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公开(公告)号:US11578862B2
公开(公告)日:2023-02-14
申请号:US17577990
申请日:2022-01-18
Applicant: Eaton Intelligent Power Limited
Inventor: Reiner Naumann , Jens Burmeister , Toni Ott
IPC: B29C65/16 , B29C65/44 , B29C65/00 , H05K5/03 , H05K5/06 , B29L31/00 , F21V25/12 , F21V29/503 , F21V29/70 , F21V15/01 , F21V31/00 , F21Y115/10
Abstract: An explosion-proof housing includes at least one metal housing part having at least one of a housing opening or receiving surface, and a support edge bordering said at least one of a housing opening or receiving surface. A cover part covers said at least one of a housing opening or the receiving surface. The cover part includes a peripheral cover edge which is connected to the support edge in an explosion-proof manner such that in the event of an explosion inside the housing, the explosion is prevented from crossing over to an explosive atmosphere surrounding the housing. A plurality of connection points are formed between the support edge and the cover edge. The connection points include interlocking depressions and protrusions. The protrusions are formed by partial melting of the cover edge. The depressions and the protrusions interlock with play in a longitudinal direction of the housing.
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72.
公开(公告)号:US20230043759A1
公开(公告)日:2023-02-09
申请号:US17879280
申请日:2022-08-02
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jihoon KANG , Jongmin KANG , Chungil CHOI
Abstract: An electronic device includes a first housing having a first through-hole, of which a first opening and a second opening are communicated with each other, and a second housing connected to the first housing to be rotatable. A flexible printed circuit board (FPCB) extends from the first housing to the second housing via the first through-hole. The FPCB includes a plurality of layers, a first sealing member disposed in the first through-hole and surrounding the FPCB, and a lamination part toward the first sealing member. A portion of a first layer and/or a second layer corresponding to the second lamination part includes at least one first valley extending from a surface that faces an adjacent layer in a lengthwise direction of the FPCB. The lamination part includes a first adhesive layer interposed between the first layer and the second layer and filling the at least one first valley.
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公开(公告)号:US11576274B2
公开(公告)日:2023-02-07
申请号:US16704318
申请日:2019-12-05
Applicant: Testo SE & Co. KGaA
Inventor: Markus Munzer , Siegfried Stallmann , Meinrad Gotz , Svenja Storz
Abstract: A device (1) for the detecting and registering of measurement data, having a first housing (2) in which electronics (7) are arranged, and having at least one sensor (14), which is electrically connected to the electronics (7). The first housing (2) includes at least two housing parts (3, 4), having at least one metallic connection site and being joined together at the connection site by a gas-tight metal/metal connection. The at least one sensor (13) is arranged in a second housing (11), which encloses the first housing (2) substantially entirely, and which includes at least two housing parts (12, 15), which are detachably joined together or can be so joined.
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公开(公告)号:US11574772B2
公开(公告)日:2023-02-07
申请号:US16836833
申请日:2020-03-31
Applicant: Delta Electronics (Shanghai) CO., LTD
Inventor: Yong Zeng , Jianxing Dong , Qiang Wang , Weijun Wang , Teng Liu
Abstract: A transformer comprises at least two windings and each of the at least two windings includes at least one lead-out wire, and a silicone rubber heat-shrinkable sleeve is wrapped around the outer surface of the lead-out wire. The at least two windings and a portion of the silicone rubber heat-shrinkable sleeve are encapsulated in a potting box with a first potting sealant, and another portion of the silicone rubber heat-shrinkable sleeve is exposed outside of the potting box.
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公开(公告)号:US11570913B2
公开(公告)日:2023-01-31
申请号:US16952441
申请日:2020-11-19
Applicant: MERCEDES-BENZ GROUP AG
Inventor: Bernd Reifenberg
IPC: E05B41/00 , E05B79/06 , E05B81/76 , H05K5/00 , F21S43/19 , E05B85/10 , F21W107/10 , B60R16/03 , H05K5/06
Abstract: The invention concerns a door handle (10) for a vehicle (1), in particular an external door handle (10) for a movable part (2) of the vehicle (1), comprising: a cavity (11) which is at least partially formed by a housing (12) of the door handle (10), and an electronic unit (20), which is received in the cavity (11), wherein the electronic unit (20) comprises a carrier unit (21), in particular an electric circuit board, such as a printed circuit board or a printed circuit, an electric connector unit (30) which comprises at least one electrically conductive connector element (31), in particular comprising at least one contact pin, wherein the at least one connector element (31) is fixed, in particular soldered, welded or glued, to the carrier unit (21) in a material-locking manner.
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公开(公告)号:US11566648B2
公开(公告)日:2023-01-31
申请号:US15776459
申请日:2016-10-27
Applicant: Sumitomo Wiring Systems, Ltd.
Inventor: Koichi Yokotani
IPC: F16B5/06 , F16J13/02 , F16J15/10 , H05K5/06 , F16J13/14 , H05K5/02 , H05K7/14 , F16B5/07 , H05K5/03
Abstract: A seal cover for closing an annular opening portion having locking projections provided on an outer peripheral surface includes a fitting portion having a seal ring (example of a sealing member) fit on an outer peripheral surface and locking portions configured to be pushed and resiliently deformed by the locking projections and move over the locking projections to be locked to the locking projections when the fitting portion is fit into the opening portion. Tapered surfaces for delaying a time point when the locking portions are maximally resiliently deformed from a time point when the seal ring is maximally compressed when the fitting portion is fit and inserted into the opening portion are formed on front end parts of the locking portions in a connecting direction.
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77.
公开(公告)号:US11555118B2
公开(公告)日:2023-01-17
申请号:US16607020
申请日:2017-08-24
Applicant: DOW TORAY CO., LTD.
Inventor: Toyohiko Fujisawa , Masayuki Onishi
IPC: C08L83/04 , C09D183/04 , C09J183/04 , H01L23/29 , H05K5/06
Abstract: Provided is a curable organopolysiloxane composition which has a particularly excellent effect of improving initial adhesiveness in small amounts and a thin layer with respect to various base materials, in addition to being able to achieve particularly excellent adhesive durability and high adhesive strength after curing. The curable organopolysiloxane composition comprises: (A) an organopolysiloxane having at least two alkenyl groups per one molecule; (B) a trialcoxysilyl containing siloxane having one silicon atom-bonded hydrogen atom and at least one trialcoxysilyl group per one molecule; (C) a chain or cyclic organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per one molecule; (D) a chain organopolysiloxane having at least three silicon atom-bonded hydrogen atoms per one molecule; (E) a catalyst for a hydrosilylation reaction; (F) a catalyst for a condensation reaction; and (G) an adhesion promoter.
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公开(公告)号:US20230009440A1
公开(公告)日:2023-01-12
申请号:US17945312
申请日:2022-09-15
Applicant: Sparton DeLeon Springs, LLC
Inventor: Lendon L. Bendix , Derek Turner
Abstract: A printed circuit board assembly (PCBA) controls an electrically initiated device (EID) in an electric field. The PCBA includes a conductive layer, a dielectric layer, and a trans-conductive layer (TCL). The conductive layer of the PCBA designated protected areas. An electrical current with a predetermined current density is impressed in the conductive layer when the PCBA is in the electric field. The TCL is a nickel-metal composite metamaterial positioned between the conductive and dielectric layers and configured to change in shape or thickness in the electric field such that the impressed current is steered away from the conductive layer and into the dielectric layer to prevent premature activation of the EID. A system includes an outer housing, power supply, an EID such as a sonobuoy or medical device, and the PCBA, all of which are encapsulated in the housing. A method is also disclosed for manufacturing the PCBA.
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公开(公告)号:US11553592B2
公开(公告)日:2023-01-10
申请号:US17307300
申请日:2021-05-04
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Ryota Asai , Yosuke Matsushita
IPC: H05K1/11 , H05K1/03 , H05K1/18 , H01L25/00 , H05K3/38 , H01L21/56 , H05K3/46 , H01L21/48 , H01L23/31 , H01L23/498 , H05K3/00 , H05K3/40 , H05K5/06 , H01L23/29 , H01L23/15
Abstract: A ceramic substrate of the present disclosure is a ceramic substrate including a ceramic body having a ceramic layer on a surface thereof and a surface electrode placed on a primary face of the ceramic body. Between the surface electrode and the ceramic layer is an oxide layer made of an insulating oxide having a melting point higher than the firing temperature for the ceramic layer. The oxide layer also extends on the ceramic layer not occupied by the surface electrode. The oxide layer on the ceramic layer not occupied by the surface electrode has a rough surface.
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公开(公告)号:US20220412832A1
公开(公告)日:2022-12-29
申请号:US17929239
申请日:2022-09-01
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jeonggyu JO , Yonghwa KIM , Junghoon PARK
Abstract: An electronic device according to various embodiments of the disclosure includes a front plate configured to form at least a part of a front surface of the electronic device, a speaker disposed in the electronic device, a barometric pressure sensor disposed in the electronic device to measure barometric pressure, a housing configured to form a side surface of the electronic device, and a first slit provided as a gap having a first interval between the housing and an edge portion of the front plate, wherein the housing includes a sound output hole provided at a position at which the speaker is disposed, and a through-hole provided at a position at which the barometric pressure sensor is disposed, and the housing is spaced apart from the front plate to provide a duct configured to connect the through-hole and a sound output passage which is a space for connecting the first slit and the sound output hole. In addition, various other embodiments identified through the specification are possible.
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