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公开(公告)号：US20220181086A1
公开(公告)日：2022-06-09
申请号：US17460887
申请日：2021-08-30
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Beom Joon CHO , Seung Min AHN , Mi Na HYUN
Abstract: An electronic component, which is mounted on a substrate having an electrode pad disposed on an upper surface thereof and bonded to a metal frame of the electronic component through a solder, includes a capacitor body, an external electrode respectively disposed on one end of the capacitor body, and a metal frame connected to the external electrode and mounted on the electrode pad of the substrate. The metal frame is divided into first and second portions including different metals having different electrical conductivity.
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公开(公告)号：US20190164695A1
公开(公告)日：2019-05-30
申请号：US15988817
申请日：2018-05-24
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Beom Joon CHO
Abstract: A multilayer electronic component includes: a first frame terminal including a first side frame, a first bottom frame and a first top frame; a second frame terminal including a second side frame, a second bottom frame and a second top frame; an electronic component including first and second external electrodes, and disposed between the first and second side frames; a first conductive adhesive disposed between the first external electrode and an upper portion of the first frame terminal; and a second conductive adhesive disposed between the second external electrode and an upper portion of the second frame terminal, wherein space portions are provided between the first and second external electrodes and lower portions of the first and second side frames and between the first and second external electrodes and the first and second bottom frames, respectively.
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公开(公告)号：US20200118752A1
公开(公告)日：2020-04-16
申请号：US16200389
申请日：2018-11-26
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Beom Joon CHO , Ki Young KIM , Jae Young NA
Abstract: An electronic component includes: a capacitor body; an external electrode disposed on an end of the capacitor body in a first direction and containing copper (Cu) as a main component; a metal frame electrically connected to the external electrode; and a bonding member disposed between the external electrode and the metal frame. The bonding member includes a tin (Sn)-based solder layer; a tin-copper based alloy solder layer disposed between the tin-based solder layer and the external electrode; and a tin-based alloy solder layer disposed between the tin-based solder layer and the metal frame.
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公开(公告)号：US20200058448A1
公开(公告)日：2020-02-20
申请号：US16190919
申请日：2018-11-14
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Beom Joon CHO
Abstract: An electronic component includes: a capacitor array including a plurality of multilayer capacitors consecutively disposed in a horizontal direction, first and second metal frames disposed on both side surfaces of the capacitor array and connected to first and second external electrodes, respectively. The first and second metal frames respectively include first and second horizontal bonding portions bonded to upper portions of first and second band portions, first and second horizontal mounting portions disposed to oppose the first and second horizontal bonding portions in a vertical direction, and first and second vertical portions connecting the first and second horizontal bonding portions and the first and second horizontal mounting portions and having at least one first and second cutout portions in a horizontal direction, respectively. The first and second horizontal mounting portions are spaced apart from the plurality of multilayer capacitors.
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公开(公告)号：US20190122823A1
公开(公告)日：2019-04-25
申请号：US15995637
申请日：2018-06-01
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Beom Joon CHO , Ki Young KIM , Jae Young NA , Jin Mo AHN
CPC classification number: H01G4/30 , H01G2/06 , H01G4/005 , H01G4/1227 , H01G4/232 , H01G4/38 , H05K1/181 , H05K3/3426 , H05K3/3442 , H05K2201/10015 , H05K2201/10515 , H05K2201/1053 , H05K2201/10946
Abstract: A multilayer electronic component includes first and second frame terminals, and first and second electronic components. The first frame terminal includes a first side frame and a first bottom frame extended from a lower end of the first side frame. The second frame terminal includes a second side frame facing the first side frame and a second bottom frame extended from a lower end of the second side frame. The first electronic component is disposed between the first and second side frames, and the second electronic component is stacked on the first electronic component and disposed between the first and second side frames. Conductive adhesives are provided between the first and second side frames and the first and second electronic components, but a conductive adhesive is not formed between the first and second side frames and portions of the first electronic component close to a mounting surface.
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Patent Agency Ranking
公开(公告)号：US20150028912A1
公开(公告)日：2015-01-29
申请号：US14322660
申请日：2014-07-02
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Beom Joon CHO , Jung Goo CHOI , Ji Sung NA , Yun Hwi PARK , Kwang Jae OH , Ho Sung CHOO , Ji Hwan SHIN
CPC classification number: H05K13/00 , G01R1/07378 , H05K1/185 , H05K3/4629 , H05K2201/10015 , H05K2201/10636 , H05K2203/063 , Y02P70/611 , Y10T29/49126
Abstract: A board for a probe card includes a ceramic board including a first insulating layer, and second insulating layers disposed on one surface of the first insulating layer and including cavities for receiving electronic components, conductive patterns disposed on the first and second insulating layers, conductive vias electrically connecting the conductive patterns, and a capacitor disposed in the cavities. The cavities have a depth greater than a thickness of the capacitor to secure a space in a lower portion of the cavity after receiving the capacitor.
Abstract translation: 用于探针卡的板包括陶瓷板，其包括第一绝缘层和设置在第一绝缘层的一个表面上的第二绝缘层，并且包括用于接收电子部件的空腔，设置在第一和第二绝缘层上的导电图案，导电通孔 电连接导电图案和设置在空腔中的电容器。 空腔具有大于电容器的厚度的深度，以在接收电容器之后固定空腔的下部的空间。
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公开(公告)号：US20220139626A1
公开(公告)日：2022-05-05
申请号：US17337924
申请日：2021-06-03
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Beom Joon CHO
Abstract: A multilayer capacitor includes a capacitor body including a dielectric layer and a plurality of internal electrodes, and a pair of external electrodes disposed on opposing ends of the capacitor body and connected to exposed portions of the internal electrodes, wherein the external electrodes respectively include a conductive layer including a connection portion formed on one end surface of the capacitor body and connected to the internal electrode and a band portion extending from the connection portion to a portion of a neighboring surface of the capacitor body, a conductive resin layer covering a corner of the connection portion of the conductive layer and having a cutout portion so that a portion of an edge of the connection portion is exposed, and a plating layer covering the conductive layer and the conductive resin layer and contacting a portion of the conductive layer due to the cutout portion.
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公开(公告)号：US20220076884A1
公开(公告)日：2022-03-10
申请号：US17186390
申请日：2021-02-26
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Min Kyeong SIM , Beom Joon CHO
Abstract: An electronic component and a board having the same mounted thereon are provided. The electronic component includes a capacitor body, a pair of external electrodes, respectively disposed on end portions of the capacitor body, a pair of metal frames, respectively disposed to be connected the pair of external electrodes, and a conductive bonding layer disposed between the external electrode and the metal frame and having a discontinuous region.
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公开(公告)号：US20210082627A1
公开(公告)日：2021-03-18
申请号：US16914942
申请日：2020-06-29
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ki Young KIM , Jae Young NA , Beom Joon CHO , Ji Hong JO , Woo Chul SHIN
Abstract: An electronic component is provided, and the electronic component includes: a capacitor array in which a plurality of multilayer capacitors are stacked, the plurality of multilayer capacitors including a body, and first and second external electrodes; first and second metal frames including first and second support portions bonded to the first and second external electrodes of the capacitor array, first and second mounting portions located below the first and second external electrodes and having first and second protrusions protruding downwardly, and first and second connection portions connecting the first and second support portions to the first and second mounting portions, respectively; and a capsule portion encapsulating the capacitor array to expose the first mounting portion of the first metal frame and the second mounting portion of the second metal frame, and having a lower surface provided with a plurality of protruding portions are formed at predetermined intervals.
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公开(公告)号：US20200118763A1
公开(公告)日：2020-04-16
申请号：US16201607
申请日：2018-11-27
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ki Young KIM , Beom Joon CHO , Sang Soo PARK , Woo Chul SHIN
Abstract: A multilayer ceramic electronic component array includes: a plurality of multilayer ceramic electronic components; a first terminal structure electrically connected to first external electrodes of each of the plurality of multilayer ceramic electronic components; a second terminal structure electrically connected to second external electrodes of each of the plurality of multilayer ceramic electronic components; a first conductive bonding member bonding the first external electrodes of each of the plurality of multilayer ceramic electronic components and the first terminal structure; a second conductive bonding member bonding the second external electrodes of each of the plurality of multilayer ceramic electronic components and the second terminal structure; and a ceramic bonding member contacting first surfaces of each of the ceramic bodies of each of the plurality of multilayer ceramic electronic components and disposed to extend to second surfaces of each of the ceramic bodies.
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