摘要:
Several mechanical features of an electronic device are provided. In some embodiments, the device may include a bezel coupled to a housing. One or more snaps of the bezel may be operative to engage a cantilever spring of the housing. In some embodiments, the device may include a window that is formed by coupling an outer layer to an inner layer that is larger than the outer layer. In some embodiments, the device may include a chassis for supporting the window. In some embodiments, the device may include a grounding clip for simultaneously grounding the bezel, the housing and a circuit board. In some embodiments, the device may include a switch that includes a button molded into a base using a double shot process. In some embodiments, the device may include a switch supporting bracket that includes a slot operative to receive a pin of the bezel.
摘要:
An electronic device may have a display. The display may have an active region in which display pixels are used to display images. The display may have one or more openings and may be mounted in a housing associated with the electronic device. An electronic component may be mounted in alignment with the openings in the display. The electronic component may include a camera, a light sensor, a light-based proximity sensor, status indicator lights, a light-based touch sensor array, a secondary display that has display pixels that may be viewed through the openings, antenna structures, a speaker, a microphone, or other acoustic, electromagnetic, or light-based component. One or more openings in the display may form a window through which a user of the device may view an external object. Display pixels in the window region may be used in forming a heads-up display.
摘要:
Electronic devices may include assemblies of structures such as electronic device assemblies connected using light-cured liquid adhesive such as ultraviolet-light-cured adhesive. Light guide structures may be mounted in the assemblies. During manufacture of an electronic device, ultraviolet light may be injected into a light guide structure to cure the light-cured liquid adhesive. A light guide structure may include portions that prevent escape of ultraviolet light and portions that allow ultraviolet light to escape into the light-cured liquid adhesive. Light guide structures may include masked portions, rigid support members, and one or more openings. Openings in a light guide structure may allow the light-cured liquid adhesive to be injected into an assembly through the openings. An adhesive applicator may be used to apply the adhesive to portions of the assembly. An external light source may be used to inject light that cures the adhesive into the light guide structures.
摘要:
Electronic devices may use buttons to gather user input. Button status monitoring circuits may be provided that apply a time-varying bias voltage to each button. The time-varying bias voltage may be held at a fixed non-zero level when the state of the button is being monitored and may be held at a level of zero volts when the state of the button is immaterial and is not being monitored. The reduction of the bias voltage across the button when the button is not being monitored prevents undesired acceleration in dendritic growth when the electronic device is exposed to moisture. The bias voltage may be pulsed by using a control circuit. The control circuit may generate a series of square wave pulses that are applied across the terminals.
摘要:
An electronic device may have a housing such as a metal housing. Openings may be formed in the housing to accommodate a button, to form a camera window, to form a microphone port, and to form a camera flash window. An input-output component mounting member may be used to mount input-output components to the housing of the electronic device. The input-output component mounting member may have a recess that mates with a corresponding protrusion on the housing. Screws may attach the input-output component mounting member to the housing. The protrusion and recess in the input-output component mounting member may ensure that the input-output component mounting member is accurately aligned with respect to the housing. Input-output components such as a microphone, button switch, camera, and camera flash may be mounted to the electronic device with the input-output component mounting member.
摘要:
Thermal sensors are disposed with OLEDs across a display of an electronic device to measure temperatures across the display surface. Thermal sensors may be used to create a temperature map across the display surface due to both the ambient environment and the internal environment of the electronic device. The thermal sensors may be disposed in the OLED layer, on a separate layer, or both. Thermal sensors may be disposed in a substantially 1:1 ratio with OLEDs or with zones of OLEDs. Both the temperature history and usage history for OLEDs may be recorded and processed to determine the age of each OLED. Controllers may adjust the driving strength of OLEDs or adjust the operation of components within the electronic device to compensate for aging or temperature based on the temperature map and age determination. Controllers may move static images from one part of the display to another less-aged part.
摘要:
Systems, methods, and devices are disclosed for applying concealment of components of an electronic device. In one embodiment, an electronic device may include a component that is disposed behind a display (e.g., a transparent organic light-emitting diode (OLED) display) that is configured to selectively become transparent at certain transparency regions. Additionally, the electronic device includes data processing circuitry configured to determine when an event requesting that the component be exposed occurs. The data processing circuitry may control portions of the display to become transparent, to expose the component upon the occurrence of the event requesting that the component be exposed.
摘要:
An electronic device may be provided with a display cover layer mounted to the device using an adhesive bond with a display. The display may be a flexible display. The flexible display may include Organic Light Emitting Diode display technology. The display may be mounted to a rigid support structure. The rigid support structure may be mounted to a device housing member. Mounting the display cover layer to the display may eliminate the need to mount the display cover layer to the device housing and may allow active display pixels to be visible under the display cover layer closer to the device housing than in conventional devices. Providing the electronic device with active display pixels closer to the device housing may reduce the need for an inactive border around the display and may improve the aesthetic appeal of the electronic device.
摘要:
An electronic device may be provided with a display and a multi-layer printed circuit. Integrated circuits and other components may be mounted to the multi-layer printed circuit. The display and multi-layer printed circuit may share a common layer formed from a flexible substrate. The flexible substrate may have portions that are integrated into the display and portions that are integrated into the multi-layer printed circuit board. The flexible substrate may contain patterned conductive traces that are used to route signals from components in the multi-layer printed circuit to display circuitry such as a display driver integrated circuit. An array of thin-film transistors may be used to control the emission of light from the display and may be formed on portions of the flexible substrate that are integrated into the display. The display may be a flexible display that includes an array of organic light-emitting diodes.
摘要:
This invention is directed to systems and methods for providing a port in an electronic device housing that is electrically isolated from a conductive portion of a connector inserted in the port without the use of a nonconductive trim in the port. In some embodiments, the connector may include a non-conductive flange or ring operative to contact the housing and the portions of the housing within the port. In some embodiments, a thin layer of non-conductive material may be applied to the portions of the housing within the port to prevent conductive portions of the connector from coming into contact with the housing (e.g., and grounding the conductive portion. This invention may be of particular interest when the conductive portion that may come into contact with the housing is not used to ground the connector.