Abstract:
A manufacturing method for a detection apparatus is provided. The method includes depositing a first impurity semiconductor layer and a first intrinsic semiconductor layer in this order on a plurality of first electrodes arranged in an array above a substrate. The method also includes patterning the first intrinsic semiconductor layer and the first impurity semiconductor layer and thereby dividing the first intrinsic semiconductor layer and the first impurity semiconductor layer so as to cover each of the plurality of first electrodes separately. The method further includes depositing a second intrinsic semiconductor layer on the patterned first intrinsic semiconductor layer.
Abstract:
A detecting apparatus formed on a substrate, includes a plurality of pixels arranged in a matrix, and a signal line electrically connected to the pixels. Each of the pixels includes a sensing element that converts radiant ray or light to electric charges, an amplification thin film transistor that outputs an electric signal based on an amount of the electric charges, a capacitor that holds an electric signal output by the amplification thin film transistor, and a transfer thin film transistor that transfers an electric signal held in the capacitor to the signal line.
Abstract:
A detection apparatus includes a plurality of pixels and a plurality of signal wires arranged on a substrate, in which each of the plurality of pixels includes a switch element arranged on the substrate and a conversion element arranged on the switch element, the conversion element includes a first electrode which is arranged on the switch element and electrically connected to the switch element and a semiconductor layer arranged over a plurality of the first electrodes, and a plurality of the switch elements is electrically connected to the plurality of signal wires, and the detection apparatus further includes a constant potential wire which is supplied with a constant potential, in which the first electrode is electrically connected to the constant potential wire in apart of pixels among the plurality of pixels.
Abstract:
A detection apparatus includes a substrate which includes a plurality of pixels arranged in a matrix and adapted to generate pixel signals, a plurality of drive lines arranged in a column direction and each connected in common to a plurality of pixels in a row direction, a plurality of data lines arranged in the row direction and each connected in common to a plurality of pixels in the column direction, connection terminals smaller in number than the data lines, and a multiplexer unit provided between the connection terminals and the data lines; a read circuit provided with a reset switch for supplying a constant potential to the connection terminals and connected to the connection terminals; a drive circuit adapted to control driving of the plurality of pixels; and a control circuit adapted to supply a control signal to the substrate and the read circuit.
Abstract:
An imaging apparatus includes: a plurality of pixels each of which includes a conversion element and a first transistor of which one of a source and a drain is connected to the conversion element; and a second transistor which is shared by the plurality of pixels and has a gate connected respectively to the other of the source and the drain of the first transistor of each of the plurality of pixels. At least one among the gate, a source, a drain and a channel portion of the second transistor is formed to be extended over the plurality of pixels, and the conversion element is arranged over the first and second transistors.
Abstract:
A radiation detection apparatus includes an obtaining unit configured to obtain information representing a setting of a target region that is a target of automatic exposure control, and information representing a radiation transmission characteristic of an object corresponding to the target region, a setting unit configured to set a candidate region based on the target region, a monitoring unit configured to monitor a radiation dose during incidence in the candidate region, a specifying unit configured to specify, as a detection region, a region where the monitored radiation dose falls within a range determined in accordance with the radiation transmission characteristic, and an output unit configured to output the radiation dose monitored in the detection region.
Abstract:
A radiation imaging apparatus comprises at least one first detection element including a first conversion element configured to convert radiation into an electrical signal and a first switch configured to connect an output from the first conversion element to a first signal line, at least one second detection element including a second conversion element configured to convert radiation into an electrical signal and a second switch configured to connect an output from the second conversion element to a second signal line, a readout unit configured to read out signals appearing on the first signal line and the second signal line, and a signal processing circuit configured to process a signal read out from the readout unit. A sensitivity of the first conversion element for the radiation is set to be different from a sensitivity of the second conversion element for the radiation.
Abstract:
A radiation imaging apparatus includes a first pixel, and a second pixel whose sensitivity for radiation is lower than sensitivity of the first pixel; and a decision unit configured to execute a reset operation of resetting charges in the pixels and a decision operation of deciding a radiation dose during irradiation to the apparatus. In the decision operation, the decision unit reads out signals from the first and second pixels at least once, and decides first and second correction values based on the signal read out from the first and second pixel respectively, and reads out signals from the first and second pixels after receiving a radiation irradiation start request, and decides the radiation dose during irradiation to the apparatus using values of the signals read out from the first and second pixels and the first and second correction values.
Abstract:
The present invention provides a technique advantageous in suitably determining the irradiation end timing in a radiation imaging apparatus that can perform AEC. The radiation imaging apparatus comprises a sensor configured to detect radiation and a control unit, wherein the control unit generates, after the start of radiation irradiation, an evaluation value indicating the stability of a radiation irradiation intensity based on a sensor signal from the sensor, and the control unit outputs, in response to the evaluation value satisfying a predetermined condition, a signal indicating that the radiation irradiation intensity has stabilized.
Abstract:
An imaging region including a plurality of detection elements each including a conversion element configured to convert radiation into an electric signal, a first signal line, and a signal processing circuit configured to process a signal output via the first signal line, wherein the plurality of detection elements include a first detection element and a second detection element which are connected to the first signal line, a sensitivity of the first detection element to radiation is set to be different from a sensitivity of the second detection element to radiation, and the signal processing circuit generates information related to irradiation of radiation to the imaging region based on signals from the first detection element and the second detection element which are connected to the first signal line.