公开(公告)号：US5057903A

公开(公告)日：1991-10-15

申请号：US611391

申请日：1990-11-08

Applicant: Michael A. Olla

Inventor： Michael A. Olla

IPC: H01L23/367 ,  H01L23/373 ,  H01L23/433 ,  H01L23/495

CPC classification number: H01L23/49562 ,  H01L23/367 ,  H01L23/3737 ,  H01L23/4334 ,  H01L24/32 ,  H01L2924/14

Abstract: An encapsulated integrated circuit which includes an integrated circuit die having a plurality of electric leads extending from the die. A thermal heat sink is positioned adjacent the die. The heat sink includes a thermoplastic material having a plurality of thermoconductive particles molded therein. A non-electrically conductive plastic material is sealably connected to the heat sink and encloses the die and seals around the leads. The heat sink plastic material is filled approximately 50 percent with metal particles, preferably in the form of powder. The particles may be from a group consisting of copper, aluminum, iron, carbon, aluminum nitride, silicon carbide, and boron nitride. The heat sink and the non-conductive plastic material have coacting interlocking interfaces.

Abstract translation: 一种封装集成电路，其包括具有从模具延伸的多个电引线的集成电路管芯。 热散热器位于模具附近。 散热器包括其中模制有多个热传导颗粒的热塑性材料。 非导电塑料材料可密封地连接到散热器并且封装模具并围绕引线密封。 散热器塑料材料用金属颗粒填充约50％，优选为粉末形式。 颗粒可以来自由铜，铝，铁，碳，氮化铝，碳化硅和氮化硼组成的组。 散热器和非导电塑料具有联合互锁接口。

公开(公告)号：US5049087A

公开(公告)日：1991-09-17

申请号：US604048

申请日：1990-10-26

Applicant: Chang-Hwa Chung ,  Thomas H. Hunter ,  Robert H. Haskell, Jr.

Inventor： Chang-Hwa Chung ,  Thomas H. Hunter ,  Robert H. Haskell, Jr.

IPC: H01R12/79 ,  H01R12/88

CPC classification number: H01R12/79 ,  H01R12/88 ,  Y10T29/49179 ,  Y10T29/49211

Abstract: An electrical connector having first and second coacting parts which include spaced electrical contacts uses a flexible electrical tape having lead ends for connection to a circuit board. Side panels protect the lead ends from damage, during storage and shipment in one position and are releasably connected in a second position to provide support on the leads for bonding. After bonding, the side panels protect the flexible tape from operational damage.

Abstract translation: 具有包括间隔开的电触点的第一和第二共同作用部分的电连接器使用具有用于连接到电路板的引线端的柔性电带。 侧面板在一个位置保护引线端头免受损坏，并且可释放地连接在第二位置以在引线上提供用于接合的支撑。 粘接后，侧面板可保护柔性带免受操作损坏。

公开(公告)号：US5021976A

公开(公告)日：1991-06-04

申请号：US271091

申请日：1988-11-14

Applicant: Alan D. Wexelblat ,  Kim M. Fairchild

Inventor： Alan D. Wexelblat ,  Kim M. Fairchild

IPC: G06F3/023 ,  G06F3/048 ,  G06T11/20

CPC classification number: G06F3/04817 ,  G06T11/206

Abstract: A method and system for generating dynamic, interactive visual representations of information structures within a computer which enable humans to efficiently process vast amounts of information. The boundaries of the information system containing the information to be processed are established and a set of mathematical relationships is provided which indicates the degree of correlation between parameters of interest to a user and segments of information contained within the boundaries. A visual display is generated for the user which has a plurality of different iconic representations and visual features corresponding to the parameters defined by the mathematical relationships. The iconic representations and visual features of the visual display change with the movement of the mathematical relationships within the boundaries of the information system according to the degree of correlation between the parameters of interest and the segment of information through which the mathematical relationships are passing.

Abstract translation: 一种用于生成计算机内的信息结构的动态，交互式视觉表示的方法和系统，其使得人们能够有效地处理大量的信息。 包含要处理的信息的信息系统的边界被建立，并且提供一组数学关系，其指示用户感兴趣的参数与包含在边界内的信息段之间的相关程度。 为具有与由数学关系定义的参数相对应的多个不同标志性表示和视觉特征的用户生成视觉显示。 视觉显示的标志性表示和视觉特征随着信息系统边界内的数学关系的移动，根据感兴趣的参数和数学关系通过的信息段之间的相关程度而变化。

公开(公告)号：US4980580A

公开(公告)日：1990-12-25

申请号：US328656

申请日：1989-03-27

Applicant: Uttam S. Ghoshal

Inventor： Uttam S. Ghoshal

IPC: H03K19/0948 ,  H03K19/195

CPC classification number: H03K19/1952 ,  H03K19/0948 ,  Y10S505/865 ,  Y10S505/866

Abstract: A low-voltage CMOS interconnection circuit utilizing high-Tc superconducting tunnel junctions and interconnects for a very high speed interchip communication at low temperatures (4-77K). An improved driver produces very small current transients and has good immunity to noise from input voltage fluctuations, cross talk and simultaneous switching of drivers. An improved receiver includes a common gate CMOS receiver having a biasing stage and at least one amplifier stage and has the advantage of a large amplification and is self biasing.

Abstract translation: 低压CMOS互连电路采用高Tc超导隧道结和互连，用于在低温（4-77K）的非常高速的芯片间通信。 改进的驱动器产生非常小的电流瞬变，并且具有良好的抗输入电压波动，串扰和驱动器同时切换的噪声。 改进的接收机包括具有偏置级和至少一个放大级的公共栅极CMOS接收器，并且具有大的放大和自偏置的优点。

公开(公告)号：US4978835A

公开(公告)日：1990-12-18

申请号：US396254

申请日：1989-08-21

Applicant: Nicolaas G. Luijtjes ,  Claire T. Galanakis ,  Barry H. Whalen

Inventor： Nicolaas G. Luijtjes ,  Claire T. Galanakis ,  Barry H. Whalen

IPC: B23K1/005 ,  B23K26/18 ,  H01L21/60

CPC classification number: H01L24/80 ,  B23K1/0056 ,  B23K26/18 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14

Abstract: A method of bonding a first plurality of electrical contacts to a second plurality of electrical contacts by aligning the first and second contacts, placing a diaphragm member against the first contacts and applying a differential pressure, such as a vacuum, to the diaphragm in a direction to pull the first contact toward the second contact. Thereafter, the first contacts are bonded to the second contacts with a laser. The diaphragm or a coating on the diaphragm can be a material that absorbs energy from the laser to transfer laser energy to the bond. The diaphragm may be a glass plate or a transparent membrane, may have a support bonded to the first contacts, and may include openings through which the contacts are bonded.

Abstract translation: 一种通过对准第一和第二触点将第一多个电触点接合到第二多个电触点的方法，将隔膜部件抵靠第一触点放置，并将差压（例如真空）施加到隔膜的方向 将第一个触点拉向第二个触点。 此后，用激光将第一触点接合到第二触点。 隔膜或隔膜上的涂层可以是吸收激光能量以将激光能量传递到键的材料。 隔膜可以是玻璃板或透明膜，可以具有接合到第一接触件的支撑件，并且可以包括接触件通过其接合的开口。

公开(公告)号：US4971144A

公开(公告)日：1990-11-20

申请号：US358031

申请日：1989-05-30

Applicant: David A. Gibson ,  Colin A. MacKay ,  Bill Weigler ,  Billy M. Hargis ,  Robert T. Smith

Inventor： David A. Gibson ,  Colin A. MacKay ,  Bill Weigler ,  Billy M. Hargis ,  Robert T. Smith

IPC: F28F3/12 ,  H01L23/473

CPC classification number: F28F3/12 ,  H01L23/473 ,  H01L2924/0002

Abstract: A flexible liquid ribbon cooler for use with electronic components which includes a plurality of elongate thermo-conductive members, which are circular in cross-section, and which are positioned side by side. A bottom and a top layer of thermo-conductive material enclose the bottom and tops of the elongate members and form a plurality of liquid coolant passageways between the elongate members within the layers. The elongate members may be solid cylinders or tubes. A plurality of microcapillaries may be formed in the bottom layer to provide additional thermocoupling, adhesion, and detachability.

Abstract translation: 一种用于电子部件的柔性液体带冷却器，其包括多个细长的热导部件，其横截面为圆形并且并排设置。 底部和顶层的导热材料包围细长构件的底部和顶部并且在层内的细长构件之间形成多个液体冷却剂通道。 细长构件可以是实心圆筒或管。 多个微毛细管可以形成在底层中以提供额外的热偶，粘附和可分离性。

公开(公告)号：US4953924A

公开(公告)日：1990-09-04

申请号：US139319

申请日：1987-12-30

Applicant: Redfield Stephen R. ,  Lambertus Hesselink

Inventor： Redfield Stephen R. ,  Lambertus Hesselink

IPC: B41M5/26 ,  G03H1/02 ,  G03H1/04

CPC classification number: G03H1/0248 ,  Y10S359/90

Abstract: A method for promoting enhanced nondestructive reconstruction of holograms recorded in photorefractive media involves control of the polarization states of the reconstruction beam and the recording beams, control of the cummulative recording energy, and use of a relatively high external field applied across the media during recording which is subsequently reduced during reconstruction. The resulting reconstruction history characteristics are selectively tailored by adjusting the polarization and intensity of the reconstruction beam, the recording geometry, and the applied voltage during reconstruction and recording, and various other parameters. In general, the reconstruction efficiency starts at a relatively high level, initially reduces, and then subsequently grows above the starting value, and can be made substantially nondestructive over a typical reconstruction cycle, with erasure times exceeding forty-five minutes.

Abstract translation: 用于促进在光折射介质中记录的全息图的增强的非破坏性重建的方法包括控制重建光束和记录光束的偏振状态，累积记录能量的控制以及在记录期间在介质上施加的相对高的外部场的使用 在重建期间随后减少。 通过在重建和记录期间调整重建光束的极化和强度，记录几何形状和施加的电压以及各种其它参数来选择性地调整所得到的重建历史特征。 一般来说，重建效率从较高的水平开始，最初降低，然后随后增长到起始值以上，并且可以在典型的重建周期内实现非破坏性，擦除时间超过四十五分钟。

公开(公告)号：US4952275A

公开(公告)日：1990-08-28

申请号：US452458

申请日：1989-12-15

Applicant: Charles W. C. Lin ,  Ian Y. K. Yee

Inventor： Charles W. C. Lin ,  Ian Y. K. Yee

IPC: C23F1/10

CPC classification number: C23F1/10

Abstract: A process and solution for selectively etching copper. The etching is effected by a nonaqueous solution of dimethyl sulfoxide and a halocarbon compound.

Abstract translation: 一种选择性蚀刻铜的工艺和解决方案。 蚀刻由二甲基亚砜和卤代烃化合物的非水溶液进行。

公开(公告)号：US4930216A

公开(公告)日：1990-06-05

申请号：US321500

申请日：1989-03-10

Applicant: Bradley H. Nelson

Inventor： Bradley H. Nelson

IPC: H01L21/60 ,  H01L21/78 ,  H01L23/485

CPC classification number: H01L24/02 ,  H01L21/78 ,  H01L23/485 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/14 ,  Y10T29/49169 ,  Y10T29/49224 ,  Y10T29/49789 ,  Y10T29/4979 ,  Y10T29/49792

Abstract: Integrated circuit dies, while still in wafer form, are prepared for surface mounting direct to a substrate without requiring packaging. Holes are made through a wafer having a plurality of integrated circuit dies and are placed between the dies and adjacent the die pads. A layer of insulating material is placed on the wafer and in the outer periphery of the holes. An electrically conductive connection is made between the top of each pad and the inside of the insulating material in an adjacent hole. The dies are separated from each other and may be surface mounted to a substrate by soldering.

Abstract translation: 准备晶片形式的集成电路裸片可直接用于表面贴装而不需要包装。 孔通过具有多个集成电路管芯的晶片制成，并且被放置在管芯之间并邻近管芯焊盘。 绝缘材料层被放置在晶片上和孔的外周。 在每个垫的顶部和相邻孔中的绝缘材料的内部之间形成导电连接。 模具彼此分离，并且可以通过焊接来表面安装到基板。

公开(公告)号：US4860444A

公开(公告)日：1989-08-29

申请号：US175784

申请日：1988-03-31

Applicant: Dennis J. Herrell ,  David A. Gibson

Inventor： Dennis J. Herrell ,  David A. Gibson

IPC: H01L23/473 ,  H05K7/20

CPC classification number: H01L23/473 ,  H01L2924/0002 ,  Y10T29/49144 ,  Y10T29/49721

Abstract: A package for enclosing, protecting and cooling semiconductor integrated circuit chips. The package includes a generally planar substrate with the chips positioned thereon. Signal connections are provided between at least some of the chips. A heat sink is positioned in contact with the chips and includes microchannels through which a cooling fluid flows for purposes of transferring heat generated by the chips to such fluid. Manifolds are provided to direct the fluid to and from the microchannels, and microcapillary slots may be formed on the heat sink surface adjacent the chips to receive liquid to generate attractive forces between the heat sink and chips to facilitate heat transfer. Circuitry is provided to distribute power through the package and to the chips.

Abstract translation: 封装，保护和冷却半导体集成电路芯片的封装。 该封装包括具有位于其上的芯片的大致平面的基板。 在至少一些芯片之间提供信号连接。 散热器定位成与芯片接触，并且包括微通道，冷却流体流过该通道用于将由芯片产生的热传递到这种流体。 提供歧管以将流体引导到微通道和从微通道引导流体，并且微毛细管狭槽可以形成在与芯片相邻的散热器表面上以接收液体以在散热器和芯片之间产生吸引力以促进热传递。 提供电路以通过封装和芯片分配电力。