公开(公告)号：US20070193607A1

公开(公告)日：2007-08-23

申请号：US11739201

申请日：2007-04-24

申请人： John Ghekiere ,  Aaron Arvidson ,  Bruce Fender ,  Craig Meuchel ,  Raoul Schroder ,  Brian Aegerter ,  Ron Flink ,  Jason Rye

发明人： John Ghekiere ,  Aaron Arvidson ,  Bruce Fender ,  Craig Meuchel ,  Raoul Schroder ,  Brian Aegerter ,  Ron Flink ,  Jason Rye

IPC分类号： C23G1/00 ,  B08B3/00 ,  B08B7/00

CPC分类号： H01L21/67051 ,  C23G5/00 ,  H01L21/02052

摘要： In methods and apparatus for cleaning a wafer, a cleaning liquid is sprayed or jetted in a direction generally tangent to the circular edge of a spinning wafer. This enhances removal of contaminants from areas near the edge. Re-deposition of contaminant pieces or particles back onto the wafer is reduced because the direction of the spray carries the contaminant off of the wafer. Insoluble contaminant films, such as post etch residue, may be removed via one or more of the pressure of the cleaning liquid, the effects of higher process temperatures from heating the cleaning liquid, and by the chemical composition of the cleaning liquid.

摘要翻译： 在清洗晶片的方法和装置中，清洗液体在与旋转晶片的圆形边缘大致相切的方向上喷射或喷射。 这增强了从边缘附近的区域去除污染物。 由于喷射方向将污染物从晶片上脱落，所以将污染物片或颗粒重新沉积回到晶片上被减少。 可以通过清洗液体的一个或多个压力，加热清洗液体中较高工艺温度的影响以及清洗液体的化学成分来除去不溶性污染物膜，例如后蚀刻残留物。