公开(公告)号：US20150151531A1

公开(公告)日：2015-06-04

申请号：US14553227

申请日：2014-11-25

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Masakatsu OHNO ,  Hiroki ADACHI ,  Satoru IDOJIRI ,  Koichi TAKESHIMA

IPC: B32B43/00 ,  B32B38/10

CPC classification number: B32B43/006 ,  B32B37/0053 ,  B32B37/025 ,  B32B37/12 ,  B32B37/1207 ,  B32B38/10 ,  B32B2037/1253 ,  B32B2037/268 ,  B32B2457/20 ,  B32B2457/208 ,  H01L27/322 ,  H01L27/323 ,  H01L27/3262 ,  H01L51/0013 ,  H01L51/003 ,  H01L51/524 ,  H01L51/5253 ,  H01L51/5284 ,  H01L51/56 ,  H01L2227/323 ,  H01L2227/326 ,  H01L2251/5315 ,  H01L2251/5338 ,  Y10T156/1111 ,  Y10T156/1174 ,  Y10T156/1928 ,  Y10T156/195

Abstract: The yield of a peeling process is improved. A peeling apparatus includes a structure body with a convex surface and a stage with a supporting surface which faces the convex surface. The structure body can hold a first member of a process member between the convex surface and the supporting surface. The stage can hold a second member of the process member. The radius of curvature of the convex surface is less than the radius of curvature of the supporting surface. The linear velocity of the convex surface is greater than or equal to the speed of a rotation center of the structure body passing the stage. The first member is wound along the convex surface to be separated from the second member.

Abstract translation: 剥离过程的产率提高。 剥离装置包括具有凸面的结构体和具有与凸面对置的支撑面的台。 结构体可以在凸表面和支撑表面之间保持处理构件的第一构件。 舞台可以容纳进程成员的第二个成员。 凸面的曲率半径小于支撑面的曲率半径。 凸面的线速度大于或等于通过平台的结构体的旋转中心的速度。 第一构件沿凸形表面缠绕以与第二构件分离。