Abstract:
An optoelectronic assembly includes an optoelectronic component having a surface light source for emitting a light on a substrate which is at least partly transmissive for the light emitted by the surface light source, wherein the optoelectronic component includes at least one first main emission surface and a second main emission surface wherein the second main emission surface is situated opposite the first main emission surface, and a reflective structure which is arranged at least partly in the beam path of the light emitted by the surface light source and is designed to reflect at least part of the light impinging on the reflective structure in the direction of the substrate, such that a laterally offset image of the surface light source is generatable. The reflective structure and the optoelectronic component are arranged at a distance from one another in a range of approximately 1 mm to approximately 1000 mm.
Abstract:
Various embodiments may relate to an optoelectronic component and a method for producing an optoelectronic component. In various embodiments, an optoelectronic component is provided, the optoelectronic component, including an optically active structure, which is designed for receiving and/or providing electromagnetic radiation, and at least one scattering structure, which is formed in the beam path of the electromagnetic radiation on or above the optically active structure. The scattering structure is designed such that the directional characteristic of the electromagnetic radiation can be electrically modified.
Abstract:
An optoelectronic component may include an electrically conductive carrier structure having a first contact section and a carrier section, an organic functional layer structure which is formed above the carrier structure and which overlaps the carrier section and which does not overlap the first contact section, an electrically conductive covering structure, which is formed above the organic functional layer structure and which includes a covering section and a second contact section, wherein the covering section overlaps the organic functional layer structure and the carrier section, wherein the first contact section projects below the organic functional layer structure on a first side and on a third side of the optoelectronic component.
Abstract:
Various embodiments may relate to an optoelectronic component, including an organic functional layer structure, and an electrode on or above the organic functional layer structure. The electrode is electrically conductively coupled to the organic functional layer structure. The electrode includes an optically transparent or translucent matrix including at least one matrix material, and particles embedded into the matrix. The particles have a refractive index that is greater than the refractive index of the at least one matrix material. A difference in refractive index between the at least one matrix material and the particles embedded into the matrix is at least 0.05.
Abstract:
Various embodiments may relate to an optoelectronic component and a method for producing an optoelectronic component. In various embodiments, an optoelectronic component is provided, the optoelectronic component, including an optically active structure, which is designed for receiving and/or providing electromagnetic radiation, and at least one scattering structure, which is formed in the beam path of the electromagnetic radiation on or above the optically active structure. The scattering structure is designed such that the directional characteristic of the electromagnetic radiation can be electrically modified.