公开(公告)号：US08674482B2

公开(公告)日：2014-03-18

申请号：US12273434

申请日：2008-11-18

申请人： Xunqing Shi ,  Bin Xie ,  Chang Hwa Chung

发明人： Xunqing Shi ,  Bin Xie ,  Chang Hwa Chung

IPC分类号： H01L29/40

CPC分类号： H01L23/16 ,  H01L21/76898 ,  H01L23/3128 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06579 ,  H01L2924/00014 ,  H01L2924/1433 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Subject matter disclosed herein may relate to packaging for multi-chip semiconductor devices as may be used, for example, in flash memory devices. In an example embodiment, a semiconductor chip may comprise a through-silicon via and a sidewall pad.

摘要翻译： 本文公开的主题可涉及可用于例如闪存设备中的多芯片半导体器件的封装。 在示例性实施例中，半导体芯片可以包括穿硅通孔和侧壁衬垫。

公开(公告)号：US07902727B1

公开(公告)日：2011-03-08

申请号：US12539315

申请日：2009-08-11

申请人： Man-Lung Sham ,  Ziyang Gao ,  Tung Ching Lui ,  Chang Hwa Chung

发明人： Man-Lung Sham ,  Ziyang Gao ,  Tung Ching Lui ,  Chang Hwa Chung

IPC分类号： H01L41/08

CPC分类号： H02N2/18 ,  A43B3/0015 ,  H01L41/113

摘要： An apparatus and method for generating electricity using piezoelectric material. The apparatus comprises a first elongate member and a second elongate member that are joining together at first and second points which are spaced apart from each other. The second elongate member comprises a piezoelectric element, or has a piezoelectric element mounted thereon. When pressure is applied to the first elongate member, the second elongate member is stretched and the stretching force is applied to the piezoelectric element. This generates electricity. A similar arrangement with a third elongate member may be provided on the other side of the second elongate member. The apparatus may be placed in a shoe or underneath a floor, so that the variation in pressure caused by walking may be used in generate electricity.

摘要翻译： 一种使用压电材料发电的装置和方法。 该装置包括在彼此间隔开的第一和第二点处接合在一起的第一细长构件和第二细长构件。 第二细长构件包括压电元件，或者安装有压电元件。 当对第一细长构件施加压力时，拉伸第二细长构件并将拉伸力施加到压电元件。 这产生电力。 与第三细长构件类似的布置可以设置在第二细长构件的另一侧上。 该装置可以放置在鞋中或在地板下方，从而可以将用于步行的压力变化用于发电。

公开(公告)号：US20090294931A1

公开(公告)日：2009-12-03

申请号：US12538296

申请日：2009-08-10

申请人： Man-Lung Sham ,  Huili Fu ,  Chang-Hwa Chung

发明人： Man-Lung Sham ,  Huili Fu ,  Chang-Hwa Chung

IPC分类号： H01L23/552 ,  H01L21/56

CPC分类号： H01L23/13 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/315 ,  H01L23/552 ,  H01L23/564 ,  H01L24/48 ,  H01L25/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic component package having an EMI shielded space is disclosed. The package comprises a substrate having an electronic component located on its surface and a conductive enclosure having a top and downwardly extending sides enclosing the component and defining a shielded space. A vent opening is provided through the substrate and is located in the shielded space for venting the shielded space. A second vent opening may be provided in the top of the conductive enclosure.

摘要翻译： 公开了具有EMI屏蔽空间的电子部件封装。 封装包括具有位于其表面上的电子部件的基板和导电外壳，其具有包围该部件的顶部和向下延伸的侧面并限定屏蔽空间。 通气孔设置在基板上，并位于屏蔽空间中，用于排出屏蔽空间。 可以在导电外壳的顶部设置第二通气口。

公开(公告)号：US20110245627A1

公开(公告)日：2011-10-06

申请号：US12749906

申请日：2010-03-30

申请人： Lydia Lap Wai Leung ,  Luis Ng ,  Kwan Wai To ,  Chi Tin Luk ,  Chang Hwa Chung

发明人： Lydia Lap Wai Leung ,  Luis Ng ,  Kwan Wai To ,  Chi Tin Luk ,  Chang Hwa Chung

IPC分类号： A61B5/00 ,  G06Q50/00 ,  G06Q10/00 ,  G06F13/10

CPC分类号： G06Q50/22 ,  G16H10/65

摘要： An electronic health record storage device is provided. The device is configured for operation in conjunction with a host device to generate and store health record data about a user. According to one embodiment, the system comprises memory including executable instructions stored in the memory, the executable instructions including an autorun file and operating instructions; one or more sensors configured for engagement by the user; an interface configured for interfacing with a host device; and a controller in operable communication with the memory, the one or more sensors, and the interface, and wherein the controller is configured to execute the executable instructions stored in the memory, the controller further configured to receive power from the host device, retrieve data from the host device, receive health data from the one or more sensors, generate a health record comprising timing data and health data, and store the health record in the memory.

摘要翻译： 提供一种电子健康记录存储装置。 该设备被配置为与主机设备一起操作以生成和存储关于用户的健康记录数据。 根据一个实施例，系统包括存储器中存储的可执行指令的存储器，包括自动运行文件和操作指令的可执行指令; 被配置为用户接合的一个或多个传感器; 被配置为与主机设备接口的接口; 以及控制器，其与所述存储器，所述一个或多个传感器和所述接口可操作地通信，并且其中所述控制器被配置为执行存储在所述存储器中的所述可执行指令，所述控制器还被配置为从所述主机设备接收电力， 从主机设备接收来自一个或多个传感器的健康数据，生成包括定时数据和健康数据的健康记录，并将健康记录存储在存储器中。

公开(公告)号：US20100123241A1

公开(公告)日：2010-05-20

申请号：US12273434

申请日：2008-11-18

申请人： Xunqing Shi ,  Bin Xie ,  Chang Hwa Chung

发明人： Xunqing Shi ,  Bin Xie ,  Chang Hwa Chung

IPC分类号： H01L23/04 ,  H01L21/00

CPC分类号： H01L23/16 ,  H01L21/76898 ,  H01L23/3128 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06579 ,  H01L2924/00014 ,  H01L2924/1433 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Subject matter disclosed herein may relate to packaging for multi-chip semiconductor devices as may be used, for example, in flash memory devices. In an example embodiment, a semiconductor chip may comprise a through-silicon via and a sidewall pad.

摘要翻译： 本文公开的主题可涉及可用于例如闪存设备中的多芯片半导体器件的封装。 在示例性实施例中，半导体芯片可以包括穿硅通孔和侧壁衬垫。

公开(公告)号：US20090189269A1

公开(公告)日：2009-07-30

申请号：US12019413

申请日：2008-01-24

申请人： Lap-Wai Lydia Leung ,  Chang Hwa Chung ,  Jie Liu ,  Chi Kuen Leung ,  Chiu Lun Chan

发明人： Lap-Wai Lydia Leung ,  Chang Hwa Chung ,  Jie Liu ,  Chi Kuen Leung ,  Chiu Lun Chan

IPC分类号： H05K1/00 ,  H01L23/48

CPC分类号： H05K1/0243 ,  H01L23/3121 ,  H01L23/5387 ,  H01L23/66 ,  H01L24/28 ,  H01L24/48 ,  H01L25/0655 ,  H01L25/16 ,  H01L2224/48195 ,  H01L2924/00014 ,  H01L2924/078 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/3011 ,  H05K1/189 ,  H05K3/284 ,  H05K2201/10045 ,  H05K2201/1006 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A electronic circuit package having a flexible substrate with metals layers on one or more of its surfaces forming a wiring pattern and/or surface mount bonding pads. Passive electronic components are integrated onto component packages that are mounted to the flexible substrate and electrically connected with the wiring pattern or bonding pad. An active electronic device is mounted on the flexible substrate or bonding pad.

摘要翻译： 一种电子电路封装，其具有在其一个或多个表面上具有金属层的柔性基板，形成布线图案和/或表面贴装焊盘。 无源电子部件被集成到组件封装上，其安装到柔性衬底并与布线图案或焊盘电连接。 有源电子器件安装在柔性基底或接合垫上。

公开(公告)号：US08138577B2

公开(公告)日：2012-03-20

申请号：US12057241

申请日：2008-03-27

申请人： Xunqing Shi ,  Wei Ma ,  Bin Xie ,  Chang Hwa Chung

发明人： Xunqing Shi ,  Wei Ma ,  Bin Xie ,  Chang Hwa Chung

IPC分类号： H01L23/538 ,  H01L21/44

CPC分类号： H01L21/76898 ,  H01L21/6835 ,  H01L24/13 ,  H01L24/27 ,  H01L24/29 ,  H01L24/81 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68359 ,  H01L2224/0401 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/0557 ,  H01L2224/056 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/8182 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/0106 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2924/00014 ,  H01L2924/013

摘要： There is described a method of forming a through-silicon-via to form an interconnect between two stacked semiconductor components using pulsed laser energy. A hole is formed in each component, and each hole is filled with a plug formed of a first metal. One component is then stacked on another component such that the holes are in alignment, and a pulse of laser energy is applied to form a bond between the metal plugs.

摘要翻译： 描述了形成穿硅通孔以形成使用脉冲激光能量的两个堆叠的半导体部件之间的互连的方法。 在每个部件中形成孔，并且每个孔填充有由第一金属形成的塞子。 然后将一个部件堆叠在另一部件上，使得孔对准，并且施加激光能量的脉冲以在金属插塞之间形成结合。

公开(公告)号：US08031484B2

公开(公告)日：2011-10-04

申请号：US11454356

申请日：2006-06-16

申请人： Huili Fu ,  Man Lung Sham ,  Chang-Hwa Chung

发明人： Huili Fu ,  Man Lung Sham ,  Chang-Hwa Chung

IPC分类号： H05K7/02 ,  H05K7/04

CPC分类号： H01L23/3128 ,  H01L23/3677 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An IC package includes a substrate and a plurality of thermal dissipating vias perforating the substrate. The substrate includes a power plane, a ground plane, and a dielectric layer disposed between the power plane and the ground plane. The power plane includes a power region and a non-power region isolated from each other. The thermal dissipating vias are connected to the non-power regions of the power plane and to the ground plane.

摘要翻译： IC封装包括基板和穿过基板的多个散热通孔。 基板包括电源平面，接地平面和布置在电源平面和接地平面之间的电介质层。 电力平面包括彼此隔离的功率区域和非功率区域。 散热通孔连接到电源平面和接地平面的非功率区域。

公开(公告)号：US08030208B2

公开(公告)日：2011-10-04

申请号：US12131777

申请日：2008-06-02

申请人： Chi Kuen Vincent Leung ,  Peng Sun ,  Xunqing Shi ,  Chang Hwa Chung

发明人： Chi Kuen Vincent Leung ,  Peng Sun ,  Xunqing Shi ,  Chang Hwa Chung

IPC分类号： H01L21/4763

CPC分类号： B23K1/0016 ,  H01L21/76898 ,  H01L23/481 ,  H01L25/0657 ,  H01L25/50 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/00

摘要： There is described a bonding method for through-silicon-via bonding of a wafer stack in which the wafers are formed with through-silicon-vias and lateral microchannels that are filled with solder. To fill the vias and channels the wafer stack is placed in a soldering chamber and molten solder is drawn through the vias and channels by vacuum. The wafers are held together by layers of adhesive during the assembly of the wafer stack. Means are provided for local reheating of the solder after it has cooled to soften the solder to enable it to be removed from the soldering chamber.

摘要翻译： 描述了晶片叠层的硅 - 硅 - 通孔结合的接合方法，其中晶片形成有填充有焊料的通硅通孔和侧向微通道。 为了填充通孔和通道，将晶片堆叠放置在焊接室中，并且熔融的焊料通过真空通过通孔和通道。 在晶片堆叠的组装期间，晶片通过粘合剂层保持在一起。 提供用于在焊料冷却以软化焊料以使其能够从焊接室除去的焊料的局部再加热的装置。

公开(公告)号：US07683459B2

公开(公告)日：2010-03-23

申请号：US12131788

申请日：2008-06-02

申请人： Wei Ma ,  Xunqing Shu ,  Chang Hwa Chung

发明人： Wei Ma ,  Xunqing Shu ,  Chang Hwa Chung

IPC分类号： H01L29/40 ,  H01L21/00

CPC分类号： H01L23/481 ,  H01L21/6836 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/6834 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/83194 ,  H01L2224/9202 ,  H01L2224/9205 ,  H01L2224/9212 ,  H01L2224/94 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/05552

摘要： There is described a hybrid bonding method for through-silicon-via based wafer stacking. Patterned adhesive layers are provided to join together adjacent wafers in the stack, while solder bonding is used to electrically connect the vias. The adhesive layers are patterned to enable outgassing and to provide stress relief.

摘要翻译： 描述了用于基于硅通孔的晶片堆叠的混合结合方法。 提供图案化的粘合剂层以将堆叠中的相邻晶片连接在一起，同时使用焊接来电连接通孔。 图案化粘合剂层以能够脱气并提供应力消除。