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公开(公告)号:US06929505B2
公开(公告)日:2005-08-16
申请号:US10912811
申请日:2004-08-06
申请人: Wen He , Fujin Peng , Nick Lin
发明人: Wen He , Fujin Peng , Nick Lin
CPC分类号: H05K7/1061 , H01R12/7076 , H01R13/62
摘要: An electrical connector (1) for connecting a land grid array (LGA) chip with a printed circuit board (PCB) includes a housing (10), and terminals (11) received in passageways (102) of the housing. The housing defines a base (100) and four sidewalls (12), the base and the sidewalls cooperatively defining a space therebetween for receiving the LGA chip. The base has a multiplicity of passageways along a length thereof, for receiving the corresponding terminals therein. Two adjacent sidewalls each define a resilient beam (13) with an incline surface and joining the sidewall at two ends. A space (15) is defined between the beam and the sidewall. When the LGA chip is placed on the base, the two resilient beams can resiliently act on the chip to ensure reliable engagement between the LGA chip and the connector.
摘要翻译: 用于将平台格栅阵列(LGA)芯片与印刷电路板(PCB)连接的电连接器(1)包括壳体(10)和容纳在壳体的通道(102)中的端子(11)。 壳体限定基部(100)和四个侧壁(12),所述基部和侧壁协作地在其间限定用于接收LGA芯片的空间。 底座具有沿其长度的多个通道,用于在其中接收相应的端子。 两个相邻的侧壁各自限定具有倾斜表面的弹性梁(13),并且在两端连接侧壁。 在梁和侧壁之间限定一个空间(15)。 当LGA芯片放置在基座上时,两个弹性梁可以弹性地作用在芯片上,以确保LGA芯片和连接器之间的可靠接合。
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公开(公告)号:US20050095906A1
公开(公告)日:2005-05-05
申请号:US10979704
申请日:2004-11-01
申请人: Wen He , Fujin Peng , Nick Lin
发明人: Wen He , Fujin Peng , Nick Lin
IPC分类号: H01R13/428 , H05K1/00 , H05K7/10
CPC分类号: H05K7/1053
摘要: A socket connector (9) includes an insulative base (10), a plurality of contacts (20) and a flexible beam (120) for securing the electronic element in the base. The base includes sidewalls (12), and a recessed portion (13) being defined in the sidewalls for receiving the electronic element therein. A plurality of receiving passageways (110) are defined in the recessed portion and extend through upper and lower surfaces of the recessed portion. Each contact includes a retaining portion retained in the base, a flexible contact portion (200) extending laterally from an upper portion of the retaining portion beyond upper surface of the recessed portion, and a connecting porting (202) extending from a lower portion of the retaining portion adapted for electrically connecting with the PCB. The beam is secured with one sidewall of the base. The sidewall defines a slot (121) adjacent to the beam. The beam has a flexible portion (120A) extending into the recessed portion and deflectable into said slot in an opposite direction to the extending direction of the contact portions of the contacts.
摘要翻译: 插座连接器(9)包括绝缘基座(10),多个触头(20)和用于将电子元件固定在基座中的柔性梁(120)。 底座包括侧壁(12)和凹陷部分(13),其限定在侧壁中用于在其中接收电子元件。 多个接收通道(110)限定在凹部中并且延伸穿过凹部的上表面和下表面。 每个触点包括保持在基座中的保持部分,从保持部分的上部横向延伸超过凹部的上表面的柔性接触部分(200),以及从凹部的下部延伸的连接端口(202) 适于与PCB电连接的保持部分。 梁与基座的一个侧壁固定。 侧壁限定与梁相邻的狭槽(121)。 梁具有延伸到凹部中的柔性部分(120A),并且沿着与触头的接触部分的延伸方向相反的方向可偏转到所述狭槽中。
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公开(公告)号:US06786738B2
公开(公告)日:2004-09-07
申请号:US10283916
申请日:2002-10-29
申请人: Nick Lin
发明人: Nick Lin
IPC分类号: H01R1200
CPC分类号: H01R13/2435 , H01R12/52 , H01R12/7076
摘要: An electrical contact (30) received in a socket connector (1) for connecting a CPU (6) to a PCB (5) includes a retention plate (31) and a spring arm (33) and a connecting arm (32) connecting the spring arm to the retention plate. The retention plate engages with the socket connector for securely retaining the electrical contact in the socket connector. The spring arm includes a first curved arm (331) bent from the connecting arm toward the retention plate, a second curved arm (332) bent from the first curved arm opposite to the retention plate and a third curved arm (333) bent from the second curved arm toward the retention plate. The first curved arm has a bottom contacting end (330) for contacting with the PCB. Similarly, the third curved arm has a top contacting end (334) for contacting with the CPU.
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公开(公告)号:US06623298B2
公开(公告)日:2003-09-23
申请号:US10126842
申请日:2002-04-19
申请人: Nick Lin , Hsiu-Yuan Hsu
发明人: Nick Lin , Hsiu-Yuan Hsu
IPC分类号: H01R1373
CPC分类号: H01R12/716 , H05K3/341
摘要: An electrical socket connector comprises a base (11), a cover (12) movably mounted on the base, and a fastening means (14). The base has a contact receiving portion (111) and a first protruding section (110) at one end thereof. A plurality of conductive contacts are received into the contact receiving portion of the base and each contact has a solder ball (112) attached thereon. The fastening means is assembled on the first protruding section of the base and at least has a soldering portion (141). The soldering portion and the solder balls are soldered on a PCB.
摘要翻译: 电插座连接器包括基座(11),可移动地安装在基座上的盖子(12)和紧固装置(14)。 底座在其一端具有接触接收部分(111)和第一突出部分(110)。 多个导电触点被接收到基座的接触接收部分中,并且每个触头具有附接在其上的焊球(112)。 紧固装置组装在基座的第一突出部分上,并且至少具有焊接部分(141)。 焊接部分和焊球焊接在PCB上。
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公开(公告)号:US06554625B1
公开(公告)日:2003-04-29
申请号:US10126219
申请日:2002-04-18
申请人: Fang-Chu Liao , Nick Lin , Hsiang-Ping Chen
发明人: Fang-Chu Liao , Nick Lin , Hsiang-Ping Chen
IPC分类号: H01R1344
CPC分类号: H05K7/1007 , Y10S439/94
摘要: A socket assembly (10) includes a socket (1) and a pick up device (2) releasably mounted to the socket. The socket has a base (11) and a cover (12) slidably mounted on the base. The pick up device includes a cap (21) and a film member (22) adhered to the cap. The cap is releasably mounted to the cover of the socket and defines a pair of through slots (212). The film member is adhered to the top face (218) of the cap to cover the through slots for being manipulated by the vacuum suction device to position the CPU socket on a circuit board.
摘要翻译: 插座组件(10)包括可释放地安装到插座的插座(1)和拾取装置(2)。 插座具有可滑动地安装在基座上的底座(11)和盖子(12)。 拾取装置包括盖(21)和粘附到盖的膜构件(22)。 盖可释放地安装到插座的盖上并且限定一对通孔(212)。 胶片构件粘附到盖的顶面(218)以覆盖通孔,以便由真空抽吸装置操纵以将CPU插座定位在电路板上。
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公开(公告)号:US06504108B1
公开(公告)日:2003-01-07
申请号:US10040347
申请日:2001-12-28
申请人: Nick Lin
发明人: Nick Lin
IPC分类号: H05K116
CPC分类号: H05K7/1007 , H01R4/028 , H01R12/57 , H05K3/303 , H05K3/3436 , H05K2201/10568 , H05K2201/10734 , H05K2201/2036 , Y02P70/613
摘要: A ball grid array (BGA) socket (5) includes an insulative member (52), a number of conductive contacts (54) attached to the insulative member in an array and a number of solder balls (56) respectively attached to corresponding conductive contacts and arranged in an array in accordance with the conductive contacts. The insulative member provides a number of stand-offs (60) on the mounting surface thereof and located in the array of the solder balls. When the BGA socket is located on a printed circuit board (PCB, 80) and heated, the solder balls become soft or melted and the insulative member sinks until the stand-offs bear against the PCB. Since the stand-offs are located in the array of the solder balls, the solder balls are not spaced from the PCB too close or too far, therefore the solder balls close a center of the connector may not be disconnected from corresponding solder pads or interconnect with the adjacent solder balls.
摘要翻译: 球栅阵列(BGA)插座(5)包括绝缘构件(52),多个导体触点(54),其以阵列方式附接到绝缘构件,并且多个焊球(56)分别附接到相应的导电触头 并且根据导电触点排列成阵列。 绝缘构件在其安装表面上提供多个位置(60)并位于焊球的阵列中。 当BGA插座位于印刷电路板(PCB,80)上并加热时,焊球变软或熔化,绝缘构件下沉,直到支座抵靠PCB。 由于支架位于焊球的阵列中,所以焊球与PCB间隔不太近或太远,因此关闭连接器中心的焊球可能不会与相应的焊盘或互连 与相邻的焊球。
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公开(公告)号:US06340309B1
公开(公告)日:2002-01-22
申请号:US09797629
申请日:2001-03-01
IPC分类号: H01R450
CPC分类号: H05K7/1007 , Y10S439/923
摘要: A ZIF socket (1) on which a CPU (2) is mounted. The CPU (2) has a plurality of pins (21) extending through a cover (11) into a base (12) of the socket for electrically engaging with contacts (110) received in the base. The cover defines two slots (1112) in two opposite sides of a top face thereof. The slots are located below two side edges of the CPU, whereby there is more space for a user's fingers to grip the CPU to pull it away from the socket in order to replace CPU with another one.
摘要翻译: 安装有CPU(2)的ZIF插座(1)。 CPU(2)具有穿过盖(11)延伸到插座的基座(12)中的多个销(21),用于与容纳在基座中的触点(110)电接合。 盖子在其顶面的两个相对侧限定了两个槽(1112)。 这些插槽位于CPU的两个侧边下方,因此用户的手指有更多的空间来抓住CPU将其从插座中拉出,以便用另一个CPU替换CPU。
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公开(公告)号:US06299470B1
公开(公告)日:2001-10-09
申请号:US09751556
申请日:2000-12-29
IPC分类号: H01R450
CPC分类号: H01R4/5008 , H01R13/193
摘要: A contact (10) for a ZIF PGA socket (20) includes a horizontal single-beam contact portion (12) and an elongated mounting portion (11) depending from the contact portion. The mounting portion includes a fixing portion (16) for fixing to the socket, a leg (19) depending from the fixing portion for extending through the socket and electrically communicating with a circuit board, and a neck (14) integrally connecting the contact portion and the fixing portion. The neck is substantially narrower than the fixing portion and the contact portion, thus allowing the contact portion to twist about a central vertical axis of the contact and to be displaced relative to the fixing portion. The contact portion can thereby rotatably contact and resiliently press against a corresponding pin (30) of a mating PGA device.
摘要翻译: 用于ZIF PGA插座(20)的接触件(10)包括水平单梁接触部分(12)和从接触部分悬垂的细长安装部分(11)。 安装部分包括用于固定到插座的固定部分(16),从固定部分延伸穿过插座并与电路板电连通的腿部(19),以及将接触部分 和固定部。 颈部基本上比固定部分和接触部分窄,从而允许接触部分围绕接触件的中心垂直轴线扭转并且相对于固定部分移位。 因此,接触部分可以可旋转地接触并弹性压靠配合PGA装置的相应销(30)。
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公开(公告)号:US06244875B1
公开(公告)日:2001-06-12
申请号:US09489345
申请日:2000-01-21
申请人: Robert G. McHugh , Nick Lin , Hsing-Yu Yu
发明人: Robert G. McHugh , Nick Lin , Hsing-Yu Yu
IPC分类号: H01R1362
CPC分类号: H01R12/7047
摘要: A socket connector includes a rectangular base plate adapted to be positioned on a circuit board and retaining an electronic device, such as an integrated circuit, thereon for establishing electrical connection between the electronic device and the circuit board by means of contacts retained therein. Bumps are formed on the base plate for engaging with notches defined in the electronic device to precisely positioning the electronic device with respect to the base plate. A retention module includes a frame having four wall segments defining an interior space therebetween for receiving the base plate. A pair of sideways projections is formed on one wall segment with aligned holes defined therein for receiving pivots of a resilient clip thereby making the clip movable between an open position where the base plate is exposed for receiving the electronic device and a closed position where the clip resiliently engages with the electronic device thereby securing the electronic device to the base plate. A pair of sideways projections is formed on an opposite wall segment each having a barb for engaging an opening defined in a corresponding resilient arm of the clip for fixing the clip at the closed position. Each sideways projection forms a bifurcated board lock for being received in a hole defined in the circuit board. A pin is inserted into a bore defined in each sideways projection to expand the board lock thereby securely fixing the socket connector to the circuit board.
摘要翻译: 插座连接器包括适于定位在电路板上的矩形基板,并在其上保持诸如集成电路的电子设备,借助于保持在其中的触点在电子设备和电路板之间建立电连接。 凸起形成在基板上,用于与限定在电子设备中的凹口接合,以相对于基板精确地定位电子设备。 保持模块包括具有限定其间的内部空间的四个壁段的框架,用于接纳基板。 一对侧面突起形成在一个壁部分上,其中限定有对准的孔,用于接收弹性夹的枢轴,从而使夹子可在打开位置之间移动,在该打开位置,底板暴露于接收电子装置的位置和夹子 弹性地与电子设备接合,从而将电子设备固定在基板上。 一对横向突起形成在相对的壁段上,每个侧壁具有倒钩,用于接合限定在夹子的相应弹性臂中的开口,用于将夹子固定在关闭位置。 每个侧面突起形成分叉板锁,用于容纳在电路板中限定的孔中。 销钉插入到每个侧面突出部中限定的孔中,以扩展板锁,从而将插座连接器牢固地固定到电路板。
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公开(公告)号:US06231406B1
公开(公告)日:2001-05-15
申请号:US09686318
申请日:2000-10-10
申请人: Nick Lin , Hsin-Yu Yu
发明人: Nick Lin , Hsin-Yu Yu
IPC分类号: H01R1302
CPC分类号: H01R13/193
摘要: A contact strip includes a number of conductive contacts (4), a contact carrier (5) and a corresponding number of links (6) connecting corresponding contacts to the contact carrier. Each contact includes a contact portion (42) and a soldering portion (43) opposite the contact portion for attaching a solder ball for soldering to a printed circuit board. The contact portion is plated with gold using a molten gold plating liquid for enhancing electrical/mechanical characteristics of the contact portion. Each link defines a longitudinal slot (61) for obstructing a wicking path from the contact to the contact carrier. Furthermore, an elongate opening (52) is defined in the contact carrier above and perpendicular to a corresponding slot to further prevent the plating liquid from wicking up to the contact carrier, thereby preventing loss of the expensive plating liquid and reducing the cost of the contact.
摘要翻译: 触点条包括多个导电触点(4),触点支架(5)和相应数量的将相应的触头连接到触点支架的连杆(6)。 每个触点包括与接触部分相对的接触部分(42)和焊接部分(43),用于将用于焊接的焊球附接到印刷电路板。 接触部分使用熔融镀金液镀金,以增强接触部分的电/机械特性。 每个连杆限定用于阻塞从触点到接触托架的芯吸路径的纵向槽(61)。 此外,在接触载体上在垂直于相应的槽的上方形成有细长的开口(52),以进一步防止电镀液液滴到接触载体上,从而防止昂贵的电镀液的损失并降低接触的成本 。
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