公开(公告)号：US20220388105A1

公开(公告)日：2022-12-08

申请号：US17681848

申请日：2022-02-28

Applicant: Infineon Technologies AG

Inventor： Alfons DEHE ,  Reinhard GABL ,  Ulrich KRUMBEIN

IPC: B23Q3/18 ,  H04R7/18 ,  H04R17/00 ,  H04R19/00 ,  H04R31/00 ,  B81B3/00 ,  B81C1/00

Abstract: A structure for fixing a membrane to a carrier including a carrier; a suspended structure; and a holding structure with a rounded concave shape which is configured to fix the suspended structure to the carrier and where a tapered side of the holding structure physically connects to the suspended structure is disclosed. A method of forming the holding structure on a carrier to support a suspended structure is further disclosed. The method may include: forming a holding structure on a carrier; forming a suspended structure on the holding structure; shaping the holding structure such that it has a concave shape; and arranging the holding structure such that a tapered side of the holding structure physically connects to the suspended structure.

公开(公告)号：US20220386004A1

公开(公告)日：2022-12-01

申请号：US17740322

申请日：2022-05-09

Applicant: XMEMS TAIWAN CO., LTD.

Inventor： Hsien-Ken Liao ,  Chiung C. Lo

IPC: H04R1/04 ,  H04R17/00 ,  H01L41/09 ,  H04R31/00

Abstract: A sound producing package structure includes a first sub-package structure and a second sub-package structure. The first sub-package structure includes a first substrate having a first opening and a first chip including a first membrane, wherein a first cavity is formed between the first membrane and the first substrate. The first sub-package structure and the second sub-package structure are stacked, and the second sub-package structure includes a second substrate and a second chip. The second substrate is connected to the first substrate and has a second opening. The second chip includes a second membrane, wherein a second cavity is formed between the second membrane and the second substrate. A gap, connected to the first opening and the second opening, is formed between the first substrate and the second substrate, such that an ambient of the sound producing package structure, the first cavity and the second cavity are connected.

公开(公告)号：US11516596B2

公开(公告)日：2022-11-29

申请号：US17085423

申请日：2020-10-30

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

Inventor： Wei-Chu Lin ,  Yi-Chuan Teng ,  Jung-Kuo Tu

IPC: H04R19/00 ,  H04R19/04 ,  B81B3/00 ,  B81C1/00 ,  H04R17/02 ,  H04R31/00 ,  H04R7/18 ,  H04R7/06 ,  H04R19/02

Abstract: A MEMS device and a method for manufacturing a MEMS device are provided. The MEMS device includes an anchor, a diaphragm structure, and a sealing film. The diaphragm structure is disposed over the anchor and has an opening through the diaphragm structure. The sealing film covers at least a portion of the opening of the diaphragm structure.

公开(公告)号：US20220369043A1

公开(公告)日：2022-11-17

申请号：US17879454

申请日：2022-08-02

Applicant: Vesper Technologies Inc.

Inventor： Craig Core ,  Hamid Basaeri ,  Robert Littrell

IPC: H04R19/04 ,  B81B3/00 ,  B81C1/00 ,  H04R19/00 ,  H04R31/00 ,  H04R1/04 ,  H04R7/06

Abstract: A robust MEMS transducer includes a kinetic energy diverter disposed within its frontside cavity. The kinetic energy diverter blunts or diverts kinetic energy in a mass of air moving through the frontside cavity, before that kinetic energy reaches a diaphragm of the MEMS transducer. The kinetic energy diverter renders the MEMS transducer more robust and resistant to damage from such a moving mass of air.

公开(公告)号：US20220353609A1

公开(公告)日：2022-11-03

申请号：US17865072

申请日：2022-07-14

Applicant: ClearOne, Inc.

Inventor： Derek Graham ,  David K. Lambert ,  Michael Braithwaite

IPC: H04R1/40 ,  H04R1/08 ,  G10L21/0232 ,  H04R29/00 ,  H04R3/00 ,  H04R17/02 ,  H04R1/28 ,  H04R31/00 ,  H04R3/04

Abstract: A beamforming microphone array may be integrated into a wall or ceiling tile as a single unit. The beamforming microphone array includes a plurality of microphones that picks up audio input signals. In addition, the wall or ceiling tile may include an acoustically transparent outer surface on the front side of the tile, and the beamforming microphone array picks up the audio input signals through the outer surface of the tile. The beamforming microphone array may be coupled to the tile as a single unit and may be integrated into the back side of the tile.

公开(公告)号：US20220345830A1

公开(公告)日：2022-10-27

申请号：US17719485

申请日：2022-04-13

Applicant: University of South Carolina

Inventor： Sourav Banerjee ,  Mohammad Sadegh Saadatzi

IPC: H04R25/02 ,  H04R25/00 ,  H04R31/00

Abstract: Described herein are bio-inspired acoustic bandpass sensors with a user-defined range of frequencies mimicking the geometric structure of a human's basilar membrane to capture infrasonic, sonic or ultrasonic waves per design with a target frequency range for a specific application and methods of making same.

公开(公告)号：US20220345803A1

公开(公告)日：2022-10-27

申请号：US17842408

申请日：2022-06-16

Applicant: Cochlear Limited

Inventor： Nathan Isaacson ,  Adam Mujaj

IPC: H04R1/08 ,  H04R1/04 ,  H04R3/00 ,  H04R19/04 ,  H04R31/00

Abstract: Presented herein are contaminant-proof microphone assemblies for use with devices/apparatuses, such as auditory prostheses, that include one or more microphones disposed within a housing. A contaminant-proof microphone assembly in accordance with certain embodiments presented herein includes a microphone, a microphone plug, and a contaminant-proof membrane. The microphone plug has a first end coupled to the microphone and a second end that is configured to be positioned adjacent the contaminant-proof membrane. As such, the microphone plug is disposed between a sound inlet of the microphone and the contaminant-proof membrane. The microphone plug may be configured to mate with the housing or a gasket attached to the housing.

公开(公告)号：US11463804B2

公开(公告)日：2022-10-04

申请号：US16592357

申请日：2019-10-03

Applicant: The University of Rochester

Inventor： Michael Charles Heilemann ,  Mark Frederick Bocko ,  David Allan Anderson

IPC: H04R1/28 ,  B32B7/12 ,  B32B37/12 ,  B32B37/18 ,  H04R17/00 ,  H04R31/00 ,  H04R7/04

Abstract: A loudspeaker system with viscoelastic material affixed between two flexible panels is disclosed. The loudspeaker system dissipates the energy of motion, resulting in less pronounced resonant peaks. The effect may be especially evident at high frequencies, where energy is dissipated over many cycles in a shorter period of time. Also disclosed are the method of making the loudspeaker system and a method of using the loudspeaker system.

公开(公告)号：US20220286784A1

公开(公告)日：2022-09-08

申请号：US17631539

申请日：2019-12-24

Applicant: Goertek Inc.

Inventor： Xiaodong Guo

IPC: H04R9/06 ,  H04R7/16 ,  H04R7/12 ,  H04R9/04 ,  H04R31/00

Abstract: Disclosed is a sound production device including a housing and a vibration assembly, the vibration assembly comprising a vibration diaphragm and a voice coil combined to one side of the vibration diaphragm; wherein the sound production device further comprises a system stabilization component connected with the voice coil; the system stabilization component is of a line-like structure formed by winding a metal wire, and comprises a first connection part connected to the voice coil, a deformation part, and a second connection part connected to the housing. By adopting the sound production device of this structure, the voice coil will not be polarized under the condition of large displacement, and the system stabilization component having a novel structure does not hinder the free vibration of the voice coil either.

公开(公告)号：US20220272460A1

公开(公告)日：2022-08-25

申请号：US17184338

申请日：2021-02-24

Applicant: Shure Acquisition Holdings, Inc.

Inventor： Benjamin Jay Grigg ,  Donald D. Noettl

IPC: H04R19/01 ,  H04R19/04 ,  H04R7/04 ,  H04R1/04 ,  H04R31/00

Abstract: A microphone assembly comprising a housing, a single flexible diaphragm, and a rigid backplate. The backplate may be coated with a parylene configured to help reduce the flatness deviation of the backplate across the diameter of the backplate. A plurality of openings may extend from the top portion of the backplate to the bottom portion of the backplate.