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公开(公告)号：US20220093317A1
公开(公告)日：2022-03-24
申请号：US17116094
申请日：2020-12-09
发明人： Chan YOON , Dong Hwan LEE , Dong Jin LEE , Sang Soo PARK
摘要： A coil component includes a body, a coil portion disposed in the body, and first and second external electrodes disposed on the body to be spaced apart from each other, wherein A/C≥2.4 and B/C≥1.6 are satisfied, where a length, a width, and a thickness of the coil component are defined as ‘A’, ‘B’, and ‘C’, respectively, and a ratio of a thickness to a width of at least one turn of the coil portion is 1 or less, based on a cross-section of the coil component.
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公开(公告)号：US20220020523A1
公开(公告)日：2022-01-20
申请号：US17116091
申请日：2020-12-09
发明人： Chan YOON , Dong Hwan LEE , Dong Jin LEE , Sang Soo PARK
摘要： A coil component includes a body, a planar spiral-shaped coil portion disposed in the body, a lead portion disposed to be spaced apart from the coil portion in the body, a support substrate disposed between the coil portion and the lead portion to correspond to the lead portion, a via penetrating through the support substrate to connect an internal end portion of the coil portion and an internal end portion of the lead portion to each other, an insulating layer covering the coil portion and the lead portion, and a first external electrode and a second external electrode disposed to be spaced apart from each other on a surface of the body and connected to the external end portion of each of the coil portion and the lead portion.
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公开(公告)号：US20210375535A1
公开(公告)日：2021-12-02
申请号：US16990273
申请日：2020-08-11
发明人： Hye Mi YOO , Dong Hwan LEE , Hwi Dae KIM , Sang Soo PARK , Chan YOON , Dong Jin LEE
摘要： A coil component includes a winding-type coil including a coil portion and first and second lead-out portions respectively connected to the coil portion; a body in which the winding-type coil is disposed, the first and second lead-out portions of the winding-type coil exposed from the body; a noise removal portion including a pattern portion spaced apart from a metal wire of the winding-type coil in the body and having both end portions spaced apart from each other to have an open-loop, and a third lead-out portion connected to the pattern portion and exposed from the body; an insulating layer disposed between the winding-type coil and the noise removal portion; and first to third external electrodes arranged on the body to be spaced apart from each other and respectively connected to the first to third lead-out portions.
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公开(公告)号：US20210027947A1
公开(公告)日：2021-01-28
申请号：US16778673
申请日：2020-01-31
发明人： Hwi Dae KIM , Sang Soo PARK , Chan YOON , Woo Chul SHIN , Ji Hong JO
摘要： A multilayer capacitor includes a capacitor body having an active region, upper and lower cover regions, and width margins on opposing sides of the active region. The width margin includes a first region on an internal side thereof adjacent the first and second internal electrodes and a second region on an external side between the first region and a respective external surface of the capacitor body, and he upper and lower cover regions each include a third region on an internal side thereof adjacent the internal electrodes and a fourth region on an external side between the third region and a respective external surface of the capacitor body. The active region, the second region, and the fourth region have a same dielectric constant A, and the first and third regions have a same dielectric constant B, and A and B are different from each other and satisfy 0.5≤B/A.
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公开(公告)号：US20200118764A1
公开(公告)日：2020-04-16
申请号：US16572068
申请日：2019-09-16
发明人： Ho Yoon KIM , Sang Soo PARK , Woo Chul SHIN
摘要： A multilayer ceramic electronic component array includes a plurality of multilayer ceramic electronic components including a ceramic body including a dielectric layer and first and second internal electrodes, and first and second external electrodes, respectively; and an interposer including an insulating body disposed below the plurality of multilayer ceramic electronic components, a first terminal electrode disposed on the insulating body and connected to at least a portion of the respective first external electrodes of the plurality of multilayer ceramic electronic components, and a second terminal electrode disposed on the insulating body and connected to at least a portion of the respective second external electrodes of the plurality of multilayer ceramic electronic components. The first external electrodes of the plurality of multilayer ceramic electronic components are in electrical contact with each other, and the second external electrodes of the plurality of multilayer ceramic electronic components are in electrical contact with each other.
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公开(公告)号：US20200118763A1
公开(公告)日：2020-04-16
申请号：US16201607
申请日：2018-11-27
发明人： Ki Young KIM , Beom Joon CHO , Sang Soo PARK , Woo Chul SHIN
摘要： A multilayer ceramic electronic component array includes: a plurality of multilayer ceramic electronic components; a first terminal structure electrically connected to first external electrodes of each of the plurality of multilayer ceramic electronic components; a second terminal structure electrically connected to second external electrodes of each of the plurality of multilayer ceramic electronic components; a first conductive bonding member bonding the first external electrodes of each of the plurality of multilayer ceramic electronic components and the first terminal structure; a second conductive bonding member bonding the second external electrodes of each of the plurality of multilayer ceramic electronic components and the second terminal structure; and a ceramic bonding member contacting first surfaces of each of the ceramic bodies of each of the plurality of multilayer ceramic electronic components and disposed to extend to second surfaces of each of the ceramic bodies.
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公开(公告)号：US20200105472A1
公开(公告)日：2020-04-02
申请号：US16198473
申请日：2018-11-21
发明人： Seung Woo SONG , Min Gon LEE , Sang Soo PARK , Jin Man JUNG , Woo Chul SHIN , Jin Kyung JOO
摘要： A multilayer ceramic electronic component includes a ceramic body including a dielectric layer, and a first internal electrode and a second internal electrode facing each other with the dielectric layer interposed therebetween, and a first external electrode electrically connected to the first internal electrode, and a second external electrode electrically connected to the second internal electrode, disposed in an outer portion of the ceramic body, the first and second external electrodes comprise a first electrode layer including a conductive metal, a first plating layer disposed on the first electrode layer and including nickel (Ni), and a second plating layer disposed on the first plating layer and including tin (Sn), and a ratio (t1/t2) is within a range from 1.0 to 9.0, where t1 is a thickness of the first plating layer including nickel (Ni), and t2 is a thickness of the second plating layer including tin (Sn).
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公开(公告)号：US20200090863A1
公开(公告)日：2020-03-19
申请号：US16200631
申请日：2018-11-26
发明人： Ho Yoon KIM , Sang Soo PARK , Woo Chul SHIN
摘要： An electronic component and a mounting board for mounting of the same are provided. The electronic component includes a body including external electrodes disposed on surfaces of the body opposing each other in a first direction, respectively, and metal frames connected to the external electrodes, respectively. The metal frames include supports bonded to the external electrodes and mounting portions extending from lower ends of the supports in the first direction and are spaced apart from the body and the external electrodes. The supports include a lower support portion disposed on a lower side of the body and an upper support portion disposed on an upper side of the body, and the lower support portion has a thickness in a second direction perpendicular to the first direction relatively greater than a thickness of the upper support portion in the first direction.
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公开(公告)号：US20200075261A1
公开(公告)日：2020-03-05
申请号：US16170645
申请日：2018-10-25
发明人： Beom Joon CHO , Woo Chul SHIN , Ki Young KIM , Sang Soo PARK
摘要： An electronic component includes a capacitor array including a plurality of multilayer capacitors; and first and second metal frames disposed on a side surface and another side surface of the capacitor array and electrically connected to first and second external electrodes, respectively, wherein the first metal frame includes a first support portion; a first mounting portion; and a first connection portion, the second metal frame includes a second support portion; a second mounting portion; and a second connection portion, and lengths of the first and second mounting portions in the first direction are smaller than a length of the capacitor array in the first direction.
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公开(公告)号：US20200075244A1
公开(公告)日：2020-03-05
申请号：US16170682
申请日：2018-10-25
发明人： Beom Joon CHO , Sang Soo PARK , Jae Young NA , Woo Chul SHIN
摘要： An electronic component includes a body; external electrodes respectively disposed on opposing surfaces of the body in a first direction thereof; and a pair of metal frames connected to the external electrodes, respectively, in which each of the metal frames includes a support portion bonded to the external electrodes, and a mounting portion extending in the first direction from a lower end of the support portion and spaced apart from the body and the external electrodes, and a length of the mounting portion in a second direction perpendicular to the first direction is greater than a length of the body in the second direction.
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