ACTIVE CONTROL OF ELECTRONIC PACKAGE WARPAGE
    82.
    发明申请

    公开(公告)号:US20200303322A1

    公开(公告)日:2020-09-24

    申请号:US16360402

    申请日:2019-03-21

    摘要: Systems and/or techniques associated with active control of electronic package warpage are provided. In one example, a system includes an electronic package and an integrated circuit. The electronic package includes a patterned structural material associated with a mechanical characteristic that changes in response to an applied condition. The integrated circuit controls the applied condition associated with the patterned structural material based on sensor data associated with a status of the electronic package.

    Display device with bending sensing patterns

    公开(公告)号:US10748970B2

    公开(公告)日:2020-08-18

    申请号:US16122222

    申请日:2018-09-05

    摘要: The present disclosure discloses is a display device including a flexible substrate having an active area, a bezel area enclosing the active area, and a bending area defined in at least a part of the active area and the bezel area; and a plurality of bending sensing patterns disposed in the bending area, in which the bending area includes a plurality of sub bending areas and the plurality of bending sensing patterns is disposed in different areas of the plurality of sub bending areas, so that the bending degree of each sub bending area included in the bending area can be independently sensed.

    METHOD AND APPARATUS FOR ON-CHIP STRESS DETECTION

    公开(公告)号:US20200211914A1

    公开(公告)日:2020-07-02

    申请号:US16294469

    申请日:2019-03-06

    IPC分类号: H01L21/66 G01B7/16

    摘要: A microelectronic chip device includes a semiconductor substrate and multiple on-chip strain sensors (OCSS s) constructed on the substrate at various locations of the substrate. The OCSSs may each include multiple piezoresistive devices configured to sense a strain at a location of the various locations and produce a strain signal representing the strain at that location. A strain measurement circuit may also be constructed on the semiconductor substrate and configured to measure strain parameters from the strain signals produced by the OCSSs. The strain parameters represent the strains at the various location. Values of the strain parameters can be used for analysis of mechanical stress on the chip device.

    Strain sensing device and manufacturing method thereof

    公开(公告)号:US10697753B2

    公开(公告)日:2020-06-30

    申请号:US15867745

    申请日:2018-01-11

    IPC分类号: G01B7/00 G01B7/16

    摘要: A strain sensing device and a manufacturing method thereof are provided in the invention. The strain sensing device includes a substrate and at least one sensing electrode. The substrate has a plurality of pores. A material of the substrate includes nanocellulose, and the substrates is strained in response to changes in external conditions. The at least one sensing electrode is disposed on the substrate, wherein the sensing electrode contacting the substrate extends into the pores of the substrate. The at least one sensing electrode has a major axis parallel to a surface of the substrate. A resistance value of the at least one sensing electrode changes in response to a strain of the substrate.

    WATERCRAFT SPEED SENSOR
    90.
    发明申请

    公开(公告)号:US20200088755A1

    公开(公告)日:2020-03-19

    申请号:US16548220

    申请日:2019-08-22

    IPC分类号: G01P5/02 G01B7/16 B63B49/00

    摘要: A sensor for measuring movement of an object relative to a fluid has a housing fixed to a surface of the object and a spring on the housing formed by a plurality of blades each having an outer end fixed to the housing and an inner end connecting to a hub, with the plurality of blades defining a plane. Respective strain gauges are carried on the blades. A rigid pin is mounted on the hub of the spring, extends in a direction generally perpendicular to the plane, and projects from the surface of the object and into the fluid.