公开(公告)号：US07489513B2

公开(公告)日：2009-02-10

申请号：US11684457

申请日：2007-03-09

申请人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Cui-Jun Lu

发明人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Cui-Jun Lu

IPC分类号： H05K7/20 ,  H02M7/48

CPC分类号： H01L23/367 ,  H01L21/4882 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a first heat sink and a second heat sink juxtaposed with the first heat sink. The first heat sink includes a first base and a plurality of first fin extending from the first base with a plurality of first channels defined therebetween. The second heat sink includes a second base and a plurality of second fins extending from the second base with a plurality of second channels defined therebetween. The second fins extend beyond a common edge of the first base and the second base to extend into first channels of the first heat sink.

摘要翻译： 散热装置包括与第一散热器并置的第一散热器和第二散热器。 第一散热器包括第一基座和从第一基座延伸的多个第一翅片，其间限定有多个第一通道。 第二散热器包括第二基座和从第二基座延伸的多个第二翅片，其间限定有多个第二通道。 第二散热片延伸超过第一基座和第二基座的共同边缘以延伸到第一散热器的第一通道。

公开(公告)号：US07457122B2

公开(公告)日：2008-11-25

申请号：US11309225

申请日：2006-07-13

申请人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

发明人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

IPC分类号： H05K7/20

CPC分类号： G11C5/143 ,  H01L23/3672 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： A memory module assembly includes a printed circuit board (10) having a heat-generating electronic component (14) thereon, and first and second heat-dissipation plates (20), (30) attached on opposite sides of the printed circuit board. The first heat-dissipation plate includes a first hook (24) extending from a side thereof and the first hook includes a resisting portion (242) extending from an end of the first heat-dissipation plate and a first engaging portion (244) extending from a free end of the resisting portion for resisting the printed circuit board and the second heat-dissipation plate. The second heat-dissipation plate defines a depressed portion (34) in a side thereof for engaging with the first hook. The other sides of the first and second heat-dissipation plates engage with each other to clamp the printed circuit board between the first and second heat-dissipation plates.

摘要翻译： 存储模块组件包括其上具有发热电子部件（14）的印刷电路板（10）和安装在印刷电路板的相对侧上的第一和第二散热板（20），（30）。 第一散热板包括从其一侧延伸的第一钩（24），第一钩包括从第一散热板的端部延伸的阻挡部分（242）和从第一散热板的一端延伸的第一接合部分（244） 用于抵抗印刷电路板和第二散热板的抵抗部分的自由端。 第二散热板在其一侧限定了与第一钩接合的凹部（34）。 第一和第二散热板的另一侧彼此接合以将印刷电路板夹在第一和第二散热板之间。

公开(公告)号：US07447028B2

公开(公告)日：2008-11-04

申请号：US11309849

申请日：2006-10-12

申请人： Cheng-Tien Lai ,  Tao Li ,  Wei-Qiang Tian

发明人： Cheng-Tien Lai ,  Tao Li ,  Wei-Qiang Tian

IPC分类号： H05K7/20

CPC分类号： H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a heat sink, a fan producing an airflow flowing towards the heat sink, an air-guiding member positioned between the fan and the heat sink and a cover enclosing the fan and the heat sink. The air-guiding member includes an air deflector dividing the airflow produced by the fan into two airstreams. The air deflector guides the airstreams of the airflow flowing towards different portions of the heat sink. By the air deflector, the portion of the heat sink, which is hotter than the other portion of the heat sink, has more air flowing therethrough.

摘要翻译： 散热装置包括散热器，产生朝向散热器流动的气流的风扇，位于风扇和散热器之间的空气引导构件和封闭风扇和散热器的盖。 空气引导构件包括将由风扇产生的气流分成两个气流的空气导流器。 空气导流器引导朝向散热器的不同部分流动的气流的气流。 通过导风板，比散热器的其他部分更热的散热器部分具有更多的空气流过其中。

公开(公告)号：US07438449B2

公开(公告)日：2008-10-21

申请号：US11621759

申请日：2007-01-10

申请人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

发明人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

IPC分类号： B60Q1/06

CPC分类号： F21V29/004 ,  F21V17/164 ,  F21V29/51 ,  F21V29/763 ,  F21Y2115/10 ,  Y10S362/80

摘要： An LED module includes a latching component, a frame holding an LED thereon, a heat spreader located in the latching component and a heat transfer member having a heat-dissipating unit remote from the LED and a heat pipe thermally connecting with the heat spreader, the LED and the heat-dissipating unit. The latching component cooperates with the heat spreader to tightly press the frame being attached on the heat spreader. The heat transfer member thermally connects with the heat spreader and transfers heat from the LED to an ambient environment. The latching component has two spring pieces pushing the frame toward the heat spreader and the heat pipe. The spring pieces electrically engage with the frame to thereby electrically connect with the LED.

摘要翻译： LED模块包括闩锁部件，保持LED的框架，位于闩锁部件中的散热器和具有远离LED的散热单元和与散热器热连接的热管的传热部件， LED和散热单元。 闩锁部件与散热器配合，以紧紧地按压附着在散热器上的框架。 传热构件与散热器热连接并将热量从LED传递到周围环境。 闩锁部件具有两个弹簧片，将框架推向散热器和热管。 弹簧片与框架电接合，从而与LED电连接。

公开(公告)号：US20080151507A1

公开(公告)日：2008-06-26

申请号：US11683355

申请日：2007-03-07

申请人： Wei-Le Wu ,  Cheng-Tien Lai

发明人： Wei-Le Wu ,  Cheng-Tien Lai

IPC分类号： H05K7/20

CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  Y10T24/44026 ,  H01L2924/00

摘要： A heat sink fastening assembly includes a fastener comprising a latching member and an operating member. The latching member includes a pressing part, a first latching leg and a second latching leg bent downwards respectively from two opposite ends of the pressing part. The operating member has a coping and a sidewall extending downwards from an edge of the coping. The sidewall defines two locking slots engaging with the first latching leg and an elastic rib extending downwards from the coping and engaged with the first latching leg of the latching member for inhibiting any movement of the operating member in a direction along the locking slot of the sidewall.

摘要翻译： 散热器紧固组件包括紧固件，其包括闩锁构件和操作构件。 闩锁构件包括按压部分，第一闩锁腿和分别从按压部分的两个相对端向下弯曲的第二闩锁腿。 操作构件具有从构架的边缘向下延伸的顶盖和侧壁。 侧壁限定与第一闩锁腿接合的两个锁定槽和从该盖子向下延伸并与该锁定构件的第一锁定腿接合的弹性肋，用于阻止操作构件沿着该侧壁的锁定槽的方向的任何运动 。

公开(公告)号：US07391613B2

公开(公告)日：2008-06-24

申请号：US11308839

申请日：2006-05-12

申请人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

发明人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

IPC分类号： H05K7/20

CPC分类号： H01L23/4093 ,  H01L23/3672 ,  H01L2924/0002 ,  H01L2924/00

摘要： A memory module assembly includes a printed circuit board (10) having a main heat-generating electronic component (52) thereon, first and second heat sinks (20), (30) attached on opposite sides of the printed circuit board and a clamp (40) clamping the first, second heat sinks and the printed circuit board together. The first heat sink comprises a pair of positioning poles (24). The second heat sink comprises a heat pipe (36) disposed therein and thermally connecting therewith. The clamp comprises a connecting portion (42) and a pair of elastic pressing portions (44). The clamp resiliently presses the second heat sink toward the main heat-generating electronic component and the first heat sink engages with the second heat sink via the positioning poles of the first heat sink extending in and engaging with the second heat sink.

摘要翻译： 存储模块组件包括其上具有主要发热电子部件（52）的印刷电路板（10），安装在印刷电路板的相对侧上的第一和第二散热器（20），（30）和夹具 40）将第一，第二散热器和印刷电路板夹在一起。 第一散热器包括一对定位极（24）。 第二散热器包括设置在其中并与其热连接的热管（36）。 夹具包括连接部分（42）和一对弹性按压部分（44）。 夹具将第二散热器弹性地压向主发热电子部件，并且第一散热器经由第一散热器的定位极与第二散热器接合，第一散热器的定位极延伸并与第二散热器接合。

公开(公告)号：US20080098898A1

公开(公告)日：2008-05-01

申请号：US11309918

申请日：2006-10-27

申请人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

发明人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

IPC分类号： B01D19/00

CPC分类号： B01D19/0057 ,  B01D19/0031 ,  B04C3/00 ,  B04C2003/006

摘要： A gas-liquid separation apparatus includes a crust and a separating pipe located in the crust. The crust includes an annular wall and two lids covering two ends of the wall. The crust has a cavity surrounded by the wall and the two lids. An inlet extends through one lid and an outlet extends through the other lid. The separating pipe is disposed in the cavity of the crust and in communication with the inlet and the outlet of the crust. A plurality of apertures is defined in a body of the separating pipe and in communication with a space inside the separating pipe and the cavity of the crust. The liquid with gas dissolved therein enters into the separating pipe via the inlet of the crust. The liquid is degassed by the separating pipe. The de-gassed liquid exits the separating pipe via the outlet of the crust.

摘要翻译： 气液分离装置包括位于地壳中的外壳和分离管。 地壳包括一个环形壁，两个盖子覆盖墙壁的两端。 地壳有一个由墙壁和两个盖子包围的空腔。 入口延伸穿过一个盖子，出口延伸穿过另一个盖子。 分离管设置在地壳的空腔中并与地壳的入口和出口连通。 多个孔被限定在分离管的主体中并且与分离管和地壳的空腔内的空间连通。 溶解有气体的液体通过外壳的入口进入分离管。 液体被分离管脱气。 脱气液体经由外壳的出口离开分离管。

公开(公告)号：US20080062641A1

公开(公告)日：2008-03-13

申请号：US11309849

申请日：2006-10-12

申请人： Cheng-Tien Lai ,  Tao Li ,  Wei-Qiang Tian

发明人： Cheng-Tien Lai ,  Tao Li ,  Wei-Qiang Tian

IPC分类号： H05K7/20

CPC分类号： H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a heat sink, a fan producing an airflow flowing towards the heat sink, an air-guiding member positioned between the fan and the heat sink and a cover enclosing the fan and the heat sink. The air-guiding member includes an air deflector dividing the airflow produced by the fan into two airstreams. The air deflector guides the airstreams of the airflow flowing towards different portions of the heat sink. By the air deflector, the portion of the heat sink, which is hotter than the other portion of the heat sink, has more air flowing therethrough.

公开(公告)号：US07333338B2

公开(公告)日：2008-02-19

申请号：US11308073

申请日：2006-03-05

申请人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

发明人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

IPC分类号： H05K7/20

CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： A memory module assembly (1) includes a printed circuit board (10) having an electronic heat-generating electronic component (40) thereon, a heat sink (20) and a clip (30) for securing the heat sink onto the heat-generating electronic component. The clip includes a pressing portion (32) and a pair of latching portions (33) respectively extending from two ends of the pressing portion. Each latching portion includes a latching leg (332) and a retaining hook section (334) formed at a bottom end of the latching leg. The retaining hook sections tightly engage a bottom face of the printed circuit board and the pressing portion presses the base toward the heat-generating electronic component. The latching legs extend through an opening and a through hole in the printed circuit board. The through hole has a L-shaped configuration and does not communicate with a periphery side of the printed circuit board.

摘要翻译： 存储模块组件（1）包括其上具有电子发热电子部件（40）的印刷电路板（10），散热器（20）和夹子（30），用于将散热器固定在发热 电子元件 夹具包括分别从按压部分的两端延伸的按压部分（32）和一对闩锁部分（33）。 每个闩锁部分包括锁定腿部（332）和形成在锁定腿部的底端处的保持钩部分（334）。 保持钩部分紧密接合印刷电路板的底面，并且按压部分将基部朝向发热电子部件按压。 闩锁腿延伸穿过印刷电路板中的开口和通孔。 通孔具有L形构造，并且不与印刷电路板的周边侧连通。

公开(公告)号：US20070206359A1

公开(公告)日：2007-09-06

申请号：US11308073

申请日：2006-03-05

申请人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

发明人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

IPC分类号： H05K7/20

CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： A memory module assembly (1) includes a printed circuit board (10) having an electronic heat-generating electronic component (40) thereon, a heat sink (20) and a clip (30) for securing the heat sink onto the heat-generating electronic component. The clip includes a pressing portion (32) and a pair of latching portions (33) respectively extending from two ends of the pressing portion. Each latching portion includes a latching leg (332) and a retaining hook section (334) formed at a bottom end of the latching leg. The retaining hook sections tightly engage a bottom face of the printed circuit board and the pressing portion presses the base toward the heat-generating electronic component. The latching legs extend through an opening and a through hole in the printed circuit board. The through hole has a L-shaped configuration and does not communicate with a periphery side of the printed circuit board.

摘要翻译： 存储模块组件（1）包括其上具有电子发热电子部件（40）的印刷电路板（10），散热器（20）和夹子（30），用于将散热器固定在发热 电子元件 夹具包括分别从按压部分的两端延伸的按压部分（32）和一对闩锁部分（33）。 每个闩锁部分包括锁定腿部（332）和形成在锁定腿部的底端处的保持钩部分（334）。 保持钩部分紧密接合印刷电路板的底面，并且按压部分将基部朝向发热电子部件按压。 闩锁腿延伸穿过印刷电路板中的开口和通孔。 通孔具有L形构造，并且不与印刷电路板的周边侧连通。