公开(公告)号：US06504108B1

公开(公告)日：2003-01-07

申请号：US10040347

申请日：2001-12-28

申请人： Nick Lin

发明人： Nick Lin

IPC分类号： H05K116

CPC分类号： H05K7/1007 ,  H01R4/028 ,  H01R12/57 ,  H05K3/303 ,  H05K3/3436 ,  H05K2201/10568 ,  H05K2201/10734 ,  H05K2201/2036 ,  Y02P70/613

摘要： A ball grid array (BGA) socket (5) includes an insulative member (52), a number of conductive contacts (54) attached to the insulative member in an array and a number of solder balls (56) respectively attached to corresponding conductive contacts and arranged in an array in accordance with the conductive contacts. The insulative member provides a number of stand-offs (60) on the mounting surface thereof and located in the array of the solder balls. When the BGA socket is located on a printed circuit board (PCB, 80) and heated, the solder balls become soft or melted and the insulative member sinks until the stand-offs bear against the PCB. Since the stand-offs are located in the array of the solder balls, the solder balls are not spaced from the PCB too close or too far, therefore the solder balls close a center of the connector may not be disconnected from corresponding solder pads or interconnect with the adjacent solder balls.

摘要翻译： 球栅阵列（BGA）插座（5）包括绝缘构件（52），多个导体触点（54），其以阵列方式附接到绝缘构件，并且多个焊球（56）分别附接到相应的导电触头 并且根据导电触点排列成阵列。 绝缘构件在其安装表面上提供多个位置（60）并位于焊球的阵列中。 当BGA插座位于印刷电路板（PCB，80）上并加热时，焊球变软或熔化，绝缘构件下沉，直到支座抵靠PCB。 由于支架位于焊球的阵列中，所以焊球与PCB间隔不太近或太远，因此关闭连接器中心的焊球可能不会与相应的焊盘或互连 与相邻的焊球。

公开(公告)号：US06340309B1

公开(公告)日：2002-01-22

申请号：US09797629

申请日：2001-03-01

申请人： Nick Lin ,  Bono Liao

发明人： Nick Lin ,  Bono Liao

IPC分类号： H01R450

CPC分类号： H05K7/1007 ,  Y10S439/923

摘要： A ZIF socket (1) on which a CPU (2) is mounted. The CPU (2) has a plurality of pins (21) extending through a cover (11) into a base (12) of the socket for electrically engaging with contacts (110) received in the base. The cover defines two slots (1112) in two opposite sides of a top face thereof. The slots are located below two side edges of the CPU, whereby there is more space for a user's fingers to grip the CPU to pull it away from the socket in order to replace CPU with another one.

摘要翻译： 安装有CPU（2）的ZIF插座（1）。 CPU（2）具有穿过盖（11）延伸到插座的基座（12）中的多个销（21），用于与容纳在基座中的触点（110）电接合。 盖子在其顶面的两个相对侧限定了两个槽（1112）。 这些插槽位于CPU的两个侧边下方，因此用户的手指有更多的空间来抓住CPU将其从插座中拉出，以便用另一个CPU替换CPU。

公开(公告)号：US06299470B1

公开(公告)日：2001-10-09

申请号：US09751556

申请日：2000-12-29

申请人： Nick Lin ,  Bono Liao

发明人： Nick Lin ,  Bono Liao

IPC分类号： H01R450

CPC分类号： H01R4/5008 ,  H01R13/193

摘要： A contact (10) for a ZIF PGA socket (20) includes a horizontal single-beam contact portion (12) and an elongated mounting portion (11) depending from the contact portion. The mounting portion includes a fixing portion (16) for fixing to the socket, a leg (19) depending from the fixing portion for extending through the socket and electrically communicating with a circuit board, and a neck (14) integrally connecting the contact portion and the fixing portion. The neck is substantially narrower than the fixing portion and the contact portion, thus allowing the contact portion to twist about a central vertical axis of the contact and to be displaced relative to the fixing portion. The contact portion can thereby rotatably contact and resiliently press against a corresponding pin (30) of a mating PGA device.

摘要翻译： 用于ZIF PGA插座（20）的接触件（10）包括水平单梁接触部分（12）和从接触部分悬垂的细长安装部分（11）。 安装部分包括用于固定到插座的固定部分（16），从固定部分延伸穿过插座并与电路板电连通的腿部（19），以及将接触部分 和固定部。 颈部基本上比固定部分和接触部分窄，从而允许接触部分围绕接触件的中心垂直轴线扭转并且相对于固定部分移位。 因此，接触部分可以可旋转地接触并弹性压靠配合PGA装置的相应销（30）。

公开(公告)号：US06231406B1

公开(公告)日：2001-05-15

申请号：US09686318

申请日：2000-10-10

申请人： Nick Lin ,  Hsin-Yu Yu

发明人： Nick Lin ,  Hsin-Yu Yu

IPC分类号： H01R1302

CPC分类号： H01R13/193

摘要： A contact strip includes a number of conductive contacts (4), a contact carrier (5) and a corresponding number of links (6) connecting corresponding contacts to the contact carrier. Each contact includes a contact portion (42) and a soldering portion (43) opposite the contact portion for attaching a solder ball for soldering to a printed circuit board. The contact portion is plated with gold using a molten gold plating liquid for enhancing electrical/mechanical characteristics of the contact portion. Each link defines a longitudinal slot (61) for obstructing a wicking path from the contact to the contact carrier. Furthermore, an elongate opening (52) is defined in the contact carrier above and perpendicular to a corresponding slot to further prevent the plating liquid from wicking up to the contact carrier, thereby preventing loss of the expensive plating liquid and reducing the cost of the contact.

摘要翻译： 触点条包括多个导电触点（4），触点支架（5）和相应数量的将相应的触头连接到触点支架的连杆（6）。 每个触点包括与接触部分相对的接触部分（42）和焊接部分（43），用于将用于焊接的焊球附接到印刷电路板。 接触部分使用熔融镀金液镀金，以增强接触部分的电/机械特性。 每个连杆限定用于阻塞从触点到接触托架的芯吸路径的纵向槽（61）。 此外，在接触载体上在垂直于相应的槽的上方形成有细长的开口（52），以进一步防止电镀液液滴到接触载体上，从而防止昂贵的电镀液的损失并降低接触的成本 。

公开(公告)号：US06186815B1

公开(公告)日：2001-02-13

申请号：US09303099

申请日：1999-04-29

申请人： Nick Lin

发明人： Nick Lin

IPC分类号： H01R13625

CPC分类号： H01R13/193 ,  H01R12/89

摘要： A zero insertion force (ZIF) socket for electrically connecting an electronic package and a mother board, comprises an insulative cover, a driving device, an insulative base defining a number of engaging slots therein and at least two types of engaging terminals received in the corresponding engaging slots. The engaging terminals or rows of the engaging slots are each offset relative to each other. Thus, electrical contacts are established between the engaging terminals and conductive terminals of the electronic package at different times thereby effectively lowering the operating resistance of the ZIF socket.

摘要翻译： 用于电连接电子封装和母板的零插入力（ZIF）插座包括绝缘盖，驱动装置，在其中限定多个接合槽的绝缘基座和在相应的接头中接收的至少两种接合端子 接合槽。 接合端子或接合槽的排各自相对于彼此偏移。 因此，在不同时间在电子封装的接合端子和导电端子之间建立电接触，从而有效地降低了ZIF插座的工作电阻。

公开(公告)号：US6113412A

公开(公告)日：2000-09-05

申请号：US360925

申请日：1999-07-26

申请人： Nick Lin

发明人： Nick Lin

IPC分类号： H01R13/193 ,  H05K7/10 ,  H01R13/625

CPC分类号： H01R13/193 ,  H05K7/1007

摘要： An electrical connector comprises a dielectric base defining a number of contact receiving slots therein, a slidable cover fixed to the base and defining a number of pin receiving holes for receiving corresponding pins of an IC package therein, and a number of contacts received in the corresponding contact receiving slots of the base. Each contact comprises a U-shaped, non-symmetrical guiding portion for guiding a corresponding pin of the IC package to electrically connect with the contact, a contact portion comprising a pair of contact tabs extending from free ends of the guiding portion and defining a gap for engaging the corresponding pin of the IC package, a main body connected to the guiding portion for supporting the contact, and a solder pad extending from a lower edge of the main body for being surface mounted to a circuit board. The guiding portion forms a coined convex collar section on an upper edge between which the corresponding pin of the IC package is inserted into a collar chamber defined within the guiding portion. When the cover is driven to slide, the coined convex collar sections smoothly guide the pins of the IC package to enter into the gap between the contact tabs and decrease frictional resistance exerted on the pins by the contacts.

摘要翻译： 电连接器包括限定其中的多个触点接收槽的电介质基座，固定到基座并限定多个针接收孔的滑动盖，用于接收其中的IC封装的相应引脚，以及在相应的接收孔中接收的多个触点 接触底座的接收槽。 每个接触件包括用于引导IC封装的对应引脚以与触头电连接的U形非对称引导部分，接触部分包括从引导部分的自由端延伸并限定间隙 用于接合IC封装的相应引脚，连接到用于支撑触点的引导部分的主体，以及从主体的下边缘延伸的用于表面安装到电路板的焊盘。 引导部分在上边缘上形成一个凸起的凸起凸缘部分，IC封装的相应的引脚插入在该引导部分中限定的凸缘室中。 当盖被驱动滑动时，打印的凸环部分平滑地引导IC封装的引脚进入接触片之间的间隙，并减小由触点施加在引脚上的摩擦阻力。

公开(公告)号：US6056558A

公开(公告)日：2000-05-02

申请号：US298980

申请日：1999-04-22

申请人： Nick Lin ,  Shih-Tsang Yang

发明人： Nick Lin ,  Shih-Tsang Yang

IPC分类号： H01R4/02 ,  H05K3/34 ,  H01R12/04 ,  H01R12/32 ,  H01R1/00

CPC分类号： H01R12/57 ,  H05K3/3426 ,  Y02P70/613

摘要： An electrical connector includes an insulative housing and a number of compound terminals for connecting a CPU to a circuit board. Each terminal has an arcuate engaging section whereby a solder ball can be easily positioned within the engaging section. Thus, assembly is expedited and proper signal transmission is ensured.

摘要翻译： 电连接器包括绝缘壳体和用于将CPU连接到电路板的多个复合端子。 每个端子具有弧形接合部分，由此焊球可以容易地定位在接合部分内。 因此，加快了组装，确保了适当的信号传输。