公开(公告)号：US08416248B2

公开(公告)日：2013-04-09

申请号：US12495695

申请日：2009-06-30

Applicant: I-Hung Weng ,  Chih-Wei Cheng

Inventor： I-Hung Weng ,  Chih-Wei Cheng

IPC: G06F13/14 ,  G06F9/44 ,  G06F13/12 ,  G06F17/00 ,  G06F15/177

CPC classification number: G06F8/65

Abstract: Methods and device for in-system firmware update in an information output device are provided. In one aspect, a method of firmware update in a display device receives a set of data in an image format through a video signal input channel of an input port of the display device. The set of data is converted from the image format to an instruction set format that is different from the image format. A first set of instructions that is used to operate the display device is updated with the set of data in the instruction set format.

Abstract translation: 提供了在信息输出设备中进行系统内固件升级的方法和设备。 一方面，显示装置中的固件更新方法通过显示装置的输入端口的视频信号输入通道接收图像格式的一组数据。 该数据集从图像格式转换为与图像格式不同的指令集格式。 用于操作显示设备的第一组指令用指令集格式的数据集来更新。

公开(公告)号：US20130083501A1

公开(公告)日：2013-04-04

申请号：US13630872

申请日：2012-09-28

Applicant: STMicroelectronics Ltd (Malta)

Inventor： Mark A. Azzopardi ,  Kevin Formosa ,  Ivan Ellul

IPC: B32B1/02 ,  B32B15/01 ,  H05K5/03 ,  B23K1/20

CPC classification number: H01L23/10 ,  B81C1/00269 ,  B81C2203/019 ,  H01L2924/0002 ,  H01L2924/16152 ,  Y10T428/1241 ,  Y10T428/13 ,  H01L2924/00

Abstract: One embodiment discloses a method for soldering a cap for an integrated electronic device to a support layer, including the steps of: providing a support layer; providing a cap including a core of a first material and a coating layer of a second material, the first and second material being respectively wettable and non-wettable with respect to a solder, the coating layer being arranged so as to expose a surface of the core; coupling the cap with the support layer; and soldering the surface of the core to the support layer, by means of the solder.

Abstract translation: 一个实施例公开了一种用于将集成电子设备的盖焊接到支撑层的方法，包括以下步骤：提供支撑层; 提供包括第一材料的芯和第二材料的涂层的盖，所述第一和第二材料分别相对于焊料可润湿和不可湿润，所述涂层被布置为暴露所述第一材料的表面 核心; 将盖与支撑层联接; 并通过焊料将芯的表面焊接到支撑层。

公开(公告)号：US20130082258A1

公开(公告)日：2013-04-04

申请号：US13629157

申请日：2012-09-27

Applicant: STMicroelectronics S.r.l. ,  STMicroelectronics Ltd (Malta)

Inventor： Mark Anthony Azzopardi ,  Conrad Cachia ,  Stefano Pozzi

IPC: H01L21/50 ,  H01L23/58

CPC classification number: B81C99/004 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method for testing a strip of MEMS devices, the MEMS devices including at least a respective die of semiconductor material coupled to an internal surface of a common substrate and covered by a protection material; the method envisages: detecting electrical values generated by the MEMS devices in response to at least a testing stimulus; and, before the step of detecting, at least partially separating contiguous MEMS devices in the strip. The step of separating includes defining a separation trench between the contiguous MEMS devices, the separation trench extending through the whole thickness of the protection material and through a surface portion of the substrate, starting from the internal surface of the substrate.

Abstract translation: 一种用于测试MEMS器件条的方法，所述MEMS器件至少包括耦合到公共衬底的内表面并由保护材料覆盖的半导体材料的相应裸片; 该方法设想：响应于至少一个测试刺激来检测由MEMS器件产生的电值; 并且在所述检测步骤之前，至少部分地分离所述条带中的连续的MEMS器件。 分离步骤包括在连续的MEMS器件之间限定分离沟槽，分离沟槽从衬底的内表面开始延伸穿过保护材料的整个厚度并穿过衬底的表面部分。

公开(公告)号：US08049794B2

公开(公告)日：2011-11-01

申请号：US11279597

申请日：2006-04-13

Applicant: Jeff Raynor ,  Ed Duncan

Inventor： Jeff Raynor ,  Ed Duncan

IPC: H04N5/262 ,  G09G5/00

CPC classification number: G09G5/397 ,  G09G2340/125 ,  H04N5/275

Abstract: The method of processing a first digital image by combining the first digital image with a second digital image includes the first digital image being received from a pixel array, and when receiving the first digital image it is converted into a first continuous sequential data stream. The second digital image may be provided in the form of a second continuous sequential data stream, and the first and second digital images may be combined by continuously combining the data in the first and second data stream.

Abstract translation: 通过将第一数字图像与第二数字图像组合来处理第一数字图像的方法包括从像素阵列接收的第一数字图像，并且当接收到第一数字图像时，将其转换为第一连续顺序数据流。 第二数字图像可以以第二连续顺序数据流的形式提供，并且可以通过连续地组合第一和第二数据流中的数据来组合第一和第二数字图像。

公开(公告)号：US07801384B2

公开(公告)日：2010-09-21

申请号：US10841947

申请日：2004-05-07

Applicant: Keith Findlater ,  Angelo Bosco

Inventor： Keith Findlater ,  Angelo Bosco

IPC: G06K9/40

CPC classification number: H04N5/3658 ,  H04N5/365

Abstract: An image sensor array of active pixel elements is arranged in rows and columns. Each column has an output circuit for reading out pixel image signals. The output circuit includes a pair of sample capacitors, a switching circuit operable based upon pixel switches for applying pixel voltages to the pair of sample capacitors. At least one optically masked pixel is provided so that output image signals obtained therefrom represent substantially only the column fixed pattern noise (FPN). An image processing circuit records the column FPN for each column from the optically masked pixels, records the image signal from the sensor array of active pixels, and subtracts the column FPN column-wise from the image signal.

Abstract translation: 有源像素元件的图像传感器阵列以行和列布置。 每列具有用于读出像素图像信号的输出电路。 输出电路包括一对采样电容器，基于用于将像素电压施加到一对采样电容器的像素开关可操作的开关电路。 提供至少一个光学掩模像素，使得从其获得的输出图像信号基本上仅表示列固定图案噪声（FPN）。 图像处理电路记录来自光学掩蔽像素的每列的列FPN，记录来自有源像素的传感器阵列的图像信号，并从图像信号中逐列减去列FPN。

公开(公告)号：US07702156B2

公开(公告)日：2010-04-20

申请号：US11399684

申请日：2006-04-05

Applicant: Christopher Galea

Inventor： Christopher Galea

IPC: G06K9/46 ,  G06K9/34

CPC classification number: G06K9/4609 ,  G06T7/12

Abstract: A method for the extraction of shadows in noisy images includes capture of an image, subdivision of the image into a plurality of pixels, definition of a square odd matrix for every pixel having said pixel in the center, application of an algorithm to the matrixes of every pixel, and displaying of an error map of the image. The algorithm is a contour algorithm that includes the operations of =computation of the averages for each corner of the matrix, computation of the averages for the top, bottom, left and right sides, computation of the maximum variance between these eight averages, and comparison with a present value (max variance).

Abstract translation: 用于在噪声图像中提取阴影的方法包括图像的捕获，将图像细分为多个像素，对于具有中心具有所述像素的每个像素的平方奇数矩阵的定义，将算法应用于 每个像素，以及显示图像的错误图。 该算法是一种轮廓算法，包括运算矩阵的每个角的平均值的运算，上，下，左和右两边的平均值的计算，这八个平均值之间的最大方差的计算，以及比较 具有现值（最大方差）。

公开(公告)号：US07683882B2

公开(公告)日：2010-03-23

申请号：US11119155

申请日：2005-04-29

Applicant: Jeff Raynor

Inventor： Jeff Raynor

IPC: G09G5/08

CPC classification number: G06F3/03543

Abstract: A computer navigation device includes a movement sensor and a trigger device activated by a timer. The computer navigation device periodically transmits to a host computer a pre-defined signal corresponding with the signal that would otherwise be generated by the movement sensor on detection of specific movements of the computer navigation device.

Abstract translation: 计算机导航装置包括由定时器激活的运动传感器和触发装置。 计算机导航装置在检测到计算机导航装置的特定移动时，周期性地向主机计​​算机发送对应于否则将由移动传感器生成的信号的预定义信号。

公开(公告)号：US20090253384A1

公开(公告)日：2009-10-08

申请号：US12062728

申请日：2008-04-04

Applicant: Oleksandr Gorbachov

Inventor： Oleksandr Gorbachov

IPC: H04B1/44 ,  H04B1/06

CPC classification number: H04B1/44

Abstract: A dual mode radio frequency (RF) front end circuit includes a first transformer for conversion between a balanced and an unbalanced RF signal and a second transformer for conversion between a balanced and an unbalanced RF signal. A first switch is configured to selectively electrically connect to one of the first transformer, the second transformer and an RF transmit port. A second switch is configured to selectively electrically connect the first switch and a filter to one of the input and the output port of an amplifier. The first switch is connected to the input port of the amplifier when the filter is connected to the output port of the amplifier, and the first switch is connected to the output port of the amplifier when the filter is connected to the input Port of the amplifier. The first and the second switch cooperatively selectively connect one of the first transformer, the second transformer and the RF transmit port to the amplifier and the filter.

Abstract translation: 双模式射频（RF）前端电路包括用于在平衡和不平衡RF信号之间转换的第一变压器和用于平衡和不平衡RF信号之间转换的第二变压器。 第一开关被配置为选择性地电连接到第一变压器，第二变压器和RF发射端口中的一个。 第二开关被配置为选择性地将第一开关和滤波器电连接到放大器的输入和输出端口之一。 当滤波器连接到放大器的输出端口时，第一个开关连接到放大器的输入端口，当滤波器连接到放大器的输入端口时，第一个开关连接到放大器的输出端口 。 第一和第二开关协同选择性地将第一变压器，第二变压器和RF发射端口中的一个连接到放大器和滤波器。

公开(公告)号：US20090080403A1

公开(公告)日：2009-03-26

申请号：US12327471

申请日：2008-12-03

Applicant: Mounir Hamdi

Inventor： Mounir Hamdi

IPC: H04J3/00

CPC classification number: H04W28/22 ,  H04L41/12

Abstract: A WLAN communication system and algorithm that adaptively changes the data transmission rate of a communication channel based on changing channel conditions. The WLAN communication system or algorithm has two modes being a searching mode and a transmission mode. Furthermore, the WLAN communication system or algorithm incorporates an additive increase, multiplicative decrease (AIMD) function into the rate adaptation algorithm.

Abstract translation: 一种WLAN通信系统和算法，其基于改变的信道条件自适应地改变通信信道的数据传输速率。 WLAN通信系统或算法具有搜索模式和传输模式两种模式。 此外，WLAN通信系统或算法将加法增加乘法减少（AIMD）功能合并到速率自适应算法中。

公开(公告)号：US20080032489A1

公开(公告)日：2008-02-07

申请号：US11833605

申请日：2007-08-03

Applicant: Kevin Formosa

Inventor： Kevin Formosa

IPC: H01L21/683

CPC classification number: H01L21/6835 ,  H01L21/67132 ,  H01L21/67144 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68336

Abstract: A removable wafer expander for die bonding equipment for a singularized wafer supported by a flexible sticky substrate, the removable wafer expander provided with a first ring member to be coupled with a second ring member for remote expansion of the flexible sticky substrate therebetween before the mounting of the wafer expander onto the die bonding equipment.

Abstract translation: 一种用于由柔性粘性基板支撑的单一晶片的芯片接合设备的可移动的晶片扩展器，该可移除的晶片扩展器设置有第一环形构件以与第二环构件联接，用于在安装之前将柔性粘性基板远程扩展 晶片扩展器到芯片粘合设备上。