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公开(公告)号：US20210268606A1
公开(公告)日：2021-09-02
申请号：US16972484
申请日：2019-05-22
发明人： Sung Hwan KIM
IPC分类号： B23K26/352 , B23K26/06 , B23K26/042 , B23K26/60 , B23K26/0622
摘要： Proposed is a method of processing a superfine blade edge using a femtosecond laser, the method including primarily grinding a blade edge portion by using a grinding wheel, the blade edge being primarily ground in a direction vertical to a rotational direction of the grinding wheel; and secondarily grinding at least a part of the blade edge portion by emitting a femtosecond laser to the ground blade edge portion in a lengthwise direction, wherein the secondarily grinding includes: oscillating the femtosecond laser; modifying the energy distribution of the femtosecond laser; aligning a central portion of the energy distribution of the femtosecond laser to an end portion of the blade edge portion; changing an advancing direction of the femtosecond laser; and emitting the femtosecond laser to the blade edge portion while moving, in the lengthwise direction of the blade, a stage on which the blade is placed.
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公开(公告)号：US12109650B2
公开(公告)日：2024-10-08
申请号：US17403989
申请日：2021-08-17
发明人： Sung Hwan Kim , Hyoung Shik Kang , Dong Bin You
摘要： Proposed is a planing-polishing apparatus 1 using a femtosecond pulsed laser and performing polishing of a planar workpiece to reduce surface roughness of the workpiece after performing planing of the workpiece using a femtosecond pulsed laser beam.
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公开(公告)号：US10964489B2
公开(公告)日：2021-03-30
申请号：US16099129
申请日：2017-11-21
发明人： Sung Hwan Kim
摘要： An upper mold for MLCC lamination comprising: a vacuum head comprising a first area formed by a plurality of base holes, which communicate with an air channel formed on the upper surface, and by through-holes that connect the lower surface and respective base holes so as to communicate with each other such that air flows between the base holes and the lower surface, the first area having a predetermined area, and the vacuum head comprising a second area configured, thereby suctioning air; a mesh plate fixed to the lower surface of the vacuum head to have a size corresponding to that of the first area, the mesh plate having a porous structure such that, when air flows through the through-holes of the first area, suction and discharge can occur evenly; and a contact plate fixed to the lower surface of the vacuum head by adhesion of the second area.
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公开(公告)号：US20230059293A1
公开(公告)日：2023-02-23
申请号：US17830311
申请日：2022-06-01
发明人： Sung Hwan KIM , Hyoung Shik KANG , Dong Sub PARK
IPC分类号： B23K26/384 , B23K26/382 , B23K26/0622 , B23K26/082
摘要： Proposed is a method of processing micro-holes formed in an upper mold used for adsorbing, transferring, and laminating a thin structure. The micro-holes drilled by setting n mono-layers in a thickness direction of the upper mold, applying the femtosecond pulsed laser beam onto a second mono-layer in a given pattern, processing the micro-holes at a thickness of the next mono-layer in a 2D manner, and sequentially applying the femtosecond pulsed laser beam to the mono-layers while lowering a focus of the laser in units of 1 /n. The femtosecond pulsed laser beam is applied along inner surfaces of the micro-holes, thereby adjusting a dimension of a diameter of each of the micro-holes to be processed, and improving surface roughness of each of the inner surfaces of the micro-holes. Surroundings of an inlet-side edge are chamfered or rounded to prevent generation of the burrs and damage to the thin film sheet.
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公开(公告)号：US20220241899A1
公开(公告)日：2022-08-04
申请号：US17403989
申请日：2021-08-17
发明人： Sung Hwan KIM , Hyoung Shik KANG , Dong Bin YOU
摘要： Proposed is a planing-polishing apparatus 1 using a femtosecond pulsed laser and performing polishing of a planar workpiece to reduce surface roughness of the workpiece after performing planing of the workpiece using a femtosecond pulsed laser beam.
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