction angle of 2θ=15 to 30° and an orientation parameter (BO) expressed by the following formula (1) is in the range of 0.5≦BO≦2 in and near the bottom center area: orientation parameter (BO)=Ix/Iy (1) (where Ix indicates a diffraction intensity near the diffraction angle of 2θ=15 to 30° when the X-ray diffraction measurement is performed in the X-direction, and ly indicates a diffraction intensity near the diffraction angle of 2θ=15 to 30° when the X-ray diffraction measurement is performed in a direction orthogonal to that for Ix)
摘要翻译:具有均匀且充分伸长的薄壁底部的双轴取向聚酯容器,具有优异的滴落强度,改进的耐ESC性和减轻的重量,以及制造该容器的方法。 本发明的双轴取向聚酯容器的特征在于,在通过双级取向吹塑成型法形成的双轴取向聚酯容器的底部中心区域附近进行X射线衍射测定时, 在2θ= 15〜30°的衍射角附近观察到分子取向,并且由下式(1)表示的取向参数(BO)在底部中心区域附近的0.5 <= BO <= 2的范围内 :<?in-line-formula description =“在线公式”end =“lead”?> orientation parameter(BO)= Ix / Iy(1)<?in-line-formula description =“In-line Formulas” end =“tail”?>(其中,Xx表示在X方向进行X射线衍射测定时的衍射角接近2θ= 15〜30°的衍射强度,并且ly表示衍射角附近的衍射强度 当X射线衍射测量直接进行时,为2θ= 15〜30° 离子与Ix正交)
摘要:
A main controller, such as a CPU, causes a runout detector to relearn a runout component using as an initial value a learned value for a runout component of a disk runout that may occur as a disk rotates, the learned value being acquired during manufacture of a disk drive. The learned value for the runout component used as the initial value is saved to a nonvolatile storage device. The main controller calculates a disk shift amount on the basis of a runout component obtained through relearning (that is, a relearned value) and the learned value acquired during the manufacture of the disk drive and used as the initial value.
摘要:
A memory section stores values of the runout component, which are obtained in respective predetermined radial positions on the disk. A determining section selects, from the memory section, a value of the runout component corresponding to a target position. A runout detector uses, as an initial value for adaptive learning, the value of the runout component selected by the determining section, and calculates, by the adaptive learning, a value of the runout component contained in a position error between a head position and the target position. A feedforward controller calculates a feedforward value used to suppress the runout component calculated by the runout detector. A feedback controller calculates a feedback value from the position error. An adder generates, from the feedback value and the feedforward value, a control amount used to position the head in the target position.
摘要:
A test wafer for use in wafer temperature prediction is prepared. The test wafer includes: first semiconductor layer formed in a crystalline state; second semiconductor layer formed in an amorphous state on the first semiconductor layer; and light absorption film formed over the second semiconductor layer. Next, the test wafer is loaded into a lamp heating system and then irradiating the test wafer with a light emitted from the lamp, thereby heating the second semiconductor layer through the light absorption film. Thereafter, a recovery rate, at which a part of the second semiconductor layer recovers from the amorphous state to the crystalline state at the interface with the first semiconductor layer, is calculated. Then, a temperature of the test wafer that has been irradiated with the light is measured according to a relationship between the recovery rate and a temperature corresponding to the recovery rate.
摘要:
A facsimile machine includes a detachable ribbon cassette accommodating an ink ribbon and having an EEPROM that stores the amount of the ink ribbon consumed. In the facsimile machine, printing is performed while the ink ribbon is taken up by a take-up motor and the memory contents in the EEPROM are renewed according to the progress of printing. The facsimile machine further includes a ribbon-empty detector that detects that the facsimile machine runs out of the ink ribbon, and a CPU that resets the memory contents in the EEPROM of the ribbon cassette.
摘要:
At the time of the loading of head, the CPU flows a plurality of different currents to VCM, and by reading the back electromotive force monitor value of the back electromotive force monitor circuit each time, the calibration value of the circuit is obtained, and by using this calibration value, head-loading control is executed. The calibration value obtained previously is compensated on the basis of temperature changes, temperature compensation coefficient that shows the relation between the variation of the calibration value of the back electromotive force monitor circuit, and the difference between the above-mentioned two measured temperatures.